JPS5538014A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5538014A
JPS5538014A JP11044878A JP11044878A JPS5538014A JP S5538014 A JPS5538014 A JP S5538014A JP 11044878 A JP11044878 A JP 11044878A JP 11044878 A JP11044878 A JP 11044878A JP S5538014 A JPS5538014 A JP S5538014A
Authority
JP
Japan
Prior art keywords
wire
resin
electrode
wedge
coating step
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11044878A
Other languages
Japanese (ja)
Inventor
Mitsuharu Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP11044878A priority Critical patent/JPS5538014A/en
Publication of JPS5538014A publication Critical patent/JPS5538014A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7815—Means for applying permanent coating, e.g. in-situ coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To simplify resin-filling process and also to reduce volume of resin in use by covering surrounding of a wire, including an electrode section, with high- purity liquid resin while a wire is being connected to the electrode.
CONSTITUTION: At first, a wedge 1 is lowered on a semiconductor part 5 piled on a supporting table 4, and while keeping a resin-coating step 3 separated from a wire 2, the wire 2 is pressingly attached securaly to No.1 electrode 51. At the time when the wedge 1 is raised, a resin flow guide 33 of the resin coating step 3 is lowered to such an extent that its top end contacts the wire 2, and while the wedge 1 is shifting, liquid resin 31, equivalent in volume to air poured into a container 32 through a pipe 34, is made to flow onto stick-out sections of the electrode 51 and the wire 2. The wedge 1 is again lowered above an electrode 52 and the resin coating step 3 is raised, and while keeping the guide 33 separated from the wire 2, the wire 2 is fixed onto the electrode 52. After the wire 2 is cut off, the electrode 52 is also covered with resin by shifting of liquid resin 31.
COPYRIGHT: (C)1980,JPO&Japio
JP11044878A 1978-09-08 1978-09-08 Wire bonding device Pending JPS5538014A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11044878A JPS5538014A (en) 1978-09-08 1978-09-08 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11044878A JPS5538014A (en) 1978-09-08 1978-09-08 Wire bonding device

Publications (1)

Publication Number Publication Date
JPS5538014A true JPS5538014A (en) 1980-03-17

Family

ID=14535966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11044878A Pending JPS5538014A (en) 1978-09-08 1978-09-08 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS5538014A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268979A (en) * 1985-03-25 1986-11-28 ル−トウイツヒ・リ−トハムメル・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング Method and device for ensuring separation of gas current having different atmosphere
JPS63238221A (en) * 1987-03-26 1988-10-04 Furukawa Electric Co Ltd:The Continuous bright annealing furnace
JPH0196333A (en) * 1987-10-08 1989-04-14 Nkk Corp Continuous annealing furnace provided with gas circulating device
JPH03135042A (en) * 1989-10-20 1991-06-10 Nippon Steel Corp Bonding of bonding wire and coating apparatus used therefor
US20140311836A1 (en) * 2011-11-11 2014-10-23 Wabco Radbremsen Gmbh Disk brake, and pressure plate and brake pad for such a disk brake

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279657A (en) * 1975-12-25 1977-07-04 Mitsubishi Electric Corp Wire bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279657A (en) * 1975-12-25 1977-07-04 Mitsubishi Electric Corp Wire bonding device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61268979A (en) * 1985-03-25 1986-11-28 ル−トウイツヒ・リ−トハムメル・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング Method and device for ensuring separation of gas current having different atmosphere
JPS63238221A (en) * 1987-03-26 1988-10-04 Furukawa Electric Co Ltd:The Continuous bright annealing furnace
JPH052727B2 (en) * 1987-03-26 1993-01-13 Furukawa Denki Kogyo Kk
JPH0196333A (en) * 1987-10-08 1989-04-14 Nkk Corp Continuous annealing furnace provided with gas circulating device
JPH03135042A (en) * 1989-10-20 1991-06-10 Nippon Steel Corp Bonding of bonding wire and coating apparatus used therefor
US20140311836A1 (en) * 2011-11-11 2014-10-23 Wabco Radbremsen Gmbh Disk brake, and pressure plate and brake pad for such a disk brake
US9291226B2 (en) * 2011-11-11 2016-03-22 Wabco Radbremsen Gmbh Disk brake, and pressure plate and brake pad for such a disk brake

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