JPS5511322A - Semiconductor light-emitting display device - Google Patents

Semiconductor light-emitting display device

Info

Publication number
JPS5511322A
JPS5511322A JP8321178A JP8321178A JPS5511322A JP S5511322 A JPS5511322 A JP S5511322A JP 8321178 A JP8321178 A JP 8321178A JP 8321178 A JP8321178 A JP 8321178A JP S5511322 A JPS5511322 A JP S5511322A
Authority
JP
Japan
Prior art keywords
light
emitting element
element pellet
display device
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8321178A
Other languages
Japanese (ja)
Inventor
Seiichi Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8321178A priority Critical patent/JPS5511322A/en
Publication of JPS5511322A publication Critical patent/JPS5511322A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE: To reduce the number of components and also reduce the number of processes by fixing a light-emitting element pellet directly by means of conducting resin without using fine metal wire.
CONSTITUTION: Insulator 13 is placed between a pair of metal foils 11 and 12. Semicircular cylindrical cut 14 is provided at the center of the end part of insulator 13. The inner surface of cut 14 is provided with reflecting effect. Light-emitting element pellet 15 is fitted into a depression which is surrounded by cut 14 and a pair of metal foils 11 and 12. Fixing of light-emitting element pellet 15 is operated directly by means of conducting resin, and light-emitting element pellet 15 is supported by a pair of metal foils 11 and 12. By this, light-emittng element pellet 15 is fixed directly by means of resin. Thus, the number of components and the number of processes for assembling a semiconductor light-emitting display device are reduced.
COPYRIGHT: (C)1980,JPO&Japio
JP8321178A 1978-07-08 1978-07-08 Semiconductor light-emitting display device Pending JPS5511322A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8321178A JPS5511322A (en) 1978-07-08 1978-07-08 Semiconductor light-emitting display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8321178A JPS5511322A (en) 1978-07-08 1978-07-08 Semiconductor light-emitting display device

Publications (1)

Publication Number Publication Date
JPS5511322A true JPS5511322A (en) 1980-01-26

Family

ID=13795980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8321178A Pending JPS5511322A (en) 1978-07-08 1978-07-08 Semiconductor light-emitting display device

Country Status (1)

Country Link
JP (1) JPS5511322A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003095094A (en) * 2002-09-11 2003-04-03 Hitachi Ltd Rail rolling stock

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003095094A (en) * 2002-09-11 2003-04-03 Hitachi Ltd Rail rolling stock

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