JPS5377174A - Production of electronic device - Google Patents

Production of electronic device

Info

Publication number
JPS5377174A
JPS5377174A JP15449477A JP15449477A JPS5377174A JP S5377174 A JPS5377174 A JP S5377174A JP 15449477 A JP15449477 A JP 15449477A JP 15449477 A JP15449477 A JP 15449477A JP S5377174 A JPS5377174 A JP S5377174A
Authority
JP
Japan
Prior art keywords
electronic device
production
lead
assemble
power electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15449477A
Other languages
Japanese (ja)
Other versions
JPS5810860B2 (en
Inventor
Jinichiro Suzuki
Kenji Takezawa
Takanori Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52154494A priority Critical patent/JPS5810860B2/en
Publication of JPS5377174A publication Critical patent/JPS5377174A/en
Publication of JPS5810860B2 publication Critical patent/JPS5810860B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To assemble a power electronic device by providing spacer between the flange mounted with an element and lead ends and making connections to the lead end.
COPYRIGHT: (C)1978,JPO&Japio
JP52154494A 1977-12-23 1977-12-23 Electronic device manufacturing method Expired JPS5810860B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52154494A JPS5810860B2 (en) 1977-12-23 1977-12-23 Electronic device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52154494A JPS5810860B2 (en) 1977-12-23 1977-12-23 Electronic device manufacturing method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP158071A Division JPS5341503B1 (en) 1970-12-23 1971-01-22

Publications (2)

Publication Number Publication Date
JPS5377174A true JPS5377174A (en) 1978-07-08
JPS5810860B2 JPS5810860B2 (en) 1983-02-28

Family

ID=15585463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52154494A Expired JPS5810860B2 (en) 1977-12-23 1977-12-23 Electronic device manufacturing method

Country Status (1)

Country Link
JP (1) JPS5810860B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5341503A (en) * 1976-09-29 1978-04-15 Babcock Hitachi Kk Process for removing sulphur dioxide from recovery boiler

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5341503A (en) * 1976-09-29 1978-04-15 Babcock Hitachi Kk Process for removing sulphur dioxide from recovery boiler

Also Published As

Publication number Publication date
JPS5810860B2 (en) 1983-02-28

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