KR880010644A - 접착제 도포장치 - Google Patents

접착제 도포장치 Download PDF

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Publication number
KR880010644A
KR880010644A KR1019880000953A KR880000953A KR880010644A KR 880010644 A KR880010644 A KR 880010644A KR 1019880000953 A KR1019880000953 A KR 1019880000953A KR 880000953 A KR880000953 A KR 880000953A KR 880010644 A KR880010644 A KR 880010644A
Authority
KR
South Korea
Prior art keywords
coating
time
timer
nozzle
adhesive applicator
Prior art date
Application number
KR1019880000953A
Other languages
English (en)
Other versions
KR910002998B1 (ko
Inventor
토시유끼 쿠리하라
벤소 아오모또
코 니시오
Original Assignee
이우에 사또시
산요덴끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62027607A external-priority patent/JPS63194394A/ja
Application filed by 이우에 사또시, 산요덴끼 가부시끼가이샤 filed Critical 이우에 사또시
Publication of KR880010644A publication Critical patent/KR880010644A/ko
Application granted granted Critical
Publication of KR910002998B1 publication Critical patent/KR910002998B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

내용 없음

Description

접착제 도포장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 일 실시예를 표시하는 제어 블록도.
제 2 도는 접착제의 도포기구를 표시하는 사시도.
제 3 도는 상기 도포기구의 요부 평면도.

Claims (1)

  1. XY 이동 하는 XY 테이블(1)위에 프린트 기판(4)(5)가 재치하여, 상기 기판(4)(5)에 대응하여 복수의 도포노즐(6)(7)(8)(9)을 배설하고, 상기 프린트 기판(4)(5)위에 상기 임의의 도포노즐로 탱크(10)(11)(12)(13)안의 도포제를 도포할 수 있도록 하는 도포제의 도포장치를 형성하였으며, 상기 도포노즐(6)(7)(8)(9)에 대응하여 설치되어 각 노즐의 사용하지 않는 시간을 재는 타이머(58)와, 그 타이머(58)가 타임업시간을 경과한 시간을 잰 경우에, 상기 기판(4)(5)에의 도포동작을 실시하기 전에 막치기를 하도록 당해 노즐의 구 동원 및 XY 테이블(1)의 구동원을 제어하는 제어장치를 비치한 것을 특징으로 하는 접착제 도포장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880000953A 1987-02-09 1988-02-03 접착제 도포장치 KR910002998B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP87-27607 1987-02-09
JP62027607A JPS63194394A (ja) 1987-02-09 1987-02-09 接着剤塗布装置
JP?62-27607 1987-02-09
JP?62-215768 1987-08-28
JP87-215768 1987-08-28
JP21576887 1987-08-28

Publications (2)

Publication Number Publication Date
KR880010644A true KR880010644A (ko) 1988-10-10
KR910002998B1 KR910002998B1 (ko) 1991-05-11

Family

ID=26365552

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880000953A KR910002998B1 (ko) 1987-02-09 1988-02-03 접착제 도포장치

Country Status (3)

Country Link
US (1) US4919074A (ko)
EP (1) EP0278457A3 (ko)
KR (1) KR910002998B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100836632B1 (ko) * 2007-09-21 2008-06-10 천성관 엘엔지 선박의 단열 방벽 연결을 위한 접착제의 경화시기를알리는 타이머가 장착된 글루 보드

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3842166C2 (de) * 1988-12-15 1996-07-25 Karsten Sturm Rechnergesteuerte Dispensereinrichtung mit Füllstandskontrolle
US5232736A (en) * 1989-07-24 1993-08-03 Motorola, Inc. Method for controlling solder printer
US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
JP3801674B2 (ja) 1995-12-15 2006-07-26 松下電器産業株式会社 電子部品の実装方法
JPH1068759A (ja) * 1996-05-31 1998-03-10 Advantest Corp 吸着物検知装置、該装置を用いた吸着物検知方法、該装置を用いた位置ずれ検知方法、および該装置を用いた清掃方法
JP3587627B2 (ja) * 1996-09-05 2004-11-10 松下電器産業株式会社 接着剤塗布方法
US6132809A (en) * 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
US6066206A (en) 1997-02-21 2000-05-23 Speedline Technologies, Inc. Dual track stenciling system with solder gathering head
US6007631A (en) 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method
US6206964B1 (en) 1997-11-10 2001-03-27 Speedline Technologies, Inc. Multiple head dispensing system and method
US6214117B1 (en) 1998-03-02 2001-04-10 Speedline Technologies, Inc. Dispensing system and method
US6866881B2 (en) 1999-02-19 2005-03-15 Speedline Technologies, Inc. Dispensing system and method
IE20000566A1 (en) * 1999-07-13 2001-02-21 Mv Res Ltd A circuit production method
EP1180918B1 (en) * 2000-08-16 2010-01-27 Ericsson AB Method for dispensing adhesive on a circuit-board carrier member and circuit-board provided thereby
US6688458B2 (en) 2001-10-09 2004-02-10 Speedline Technologies, Inc. System and method for controlling a conveyor system configuration to accommodate different size substrates
JP2006013427A (ja) 2004-05-25 2006-01-12 Ricoh Co Ltd 微小接着剤ノズルおよび接着剤塗布装置
JP7122451B1 (ja) * 2021-07-08 2022-08-19 アーベーベー・シュバイツ・アーゲー 塗装ヘッドの塗装判定装置及び塗装システム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3364055A (en) * 1964-09-01 1968-01-16 Waldorf Paper Prod Co Method for applying hot melt adhesive to a carton blank
US4569305A (en) * 1981-10-09 1986-02-11 Ferco S.R.L. Apparatus to provide the application of glue on preselected zones of printed circuit boards
US4420510A (en) * 1982-03-23 1983-12-13 Weyerhaeuser Company Method for applying a foamed adhesive under start-stop conditions
CA1219843A (en) * 1982-11-15 1987-03-31 Robert A. Kidder Adhesive dispenser
US4584964A (en) * 1983-12-12 1986-04-29 Engel Harold J Viscous material dispensing machine having programmed positioning
JPS60219793A (ja) * 1984-04-17 1985-11-02 松下電器産業株式会社 厚膜回路描画方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100836632B1 (ko) * 2007-09-21 2008-06-10 천성관 엘엔지 선박의 단열 방벽 연결을 위한 접착제의 경화시기를알리는 타이머가 장착된 글루 보드

Also Published As

Publication number Publication date
US4919074A (en) 1990-04-24
EP0278457A2 (en) 1988-08-17
KR910002998B1 (ko) 1991-05-11
EP0278457A3 (en) 1989-06-14

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