KR910002030A - 후막형성방법 - Google Patents

후막형성방법 Download PDF

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Publication number
KR910002030A
KR910002030A KR1019890008561A KR890008561A KR910002030A KR 910002030 A KR910002030 A KR 910002030A KR 1019890008561 A KR1019890008561 A KR 1019890008561A KR 890008561 A KR890008561 A KR 890008561A KR 910002030 A KR910002030 A KR 910002030A
Authority
KR
South Korea
Prior art keywords
thick film
film formation
formation method
substrate
forming
Prior art date
Application number
KR1019890008561A
Other languages
English (en)
Other versions
KR920004038B1 (ko
Inventor
다께시 세끼구찌
노부오 시가
Original Assignee
나까하라 쯔네오
스미도모덴기고오교오 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나까하라 쯔네오, 스미도모덴기고오교오 가부시기가이샤 filed Critical 나까하라 쯔네오
Publication of KR910002030A publication Critical patent/KR910002030A/ko
Application granted granted Critical
Publication of KR920004038B1 publication Critical patent/KR920004038B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음

Description

후막형성방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명의 후막(厚膜) 형성과정을 도시한 공정도,
제 2도는 직접묘화법에서 사용되는 노즐선단부의 사시도,

Claims (1)

  1. 기판상에 스크리인 인쇄법을 사용해서 소망패턴의 후막을 형성하는 제1의 공정과, 상기 제1의 공정에서 후막이 형성된 기판상에 직접묘화법을 사용해서 소망패턴의 후막을 형성하는 제2의 공정으로 이루어진 후막형성방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890008561A 1988-06-22 1989-06-21 후막형성방법 KR920004038B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63153739A JPH01319990A (ja) 1988-06-22 1988-06-22 厚膜形成方法
JP88-153739 1988-06-22
JP263-153739 1988-06-22

Publications (2)

Publication Number Publication Date
KR910002030A true KR910002030A (ko) 1991-01-31
KR920004038B1 KR920004038B1 (ko) 1992-05-22

Family

ID=15569045

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890008561A KR920004038B1 (ko) 1988-06-22 1989-06-21 후막형성방법

Country Status (6)

Country Link
US (1) US5116642A (ko)
EP (1) EP0347824B1 (ko)
JP (1) JPH01319990A (ko)
KR (1) KR920004038B1 (ko)
CA (1) CA1335772C (ko)
DE (1) DE68920783T2 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01319990A (ja) * 1988-06-22 1989-12-26 Sumitomo Electric Ind Ltd 厚膜形成方法
JPH03283594A (ja) * 1990-03-30 1991-12-13 Toshiba Lighting & Technol Corp 回路基板
US5521576A (en) * 1993-10-06 1996-05-28 Collins; Franklyn M. Fine-line thick film resistors and resistor networks and method of making same
US5819652A (en) * 1994-12-14 1998-10-13 International Business Machines Corporation Reduced cavity depth screening stencil
US5588359A (en) * 1995-06-09 1996-12-31 Micron Display Technology, Inc. Method for forming a screen for screen printing a pattern of small closely spaced features onto a substrate
DE10042312A1 (de) * 2000-08-29 2002-03-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein
US20040238202A1 (en) * 2003-06-02 2004-12-02 Ohmcraft Inc. Method of making an inductor with written wire and an inductor made therefrom
DE102007063282A1 (de) * 2007-12-27 2009-07-02 Robert Bosch Gmbh Verfahren zur Herstellung eines elektrischen Leiters durch Auftragen zumindest einer Paste, insbesondere Dickschichtpaste
US9623951B2 (en) 2013-08-21 2017-04-18 Goodrich Corporation Heating elements for aircraft heated floor panels
BR102014025627A2 (pt) * 2013-10-15 2015-11-10 Goodrich Corp método para dar forma a um elemento aquecedor, e, painel de piso aquecido de aeronave
CN107660066B (zh) * 2017-10-31 2024-05-14 北京京东方显示技术有限公司 一种柔性电路板、其制作方法及显示装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798059A (en) * 1970-04-20 1974-03-19 Rca Corp Thick film inductor with ferromagnetic core
US4324815A (en) * 1978-01-24 1982-04-13 Mitani Electronics Industry Corp. Screen-printing mask and method
US4457861A (en) * 1979-12-13 1984-07-03 Additive Technology Corporation Method, materials and apparatus for manufacturing printed circuits
US4486738A (en) * 1982-02-16 1984-12-04 General Electric Ceramics, Inc. High reliability electrical components
EP0113979B1 (en) * 1982-12-16 1987-09-02 Matsushita Electric Industrial Co., Ltd. Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick strip
US4529477A (en) * 1983-05-02 1985-07-16 Kollmorgen Technologies Corporation Process for the manufacture of printed circuit boards
JPS59215763A (ja) * 1983-05-23 1984-12-05 Matsushita Electric Ind Co Ltd 厚膜印刷装置
JPS6043894A (ja) * 1983-08-19 1985-03-08 松下電器産業株式会社 厚膜回路の形成方法
JPS60219793A (ja) * 1984-04-17 1985-11-02 松下電器産業株式会社 厚膜回路描画方法
CA1260157A (en) * 1985-07-26 1989-09-26 Preleg, Inc. Electrical circuit fabrication apparatus and method
DE3532834A1 (de) * 1985-09-12 1987-03-19 Schering Ag Verfahren zur integration von widerstaenden in chemisch abgeschiedene leiternetzwerke
US4622239A (en) * 1986-02-18 1986-11-11 At&T Technologies, Inc. Method and apparatus for dispensing viscous materials
US4720402A (en) * 1987-01-30 1988-01-19 American Telephone And Telegraph Company Method for dispensing viscous material
US4808435A (en) * 1987-04-06 1989-02-28 International Business Machines Corporation Screen printing method for producing lines of uniform width and height
JPH01319990A (ja) * 1988-06-22 1989-12-26 Sumitomo Electric Ind Ltd 厚膜形成方法

Also Published As

Publication number Publication date
EP0347824B1 (en) 1995-01-25
JPH01319990A (ja) 1989-12-26
US5116642A (en) 1992-05-26
EP0347824A2 (en) 1989-12-27
DE68920783T2 (de) 1995-09-21
EP0347824A3 (en) 1991-03-20
KR920004038B1 (ko) 1992-05-22
CA1335772C (en) 1995-06-06
DE68920783D1 (de) 1995-03-09

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