AU560540B2 - Flood soldering device - Google Patents

Flood soldering device

Info

Publication number
AU560540B2
AU560540B2 AU19681/83A AU1968183A AU560540B2 AU 560540 B2 AU560540 B2 AU 560540B2 AU 19681/83 A AU19681/83 A AU 19681/83A AU 1968183 A AU1968183 A AU 1968183A AU 560540 B2 AU560540 B2 AU 560540B2
Authority
AU
Australia
Prior art keywords
pressure chamber
soldering
chamber
wave
return
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU19681/83A
Other versions
AU1968183A (en
Inventor
Haim Shtalryd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ERSA ERNST SACHS KG AND CO GmbH
Original Assignee
ERSA Ernst Sachs KG GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ERSA Ernst Sachs KG GmbH and Co filed Critical ERSA Ernst Sachs KG GmbH and Co
Publication of AU1968183A publication Critical patent/AU1968183A/en
Application granted granted Critical
Publication of AU560540B2 publication Critical patent/AU560540B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

1. Wave soldering device for soldering in and out particularly of electronic components on printed-circuit boards, consisting of a heated soldering-bath container (1) accommodating a liquid solder, a pressure chamber (3) provided with a cover wall (22) and a bottom (2), a return chamber (11), and a wave-generating nozzle (4) connectable to said return chamber (11) and being directed vertically upward and a pressure-generating device (5) for transporting the solder from the pressure chamber into the wave-generating nozzle, characterized by that as pressure-generating device (5) a pressurized-air cushion (7) is provided, said cushion being formed by a pressurized-air line (6) guided into the cover wall (22) of the pressure chamber (3) and being supplied from a pressurized-air source and being arranged underneath the cover wall (22) of the pressure chamber (3), that the wave-generating nozzle (4) is provided with a hollow shaft (8) protruding into the pressure chamber (3) and being guided closely up to the bottom (2) of the pressure chamber (3), that the pressure chamber (3) is inserted into the soldering-bath container (1) being open towards top, whereby the space between the pressure chamber (3) and the soldering-bath container (1) forms the return chamber (11) for the liquid solder emerging from the nozzle (4), and that the return chamber (11) is connected over a return line (12) to the hollow body (9) forming the pressure chamber (3), a check valve (13) being integrated in said line (12).
AU19681/83A 1982-09-30 1983-09-28 Flood soldering device Ceased AU560540B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3236493A DE3236493C1 (en) 1982-09-30 1982-09-30 Schwalloetgeraet
DE32364938 1982-09-30

Publications (2)

Publication Number Publication Date
AU1968183A AU1968183A (en) 1984-04-05
AU560540B2 true AU560540B2 (en) 1987-04-09

Family

ID=6174739

Family Applications (1)

Application Number Title Priority Date Filing Date
AU19681/83A Ceased AU560540B2 (en) 1982-09-30 1983-09-28 Flood soldering device

Country Status (8)

Country Link
EP (1) EP0105832B1 (en)
JP (1) JPS59147772A (en)
KR (1) KR840006434A (en)
AT (1) ATE16687T1 (en)
AU (1) AU560540B2 (en)
CA (1) CA1217684A (en)
DE (2) DE3236493C1 (en)
IL (1) IL69899A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224865A (en) * 1986-12-11 1988-09-19 ペイス　インコーポレイテッド Soldering and/or solder removing device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198414A (en) * 1963-07-30 1965-08-03 Electrovert Mfg Co Ltd Molten solder bath with uniformly dispersed additive

Also Published As

Publication number Publication date
IL69899A (en) 1985-12-31
CA1217684A (en) 1987-02-10
AU1968183A (en) 1984-04-05
KR840006434A (en) 1984-11-29
JPS6343196B2 (en) 1988-08-29
EP0105832A1 (en) 1984-04-18
DE3236493C1 (en) 1983-11-03
JPS59147772A (en) 1984-08-24
DE3361354D1 (en) 1986-01-09
EP0105832B1 (en) 1985-11-27
ATE16687T1 (en) 1985-12-15

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