IL69899A - Flood soldering device - Google Patents
Flood soldering deviceInfo
- Publication number
- IL69899A IL69899A IL69899A IL6989983A IL69899A IL 69899 A IL69899 A IL 69899A IL 69899 A IL69899 A IL 69899A IL 6989983 A IL6989983 A IL 6989983A IL 69899 A IL69899 A IL 69899A
- Authority
- IL
- Israel
- Prior art keywords
- pressure chamber
- soldering
- chamber
- wave
- return
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Coating With Molten Metal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
1. Wave soldering device for soldering in and out particularly of electronic components on printed-circuit boards, consisting of a heated soldering-bath container (1) accommodating a liquid solder, a pressure chamber (3) provided with a cover wall (22) and a bottom (2), a return chamber (11), and a wave-generating nozzle (4) connectable to said return chamber (11) and being directed vertically upward and a pressure-generating device (5) for transporting the solder from the pressure chamber into the wave-generating nozzle, characterized by that as pressure-generating device (5) a pressurized-air cushion (7) is provided, said cushion being formed by a pressurized-air line (6) guided into the cover wall (22) of the pressure chamber (3) and being supplied from a pressurized-air source and being arranged underneath the cover wall (22) of the pressure chamber (3), that the wave-generating nozzle (4) is provided with a hollow shaft (8) protruding into the pressure chamber (3) and being guided closely up to the bottom (2) of the pressure chamber (3), that the pressure chamber (3) is inserted into the soldering-bath container (1) being open towards top, whereby the space between the pressure chamber (3) and the soldering-bath container (1) forms the return chamber (11) for the liquid solder emerging from the nozzle (4), and that the return chamber (11) is connected over a return line (12) to the hollow body (9) forming the pressure chamber (3), a check valve (13) being integrated in said line (12).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3236493A DE3236493C1 (en) | 1982-09-30 | 1982-09-30 | Schwalloetgeraet |
Publications (1)
Publication Number | Publication Date |
---|---|
IL69899A true IL69899A (en) | 1985-12-31 |
Family
ID=6174739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL69899A IL69899A (en) | 1982-09-30 | 1983-10-04 | Flood soldering device |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0105832B1 (en) |
JP (1) | JPS59147772A (en) |
KR (1) | KR840006434A (en) |
AT (1) | ATE16687T1 (en) |
AU (1) | AU560540B2 (en) |
CA (1) | CA1217684A (en) |
DE (2) | DE3236493C1 (en) |
IL (1) | IL69899A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63224865A (en) * | 1986-12-11 | 1988-09-19 | ペイス インコーポレイテッド | Soldering and/or solder removing device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3198414A (en) * | 1963-07-30 | 1965-08-03 | Electrovert Mfg Co Ltd | Molten solder bath with uniformly dispersed additive |
-
1982
- 1982-09-30 DE DE3236493A patent/DE3236493C1/en not_active Expired
-
1983
- 1983-09-27 EP EP83730090A patent/EP0105832B1/en not_active Expired
- 1983-09-27 AT AT83730090T patent/ATE16687T1/en active
- 1983-09-27 DE DE8383730090T patent/DE3361354D1/en not_active Expired
- 1983-09-28 AU AU19681/83A patent/AU560540B2/en not_active Ceased
- 1983-09-30 CA CA000438075A patent/CA1217684A/en not_active Expired
- 1983-09-30 JP JP58180928A patent/JPS59147772A/en active Granted
- 1983-09-30 KR KR1019830004710A patent/KR840006434A/en not_active Application Discontinuation
- 1983-10-04 IL IL69899A patent/IL69899A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPS6343196B2 (en) | 1988-08-29 |
ATE16687T1 (en) | 1985-12-15 |
JPS59147772A (en) | 1984-08-24 |
EP0105832A1 (en) | 1984-04-18 |
KR840006434A (en) | 1984-11-29 |
AU1968183A (en) | 1984-04-05 |
DE3236493C1 (en) | 1983-11-03 |
EP0105832B1 (en) | 1985-11-27 |
CA1217684A (en) | 1987-02-10 |
AU560540B2 (en) | 1987-04-09 |
DE3361354D1 (en) | 1986-01-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3466353D1 (en) | Appliance for practising aquatic sports | |
CA2125040A1 (en) | A Process and an Apparatus for Wave Soldering | |
JPS5550437U (en) | ||
BG103583A (en) | Device for agitation and aeration of a liquid and foam elimination in a tank for the treatment of the above liquid | |
JPS5591191A (en) | Device for applying metallic brazing filler to printed circuit board | |
AU560540B2 (en) | Flood soldering device | |
DE3472066D1 (en) | Soldering apparatus | |
EP0329372A3 (en) | Foam fluxer | |
KR930003794A (en) | Mounting method to printed board of electronic component | |
DE3762357D1 (en) | CONTAINER WITH AN INTEGRATED PRESSURE CHAMBER. | |
WO1995003982A3 (en) | Device for producing a head on a beverage | |
DE3760999D1 (en) | Treatment apparatus, particularly for printed-circuit boards moving horizontally | |
JPS5516725A (en) | Soldering device | |
GB1468873A (en) | ||
JPS6440170A (en) | Automatic soldering device | |
JPS6450551A (en) | Ic package structure | |
KR910000993Y1 (en) | Flux coating device for print board | |
GB9106552D0 (en) | Method for producing a printed circuit board | |
JPS57145716A (en) | Lineup feeder of chiplike component | |
CA2058716A1 (en) | Printed circuit board assembly handle/stiffener | |
JPS6459835A (en) | Semiconductor device | |
JPH0447862U (en) | ||
JPS57155011A (en) | Electronic atomizer | |
JPS6434577A (en) | Soldering device for printed board | |
JPS5626421A (en) | Stabilizer for electric-discharge lamp |