JPS6440170A - Automatic soldering device - Google Patents
Automatic soldering deviceInfo
- Publication number
- JPS6440170A JPS6440170A JP19493787A JP19493787A JPS6440170A JP S6440170 A JPS6440170 A JP S6440170A JP 19493787 A JP19493787 A JP 19493787A JP 19493787 A JP19493787 A JP 19493787A JP S6440170 A JPS6440170 A JP S6440170A
- Authority
- JP
- Japan
- Prior art keywords
- passing
- liquid
- tank
- inert gas
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To minimize the necessary consumption of an inert gas and to enable soldering under an oxygen free atm. by sealing the inlet port and outlet port of a conveyor by a liquid and filling up the inert gas in a gaseous phase chamber. CONSTITUTION:When a conveyor device 6 is driven, the body 7 to be soldered comes into a liquid tank 5a, is transferred along the bottom of the liquid tank 5a inside with passing through a liquid 17, coming into the gaseous phase chamber 13 where an inert gas is filled up by passing an inlet port 15. It is then soldered by coming into contact with the surface of a solder bath 4 while passing through the upper part of a holder tank 1 and sent out to the outside of the tank by passing the outlet port 16 of a liquid tank 5b. The soldering is thus executed continuously and automatically under the oxygen free atm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19493787A JPS6440170A (en) | 1987-08-04 | 1987-08-04 | Automatic soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19493787A JPS6440170A (en) | 1987-08-04 | 1987-08-04 | Automatic soldering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6440170A true JPS6440170A (en) | 1989-02-10 |
Family
ID=16332818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19493787A Pending JPS6440170A (en) | 1987-08-04 | 1987-08-04 | Automatic soldering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6440170A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0350789A (en) * | 1989-07-18 | 1991-03-05 | Murata Mfg Co Ltd | Soldering of electronic component device |
JPH0494154U (en) * | 1991-01-09 | 1992-08-14 | ||
JPH0524155U (en) * | 1991-05-14 | 1993-03-30 | 日本電熱計器株式会社 | Soldering equipment |
JPH0592259A (en) * | 1991-09-30 | 1993-04-16 | Osaka Asahi Kagaku Kk | Soldering device in atmosphere of inert gas |
JP2014533438A (en) * | 2011-11-11 | 2014-12-11 | クゥアルコム・インコーポレイテッドQualcomm Incorporated | Method and apparatus for wafer level solder hermetic encapsulation of MEMS devices |
-
1987
- 1987-08-04 JP JP19493787A patent/JPS6440170A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0350789A (en) * | 1989-07-18 | 1991-03-05 | Murata Mfg Co Ltd | Soldering of electronic component device |
JPH0494154U (en) * | 1991-01-09 | 1992-08-14 | ||
JPH0524155U (en) * | 1991-05-14 | 1993-03-30 | 日本電熱計器株式会社 | Soldering equipment |
JPH0592259A (en) * | 1991-09-30 | 1993-04-16 | Osaka Asahi Kagaku Kk | Soldering device in atmosphere of inert gas |
JP2014533438A (en) * | 2011-11-11 | 2014-12-11 | クゥアルコム・インコーポレイテッドQualcomm Incorporated | Method and apparatus for wafer level solder hermetic encapsulation of MEMS devices |
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