DE69401459D1 - Vorrichtung zum Montieren von elektronischen Bauelementen auf Platten - Google Patents
Vorrichtung zum Montieren von elektronischen Bauelementen auf PlattenInfo
- Publication number
- DE69401459D1 DE69401459D1 DE69401459T DE69401459T DE69401459D1 DE 69401459 D1 DE69401459 D1 DE 69401459D1 DE 69401459 T DE69401459 T DE 69401459T DE 69401459 T DE69401459 T DE 69401459T DE 69401459 D1 DE69401459 D1 DE 69401459D1
- Authority
- DE
- Germany
- Prior art keywords
- boards
- electronic components
- mounting electronic
- mounting
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5129800A JPH06338700A (ja) | 1993-05-31 | 1993-05-31 | 実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69401459D1 true DE69401459D1 (de) | 1997-02-27 |
DE69401459T2 DE69401459T2 (de) | 1997-05-15 |
Family
ID=15018545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69401459T Expired - Fee Related DE69401459T2 (de) | 1993-05-31 | 1994-05-31 | Vorrichtung zum Montieren von elektronischen Bauelementen auf Platten |
Country Status (6)
Country | Link |
---|---|
US (1) | US5498942A (de) |
EP (1) | EP0627877B1 (de) |
JP (1) | JPH06338700A (de) |
KR (1) | KR940027654A (de) |
DE (1) | DE69401459T2 (de) |
TW (1) | TW275181B (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3433218B2 (ja) * | 1995-01-17 | 2003-08-04 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
CN1091341C (zh) * | 1995-02-17 | 2002-09-18 | 松下电器产业株式会社 | 电子元件装配方法及装置 |
JP3652397B2 (ja) * | 1995-02-21 | 2005-05-25 | 三星テクウィン株式会社 | 部品搭載方法および搭載装置 |
JPH0936156A (ja) * | 1995-07-25 | 1997-02-07 | Mitsubishi Electric Corp | ゲートブレイク装置およびゲートブレイク方法 |
US6094808A (en) * | 1996-02-16 | 2000-08-01 | Matsushita Electric Industrial Co., Ltd. | Apparatus for mounting electronic components |
US6230393B1 (en) * | 1997-07-07 | 2001-05-15 | Matsushita Electric Industrial Co., Ltd. | Method and device for mounting electronic component |
KR100253092B1 (ko) * | 1997-12-05 | 2000-06-01 | 윤종용 | 반도체 제조설비의 진공 흡착 장치 |
JP3987648B2 (ja) * | 1998-11-16 | 2007-10-10 | ヤマハ発動機株式会社 | 表面実装機 |
US20030205030A1 (en) * | 2001-02-22 | 2003-11-06 | Martin Weiss | Taper machine using inertial control of parts |
JP2002368495A (ja) * | 2001-06-08 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 部品実装装置及び部品実装方法 |
US6691859B2 (en) * | 2001-12-20 | 2004-02-17 | Autosplice Systems, Inc. | Automatic feeder for strip-supported contacts |
US6820325B2 (en) * | 2002-10-17 | 2004-11-23 | Delaware Capital Formation, Inc. | Integrated air flow control for a pick and place spindle assembly |
JP4564235B2 (ja) * | 2003-02-24 | 2010-10-20 | パナソニック株式会社 | 部品実装装置及び部品実装方法 |
US20080179330A1 (en) * | 2007-01-29 | 2008-07-31 | Brooks Kerry G | Trash containment system |
KR20130079031A (ko) * | 2012-01-02 | 2013-07-10 | 삼성전자주식회사 | 반도체 칩 실장 장치 |
TWI487839B (zh) * | 2013-05-14 | 2015-06-11 | King Yuan Electronics Co Ltd | 旋轉凸輪式真空切換模組 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3831250A (en) * | 1971-06-21 | 1974-08-27 | King Radio Corp | Method and apparatus for assembling printed circuit boards |
US4231153A (en) * | 1979-02-22 | 1980-11-04 | Browne Lawrence T | Article placement system |
JPH0691355B2 (ja) * | 1988-01-19 | 1994-11-14 | 三洋電機株式会社 | 電子部品位置決め装置 |
JP2568623B2 (ja) * | 1988-04-12 | 1997-01-08 | 松下電器産業株式会社 | 電子部品の実装方法 |
JP2620646B2 (ja) * | 1989-06-07 | 1997-06-18 | 三洋電機株式会社 | 電子部品自動装着装置 |
JPH05129796A (ja) * | 1991-09-25 | 1993-05-25 | Toshiba Corp | 部品実装装置 |
-
1993
- 1993-05-31 JP JP5129800A patent/JPH06338700A/ja active Pending
-
1994
- 1994-05-23 KR KR1019940011204A patent/KR940027654A/ko not_active Application Discontinuation
- 1994-05-26 TW TW083104780A patent/TW275181B/zh active
- 1994-05-31 US US08/251,377 patent/US5498942A/en not_active Expired - Fee Related
- 1994-05-31 EP EP94401196A patent/EP0627877B1/de not_active Expired - Lifetime
- 1994-05-31 DE DE69401459T patent/DE69401459T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5498942A (en) | 1996-03-12 |
EP0627877B1 (de) | 1997-01-15 |
JPH06338700A (ja) | 1994-12-06 |
EP0627877A1 (de) | 1994-12-07 |
DE69401459T2 (de) | 1997-05-15 |
KR940027654A (ko) | 1994-12-10 |
TW275181B (de) | 1996-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |