DE69926162D1 - Vorrichtung zum Bestücken von Leiterplatten mit elektronischen Bauteilen - Google Patents

Vorrichtung zum Bestücken von Leiterplatten mit elektronischen Bauteilen

Info

Publication number
DE69926162D1
DE69926162D1 DE69926162T DE69926162T DE69926162D1 DE 69926162 D1 DE69926162 D1 DE 69926162D1 DE 69926162 T DE69926162 T DE 69926162T DE 69926162 T DE69926162 T DE 69926162T DE 69926162 D1 DE69926162 D1 DE 69926162D1
Authority
DE
Germany
Prior art keywords
printed circuit
electronic components
circuit boards
equipping printed
equipping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69926162T
Other languages
English (en)
Other versions
DE69926162T2 (de
Inventor
Yoichi Kinoshita
Takashi Munezane
Kunio Tanaka
Shigeki Nakatsuka
Toshihiko Nagaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69926162D1 publication Critical patent/DE69926162D1/de
Publication of DE69926162T2 publication Critical patent/DE69926162T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
DE69926162T 1998-03-03 1999-03-02 Vorrichtung zum Bestücken von Leiterplatten mit elektronischen Bauteilen Expired - Lifetime DE69926162T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10050453A JPH11251792A (ja) 1998-03-03 1998-03-03 電子部品装着機
JP5045398 1998-03-03

Publications (2)

Publication Number Publication Date
DE69926162D1 true DE69926162D1 (de) 2005-08-25
DE69926162T2 DE69926162T2 (de) 2006-05-24

Family

ID=12859293

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69926162T Expired - Lifetime DE69926162T2 (de) 1998-03-03 1999-03-02 Vorrichtung zum Bestücken von Leiterplatten mit elektronischen Bauteilen

Country Status (8)

Country Link
US (1) US6370764B1 (de)
EP (1) EP0946087B1 (de)
JP (1) JPH11251792A (de)
KR (1) KR100374438B1 (de)
CN (1) CN1130115C (de)
DE (1) DE69926162T2 (de)
SG (1) SG76598A1 (de)
TW (1) TW401729B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6701610B1 (en) * 1998-07-28 2004-03-09 Koninklijke Philips Electronics N.V. Pick and place machine with varied nozzle lengths
WO2001041523A1 (fr) * 1999-11-29 2001-06-07 Shibaura Mechatronics Corporation Dispositif de montage de pieces et procede associe
KR20010114161A (ko) * 2000-06-21 2001-12-29 마츠시타 덴끼 산교 가부시키가이샤 부품의 장착 장치 및 장착 방법
US20030102681A1 (en) * 2001-12-04 2003-06-05 Gary Bouchard High speed pickhead
DE10236626A1 (de) * 2002-08-09 2004-02-19 Siemens Ag Vorrichtung zum selektiven Bewegen von Haltevorrichtungen und Bestückkopf zum Transportieren von Bauelementen
JP4384439B2 (ja) * 2002-11-21 2009-12-16 富士機械製造株式会社 対基板作業機、対基板作業システムおよび対基板作業機用作業ヘッド使用準備処理プログラム
WO2007015561A1 (en) * 2005-08-02 2007-02-08 Matsushita Electric Industrial Co., Ltd. Electronic component mounter and mounting method
JP4695954B2 (ja) * 2005-09-30 2011-06-08 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
KR100816071B1 (ko) * 2006-09-22 2008-03-24 미래산업 주식회사 전자부품 픽커 및 이를 구비한 핸들러용 헤드 어셈블리
JP4840422B2 (ja) * 2008-09-04 2011-12-21 パナソニック株式会社 電子部品実装用装置及び電子部品実装用装置による作業方法
JP2012240166A (ja) * 2011-05-20 2012-12-10 Fanuc Ltd ビジョンセンサ及び吸引装置を備えた吸着搬送装置
DE202013102447U1 (de) * 2013-06-07 2014-09-08 Seho Systemtechnik Gmbh In Transportsystem integrierter Arbeitsplatz
JP6442625B2 (ja) * 2016-01-12 2018-12-19 ヤマハ発動機株式会社 被実装物作業装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3279044A (en) * 1964-12-14 1966-10-18 Max E Roper Tip for insertion tool
US4606117A (en) * 1983-05-13 1986-08-19 Tdk Corporation Apparatus for automatically mounting chip type circuit elements on printed circuit boards
JPS59224279A (ja) * 1983-06-01 1984-12-17 富士機械製造株式会社 電子部品の位置決め保持方法および装置
JPS6066500A (ja) * 1983-09-22 1985-04-16 松下電器産業株式会社 部品装着装置
JPS62114289A (ja) * 1985-11-14 1987-05-26 松下電器産業株式会社 電子部品の装着方法および装置
GB2214894B (en) * 1988-02-03 1991-10-30 Ind Tech Res Inst Surface mounting device pick-and-place head
US4979286A (en) * 1988-05-13 1990-12-25 Hitachi, Ltd. Electric parts mounting apparatus and electric parts mounting method
JPH07109957B2 (ja) * 1988-06-21 1995-11-22 松下電器産業株式会社 電子部品装着方法
JPH02303200A (ja) * 1989-05-18 1990-12-17 Hitachi Ltd 電子部品装着装置
JP2503082B2 (ja) * 1989-09-05 1996-06-05 富士機械製造株式会社 電子部品装着装置
US5058263A (en) * 1989-12-21 1991-10-22 U.S. Philips Corporation Manipulation device
JP2765187B2 (ja) * 1990-05-28 1998-06-11 ソニー株式会社 電子部品装着装置
JP3058708B2 (ja) * 1991-04-09 2000-07-04 松下電器産業株式会社 部品装着機
US5290134A (en) * 1991-12-03 1994-03-01 Advantest Corporation Pick and place for automatic test handler
EP0578136B1 (de) 1992-07-01 1995-11-22 Yamaha Hatsudoki Kabushiki Kaisha Verfahren zum Montieren von Komponenten und Vorrichtung dafür
US5421696A (en) * 1992-10-30 1995-06-06 Delco Electronics Corp. Zero error Z-axis compliance robotic device and process
JP2823481B2 (ja) * 1993-05-26 1998-11-11 三洋電機株式会社 電子部品自動装着装置
JP3114469B2 (ja) * 1993-11-29 2000-12-04 松下電器産業株式会社 電子部品吸着装置
JPH07212096A (ja) 1994-01-21 1995-08-11 Yamaha Motor Co Ltd 実装機の部品認識装置
EP0664665B1 (de) 1994-01-21 1997-07-09 Yamaha Hatsudoki Kabushiki Kaisha Eine Vorrichtung zum Montieren von Komponenten in spezifische Positionen
SG52900A1 (en) 1996-01-08 1998-09-28 Matsushita Electric Ind Co Ltd Mounting apparatus of electronic components and mounting methods of the same
JP3339344B2 (ja) * 1997-01-17 2002-10-28 松下電器産業株式会社 電子部品装着装置

Also Published As

Publication number Publication date
EP0946087B1 (de) 2005-07-20
KR19990077540A (ko) 1999-10-25
TW401729B (en) 2000-08-11
SG76598A1 (en) 2000-11-21
DE69926162T2 (de) 2006-05-24
JPH11251792A (ja) 1999-09-17
US6370764B1 (en) 2002-04-16
KR100374438B1 (ko) 2003-03-03
EP0946087A3 (de) 1999-10-13
CN1233933A (zh) 1999-11-03
EP0946087A2 (de) 1999-09-29
CN1130115C (zh) 2003-12-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)