US20030205030A1 - Taper machine using inertial control of parts - Google Patents
Taper machine using inertial control of parts Download PDFInfo
- Publication number
- US20030205030A1 US20030205030A1 US10/239,344 US23934402A US2003205030A1 US 20030205030 A1 US20030205030 A1 US 20030205030A1 US 23934402 A US23934402 A US 23934402A US 2003205030 A1 US2003205030 A1 US 2003205030A1
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- United States
- Prior art keywords
- vacuum
- chip
- head
- vacuum head
- moving
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
Definitions
- the invention relates to machines used to load electrical parts or circuit elements, hereinafter referred to generically as chips, into the compartments or pockets of a carrier tape for storage and shipment.
- a manufacturer of chips will create a large number of chips, and the chips will be supported on a temporary carrier medium.
- the chips are then processed through a quality control machine of one type or another, where the chips are visually inspected for flaws.
- the chips passing the inspection are then removed from the temporary carrier medium and placed in the compartments or pockets of a carrier tape.
- the carrier tape is then wound on a reel and stored and eventually shipped to the purchaser of the chips (often a manufacturer of electronic devices such as personal computers).
- pick-and-place assemblies have been constructed to move chips to the tape compartment through a series of distinct movements. More specifically, the pick-and-place head is moved to engage an exposed surface of a chip and the head is attached to the chip by means of a vacuum. The pick-and-place head is then moved upwardly and is displaced to one side or the other with the chip attached to the head. Once the chip is positioned over the tape compartment, the head is brought to a stop. Then the pick-and-place head is moved downwardly toward the tape compartment, and the vacuum is released to deposit the chip in the tape compartment. The movement of the pick-and-place head is then retraced to return the head to the start position and repeat the steps just described for the next chip in line.
- the invention provides a method for packaging electronic chips into the compartments of a carrier tape includes feeding a chip into a preselected position with respect to a movable vacuum head, taking custody of the chip by way of a vacuum in the vacuum head, moving the vacuum head in a single motion toward the carrier tape without substantially altering the direction of movement of the vacuum head, and interrupting the vacuum in the vacuum head to release the chip into a compartment of the tape.
- the chips may be feed by gravity feed.
- the preselected position may be within a slot in a body, and the body may be bifurcated to provide access for the vacuum head to the slot.
- the body may be moved aside after the vacuum head has taken custody of the chip to remove a support surface or floor from under the chip.
- the chip may then be moved downwardly, either directly on along an arcuate path, in a single motion to position the chip in the tape compartment.
- FIGS. 1 - 5 are schematic representations of the movement of a prior art pick-and-place head as viewed from the side.
- FIG. 6 is a perspective view of a taper machine embodying the present invention.
- FIGS. 7 - 9 are side schematic representations of an apparatus embodying the present invention and executing the steps of moving a chip from a feeder to a carrier tape.
- FIGS. 10 and 11 are side schematic representations of an alternative embodiment of the invention.
- FIGS. 12 and 13 are side schematic representations of another alternative embodiment of the invention.
- FIG. 14 is a view taken from the vantage of line 14 - 14 in FIG. 13.
- FIGS. 1 - 5 illustrate the operation of a pick-and-place elevator or head 10 executing a prior art method for loading a carrier tape 14 .
- a chip 18 is delivered to a pick-and-place station on an inclined surface 22 of a gravity feed arrangement.
- the chip 18 engages a stop 26 , and is thereby positioned in the pick-and-place station for engagement by the head 10 .
- the head 10 is moved toward the chip 18 , a vacuum is drawn through the head 10 and the chip 18 is attached to the head 10 by reason of the vacuum.
- the head 10 is moved away from the surface 22 to clear the stop 26 .
- the chip 18 is being displaced against its own weight and against the inertial forces tending to keep the chip 18 at rest on the surface 22 .
- the step is preferably conducted as quickly as possible to maximize the efficiency of the tape loading process.
- the inertial forces that must be overcome are directly related to the speed at which the step is carried out.
- the vacuum force must therefore be rather strong to insure the head 10 maintains custody of the chip 18 when the step is executed quickly. The strong vacuum creates the possibility of damage to the chip 18 or its exposed leads and/or terminals.
- FIG. 3 illustrates the next step in the movement of the prior art loading process.
- this step movement of the head 10 away from the surface 22 is stopped, and then the head is pivoted or moved to the left as seen in the drawings to transport the chip 18 to a position over the carrier tape 14 .
- this step is preferably carried out very quickly, and thus there are further inertial forces exerted on the chip 18 when movement of the head 10 stops and changes direction quickly.
- the head 10 is brought to a quick stop over a compartment or pocket in the carrier tape 14 , which is yet another change in momentum of the chip 18 .
- the chip 18 is quickly lowered by the head 10 to position the chip 18 in the tape compartment. Once the chip 18 is positioned in the tape compartment, the vacuum is momentarily shut off to release the chip 18 into the tape compartment.
- FIG. 5 illustrates the last step in the prior art loading process. In this step, the head 10 is raised and returned to the position illustrated in FIG. 1.
- FIG. 6 illustrates a taper machine 30 embodying the present invention and including a tape supply reel 31 and a tape output reel 32 .
- the machine 30 includes an inclined surface or gravity feed apparatus 34 for supporting chips 18 to be packaged in the carrier tape 14 .
- the tape 14 runs from the supply reel 31 , through a taper assembly 46 , and to the output reel 32 .
- the taper assembly 46 transfers the chips 18 from the inclined surface 34 to the tape 14 .
- a stop 48 is positioned upstream (in the sense of travel along the inclined surface 34 ) of the taper assembly 46 , and provides one chip 18 at a time to the taper assembly 46 .
- the taper assembly 46 includes a chip receiving body 50 that has a bifurcated or split nose 54 and a floor 56 that together define a chip receiving slot 58 .
- the nose 54 also includes a cam profile surface 62 extending substantially parallel to the inclined surface 34 , and a nose profile surface 66 which is substantially linear and angled down toward the inclined surface 34 .
- a stop 70 Positioned within the slot 58 is a stop 70 that locates the chip 18 within the slot 58 .
- a cam follower 74 Supported on top of the body 50 is a cam follower 74 , which may, for example, be a roller.
- the cam follower 74 supports a pivot arm 78 which in turn supports a vacuum head 82 .
- the head 82 extends between the two halves of the bifurcated nose 54 , and into the slot 58 .
- the pivot arm 78 is fixed for rotation with the cam follower 74 such that the pivot arm 78 and cam follower 74 rotate together.
- the pivot arm 78 is suitably biased (e.g. by spring or gravity) in the clockwise direction as viewed in FIGS. 7 - 9 .
- FIG. 7 The first step of the taping process is illustrated in FIG. 7.
- a chip 18 slides or is fed down the inclined surface 34 and into the slot 58 .
- the chip 18 is positioned under the head 82 by the stop 70 .
- a vacuum is drawn in the head 82 so that the head 82 takes custody of the chip 18 .
- FIG. 8 The next step is illustrated in FIG. 8, where the body 50 is moved down and to the left as illustrated and substantially parallel to the inclined surface 34 . This movement causes the chip 18 to be moved out of the slot 58 . As the body 50 is moved, the support floor 56 is moved from underneath the chip 18 . The cam follower 74 is held stationary such that the body 50 moves relative to the cam follower 74 .
- FIG. 9 illustrates the next step in the process, in which the chip 18 is deposited into a compartment or pocket of the carrier tape 14 .
- Movement of the cam follower 74 down the nose profile surface 66 causes the cam follower 74 to rotate as illustrated, which in turn causes the pivot arm 78 to pivot and the head 82 to lower.
- This action moves the chip 18 toward the carrier tape.
- the vacuum is then interrupted to release the chip 18 from the head 82 and deposit the chip 18 into the tape compartment, and the body 50 is moved to the right as illustrated, causing the pivot arm 78 to raise the head 82 and move the slot 58 into the position shown in FIG. 7.
- the above-described process moves the chip 18 substantially in the direction of the chip's 18 acceleration due to gravity (i.e., in the direction of its weight), and that substantially no inertial forces act on the chip 18 as the chip is moved down into the tape compartment. Any the inertial forces acting on the chip 18 during the downward movement of the head 82 tend to further secure the head's custody of the chip 18 .
- the chip 18 is transported in single smooth motion step to the tape compartment from the inclined surface 34 . Because there are no stops and/or changes in direction between the inclined surface 34 and the tape compartment, and substantially all motion is in the direction of weight of the chip 18 , a lower vacuum may be used when compared to prior art arrangements.
- the taper machine of the present invention therefore minimizes the opportunity for damage to or misalignment of the chip 18 .
- FIGS. 10 and 11 An alternative embodiment is illustrated in FIGS. 10 and 11.
- the chips 18 are transported on a track 86 by a singulator station 90 comprising a suitable belt drive 94 for moving the chips 18 against a stop 98 .
- An air jet 102 moves a selected or singulated chip into a bifurcated body 106 after stop 98 is moved up to release the chip 18 .
- the singulated chip 18 moves against stop 110 and onto support platform or floor 114 .
- a vacuum is drawn on vacuum elevator 118 to attach the chip 18 thereto.
- the body 106 is moved to the right as illustrated by actuator 122 which can be hydraulic or pneumatically operated.
- the body 106 As the body 106 is moved, the floor 114 is removed from under the chip 18 , and the cam follower 126 attached to the vacuum elevator rides down on the inclined surface 130 lowering the chip 18 toward and into the tape compartment at which time the vacuum is interrupted and the chip 18 is released. The body 106 is then moved to left as illustrated returning the vacuum elevator 118 to the start position to attach to and move a subsequent chip 18 to the tape compartment. Again the chip 18 is moved in a single smooth step and in the direction of the weight of the chip 18 to achieve the advantages mentioned above.
- FIGS. 12 and 13 illustrate another embodiment of the taper assembly 46 , in which a singulator stop 134 permits a single chip 18 to slide down the inclined surface 34 into abutment with a stop 138 .
- a vacuum head 142 is pivoted by a drive mechanism 146 to a position above the chip 18 .
- the drive mechanism 146 may include, for example, a motor output shaft or a shaft operatively interconnected with a motor output shaft 147 , a pair of sprockets 148 , and a flexible force transfer member 149 (e.g., a drive belt or chain).
- a vacuum is applied through the head 142 to take custody of the chip 18 .
- An actuator 150 is used to pivot or otherwise move a floor member 154 from under the chip 18 . Once the floor member 154 is clear of the chip 18 , the vacuum head 142 is pivoted down to position the chip 18 in the tape compartment. The vacuum is then interrupted and the vacuum head 142 and floor member 154 are raised to the positions shown in FIG. 12.
- FIG. 14 illustrates a type of vacuum head 142 that may be employed to assist in keeping custody of the chip 18 during transfer of the chip 18 from the surface 34 to the tape 14 .
- the illustrated head 142 includes a pair of depending members 158 that snugly fit on either side of the chip 18 to further prevent the chip 18 from moving relative to the head 142 during transfer to the tape.
- the head arrangement illustrated in FIG. 14 may be used with the vacuum heads 82 , 118 of FIGS. 7 - 11 as well.
- additional depending member 158 may be employed to embrace the chip 18 on three or even four sides to further reduce the likelihood of movement of the chip 18 during transfer.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
- This application claims priority to International Application No. PCT/US01/05641 filed on Feb. 22, 2001, which claims the benefit of U.S. Provisional Patent Application No. 60/184,887 filed Feb. 25, 2000.
- The invention relates to machines used to load electrical parts or circuit elements, hereinafter referred to generically as chips, into the compartments or pockets of a carrier tape for storage and shipment.
- Typically, a manufacturer of chips will create a large number of chips, and the chips will be supported on a temporary carrier medium. The chips are then processed through a quality control machine of one type or another, where the chips are visually inspected for flaws. The chips passing the inspection are then removed from the temporary carrier medium and placed in the compartments or pockets of a carrier tape. The carrier tape is then wound on a reel and stored and eventually shipped to the purchaser of the chips (often a manufacturer of electronic devices such as personal computers).
- There are several processes and methods known for removing the chips from the temporary carrier medium and placing the chips in the pockets of the carrier tape. Often a pick-and-place device or module is used. In many instances the chips are fed to the pick-and-place device by a gravity feed. The pick-and-place device takes custody of each chip and moves the chip over some distance to the pocket of the carrier tape.
- To date pick-and-place assemblies have been constructed to move chips to the tape compartment through a series of distinct movements. More specifically, the pick-and-place head is moved to engage an exposed surface of a chip and the head is attached to the chip by means of a vacuum. The pick-and-place head is then moved upwardly and is displaced to one side or the other with the chip attached to the head. Once the chip is positioned over the tape compartment, the head is brought to a stop. Then the pick-and-place head is moved downwardly toward the tape compartment, and the vacuum is released to deposit the chip in the tape compartment. The movement of the pick-and-place head is then retraced to return the head to the start position and repeat the steps just described for the next chip in line.
- The movement of the head is as rapid as possible to maintain a speedy loading operation, and the chip is therefore subjected to abrupt starts, stops, and changes in direction of movement. As a result, it is not uncommon for chips to dislodge or displace on the head. If the chip is forced off of the head, the chip may in some cases be damaged. If the chip is not separated, but just displaced, the chip may be positioned in the tape compartment in an improper or skewed position, which again can result in damage to the chip and/or disrupt the loading process. Most gravity feed apparatus are angled with respect to horizontal, which requires the pick-and-place head to mirror the angle to facilitate the loading process. Such angular disposition of the head can exaggerate the above-mentioned problems.
- The invention provides a method for packaging electronic chips into the compartments of a carrier tape includes feeding a chip into a preselected position with respect to a movable vacuum head, taking custody of the chip by way of a vacuum in the vacuum head, moving the vacuum head in a single motion toward the carrier tape without substantially altering the direction of movement of the vacuum head, and interrupting the vacuum in the vacuum head to release the chip into a compartment of the tape. The chips may be feed by gravity feed.
- The preselected position may be within a slot in a body, and the body may be bifurcated to provide access for the vacuum head to the slot. The body may be moved aside after the vacuum head has taken custody of the chip to remove a support surface or floor from under the chip. The chip may then be moved downwardly, either directly on along an arcuate path, in a single motion to position the chip in the tape compartment.
- FIGS.1-5 are schematic representations of the movement of a prior art pick-and-place head as viewed from the side.
- FIG. 6 is a perspective view of a taper machine embodying the present invention.
- FIGS.7-9 are side schematic representations of an apparatus embodying the present invention and executing the steps of moving a chip from a feeder to a carrier tape.
- FIGS. 10 and 11 are side schematic representations of an alternative embodiment of the invention.
- FIGS. 12 and 13 are side schematic representations of another alternative embodiment of the invention.
- FIG. 14 is a view taken from the vantage of line14-14 in FIG. 13.
- FIGS.1-5 illustrate the operation of a pick-and-place elevator or
head 10 executing a prior art method for loading acarrier tape 14. Achip 18 is delivered to a pick-and-place station on aninclined surface 22 of a gravity feed arrangement. Thechip 18 engages astop 26, and is thereby positioned in the pick-and-place station for engagement by thehead 10. In FIG. 1, thehead 10 is moved toward thechip 18, a vacuum is drawn through thehead 10 and thechip 18 is attached to thehead 10 by reason of the vacuum. - Next, as illustrated in FIG. 2, the
head 10 is moved away from thesurface 22 to clear thestop 26. At this point it should be noted thechip 18 is being displaced against its own weight and against the inertial forces tending to keep thechip 18 at rest on thesurface 22. Of course, the step is preferably conducted as quickly as possible to maximize the efficiency of the tape loading process. The inertial forces that must be overcome are directly related to the speed at which the step is carried out. The vacuum force must therefore be rather strong to insure thehead 10 maintains custody of thechip 18 when the step is executed quickly. The strong vacuum creates the possibility of damage to thechip 18 or its exposed leads and/or terminals. - FIG. 3 illustrates the next step in the movement of the prior art loading process. In this step, movement of the
head 10 away from thesurface 22 is stopped, and then the head is pivoted or moved to the left as seen in the drawings to transport thechip 18 to a position over thecarrier tape 14. As with the steps described above, this step is preferably carried out very quickly, and thus there are further inertial forces exerted on thechip 18 when movement of thehead 10 stops and changes direction quickly. Additionally, at the end of this step, thehead 10 is brought to a quick stop over a compartment or pocket in thecarrier tape 14, which is yet another change in momentum of thechip 18. - In FIG. 4, the
chip 18 is quickly lowered by thehead 10 to position thechip 18 in the tape compartment. Once thechip 18 is positioned in the tape compartment, the vacuum is momentarily shut off to release thechip 18 into the tape compartment. - FIG. 5 illustrates the last step in the prior art loading process. In this step, the
head 10 is raised and returned to the position illustrated in FIG. 1. - FIG. 6 illustrates a
taper machine 30 embodying the present invention and including atape supply reel 31 and atape output reel 32. Themachine 30 includes an inclined surface orgravity feed apparatus 34 for supportingchips 18 to be packaged in thecarrier tape 14. Thetape 14 runs from thesupply reel 31, through ataper assembly 46, and to theoutput reel 32. Thetaper assembly 46 transfers thechips 18 from theinclined surface 34 to thetape 14. Astop 48 is positioned upstream (in the sense of travel along the inclined surface 34) of thetaper assembly 46, and provides onechip 18 at a time to thetaper assembly 46. - Turning to FIGS.7-9, the
taper assembly 46 will be discussed in more detail. Thetaper assembly 46 includes achip receiving body 50 that has a bifurcated or splitnose 54 and afloor 56 that together define achip receiving slot 58. Thenose 54 also includes acam profile surface 62 extending substantially parallel to theinclined surface 34, and anose profile surface 66 which is substantially linear and angled down toward theinclined surface 34. Positioned within theslot 58 is astop 70 that locates thechip 18 within theslot 58. Supported on top of thebody 50 is acam follower 74, which may, for example, be a roller. Thecam follower 74 supports apivot arm 78 which in turn supports avacuum head 82. Thehead 82 extends between the two halves of thebifurcated nose 54, and into theslot 58. Thepivot arm 78 is fixed for rotation with thecam follower 74 such that thepivot arm 78 andcam follower 74 rotate together. Thepivot arm 78 is suitably biased (e.g. by spring or gravity) in the clockwise direction as viewed in FIGS. 7-9. - The first step of the taping process is illustrated in FIG. 7. A
chip 18 slides or is fed down theinclined surface 34 and into theslot 58. Thechip 18 is positioned under thehead 82 by thestop 70. When thechip 18 is in engagement with thestop 70, a vacuum is drawn in thehead 82 so that thehead 82 takes custody of thechip 18. - The next step is illustrated in FIG. 8, where the
body 50 is moved down and to the left as illustrated and substantially parallel to theinclined surface 34. This movement causes thechip 18 to be moved out of theslot 58. As thebody 50 is moved, thesupport floor 56 is moved from underneath thechip 18. Thecam follower 74 is held stationary such that thebody 50 moves relative to thecam follower 74. - FIG. 9 illustrates the next step in the process, in which the
chip 18 is deposited into a compartment or pocket of thecarrier tape 14. Movement of thecam follower 74 down thenose profile surface 66, causes thecam follower 74 to rotate as illustrated, which in turn causes thepivot arm 78 to pivot and thehead 82 to lower. This action moves thechip 18 toward the carrier tape. The vacuum is then interrupted to release thechip 18 from thehead 82 and deposit thechip 18 into the tape compartment, and thebody 50 is moved to the right as illustrated, causing thepivot arm 78 to raise thehead 82 and move theslot 58 into the position shown in FIG. 7. - It should be appreciated that the above-described process moves the
chip 18 substantially in the direction of the chip's 18 acceleration due to gravity (i.e., in the direction of its weight), and that substantially no inertial forces act on thechip 18 as the chip is moved down into the tape compartment. Any the inertial forces acting on thechip 18 during the downward movement of thehead 82 tend to further secure the head's custody of thechip 18. In this manner thechip 18 is transported in single smooth motion step to the tape compartment from theinclined surface 34. Because there are no stops and/or changes in direction between theinclined surface 34 and the tape compartment, and substantially all motion is in the direction of weight of thechip 18, a lower vacuum may be used when compared to prior art arrangements. The taper machine of the present invention therefore minimizes the opportunity for damage to or misalignment of thechip 18. - An alternative embodiment is illustrated in FIGS. 10 and 11. In this embodiment the
chips 18 are transported on atrack 86 by asingulator station 90 comprising asuitable belt drive 94 for moving thechips 18 against astop 98. Anair jet 102 moves a selected or singulated chip into abifurcated body 106 afterstop 98 is moved up to release thechip 18. Thesingulated chip 18 moves againststop 110 and onto support platform orfloor 114. When so positioned a vacuum is drawn onvacuum elevator 118 to attach thechip 18 thereto. Thebody 106 is moved to the right as illustrated byactuator 122 which can be hydraulic or pneumatically operated. As thebody 106 is moved, thefloor 114 is removed from under thechip 18, and thecam follower 126 attached to the vacuum elevator rides down on theinclined surface 130 lowering thechip 18 toward and into the tape compartment at which time the vacuum is interrupted and thechip 18 is released. Thebody 106 is then moved to left as illustrated returning thevacuum elevator 118 to the start position to attach to and move asubsequent chip 18 to the tape compartment. Again thechip 18 is moved in a single smooth step and in the direction of the weight of thechip 18 to achieve the advantages mentioned above. - FIGS. 12 and 13 illustrate another embodiment of the
taper assembly 46, in which asingulator stop 134 permits asingle chip 18 to slide down theinclined surface 34 into abutment with astop 138. Avacuum head 142 is pivoted by adrive mechanism 146 to a position above thechip 18. Thedrive mechanism 146 may include, for example, a motor output shaft or a shaft operatively interconnected with amotor output shaft 147, a pair ofsprockets 148, and a flexible force transfer member 149 (e.g., a drive belt or chain). A vacuum is applied through thehead 142 to take custody of thechip 18. Anactuator 150 is used to pivot or otherwise move afloor member 154 from under thechip 18. Once thefloor member 154 is clear of thechip 18, thevacuum head 142 is pivoted down to position thechip 18 in the tape compartment. The vacuum is then interrupted and thevacuum head 142 andfloor member 154 are raised to the positions shown in FIG. 12. - FIG. 14 illustrates a type of
vacuum head 142 that may be employed to assist in keeping custody of thechip 18 during transfer of thechip 18 from thesurface 34 to thetape 14. The illustratedhead 142 includes a pair of dependingmembers 158 that snugly fit on either side of thechip 18 to further prevent thechip 18 from moving relative to thehead 142 during transfer to the tape. It should be noted that the head arrangement illustrated in FIG. 14 may be used with the vacuum heads 82, 118 of FIGS. 7-11 as well. It should also be noted that additional dependingmember 158 may be employed to embrace thechip 18 on three or even four sides to further reduce the likelihood of movement of thechip 18 during transfer.
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/239,344 US20030205030A1 (en) | 2001-02-22 | 2001-02-22 | Taper machine using inertial control of parts |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2001/005641 WO2001062596A1 (en) | 2000-02-25 | 2001-02-22 | Taper machine using inertial control of parts |
US10/239,344 US20030205030A1 (en) | 2001-02-22 | 2001-02-22 | Taper machine using inertial control of parts |
Publications (1)
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US20030205030A1 true US20030205030A1 (en) | 2003-11-06 |
Family
ID=29270237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/239,344 Abandoned US20030205030A1 (en) | 2001-02-22 | 2001-02-22 | Taper machine using inertial control of parts |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180244414A1 (en) * | 2017-02-24 | 2018-08-30 | Taiyo Yuden Co., Ltd. | Taping apparatus |
Citations (9)
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US4915770A (en) * | 1987-05-09 | 1990-04-10 | Hitachi, Ltd. | Electronic chip supplying apparatus and method |
US5498942A (en) * | 1993-05-31 | 1996-03-12 | Sony Corporation | Electronic packaging apparatus |
US5525023A (en) * | 1992-12-10 | 1996-06-11 | Matsushita Electric Industrial Co., Ltd. | Chip component supply apparatus |
US5846621A (en) * | 1995-09-15 | 1998-12-08 | Minnesota Mining And Manufacturing Company | Component carrier tape having static dissipative properties |
US5852869A (en) * | 1995-09-22 | 1998-12-29 | Universal Instruments Corporation | Method and apparatus for supplying and placing components |
US6074158A (en) * | 1995-11-06 | 2000-06-13 | Advantest Corporation | IC transporting apparatus, IC posture altering apparatus and IC take-out apparatus |
US6101707A (en) * | 1998-03-03 | 2000-08-15 | Sanyo Electric Co., Ltd. | Mounting head for electronic component-mounting apparatus |
US6224121B1 (en) * | 1999-06-18 | 2001-05-01 | Wilburn B. Laubach | Quick disconnect articulated chuck apparatus and method |
US6451623B1 (en) * | 2000-09-22 | 2002-09-17 | Oki Electric Industry Co, Ltd. | Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device |
-
2001
- 2001-02-22 US US10/239,344 patent/US20030205030A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4915770A (en) * | 1987-05-09 | 1990-04-10 | Hitachi, Ltd. | Electronic chip supplying apparatus and method |
US5525023A (en) * | 1992-12-10 | 1996-06-11 | Matsushita Electric Industrial Co., Ltd. | Chip component supply apparatus |
US5498942A (en) * | 1993-05-31 | 1996-03-12 | Sony Corporation | Electronic packaging apparatus |
US5846621A (en) * | 1995-09-15 | 1998-12-08 | Minnesota Mining And Manufacturing Company | Component carrier tape having static dissipative properties |
US5852869A (en) * | 1995-09-22 | 1998-12-29 | Universal Instruments Corporation | Method and apparatus for supplying and placing components |
US6074158A (en) * | 1995-11-06 | 2000-06-13 | Advantest Corporation | IC transporting apparatus, IC posture altering apparatus and IC take-out apparatus |
US6101707A (en) * | 1998-03-03 | 2000-08-15 | Sanyo Electric Co., Ltd. | Mounting head for electronic component-mounting apparatus |
US6224121B1 (en) * | 1999-06-18 | 2001-05-01 | Wilburn B. Laubach | Quick disconnect articulated chuck apparatus and method |
US6451623B1 (en) * | 2000-09-22 | 2002-09-17 | Oki Electric Industry Co, Ltd. | Carrier reel, carriage method using the carrier reel, and method for manufacturing electronic device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180244414A1 (en) * | 2017-02-24 | 2018-08-30 | Taiyo Yuden Co., Ltd. | Taping apparatus |
US10683114B2 (en) * | 2017-02-24 | 2020-06-16 | Taiyo Yuden Co., Ltd. | Taping apparatus |
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Owner name: ROBOTIC VISION SYSTEMS, INC., MASSACHUSETTS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WEISS, MARTIN;REEL/FRAME:013583/0576 Effective date: 20010323 |
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Owner name: INTERNATIONAL PRODUCT TECHNOLOGY, INC., WISCONSIN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ROBOTIC VISION SYSTEMS, INC.;REEL/FRAME:015000/0153 Effective date: 20031020 |
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Owner name: ROBOTIC VISION SYSTEMS, INC., NEW HAMPSHIRE Free format text: SECURITY AGREEMENT;ASSIGNOR:INTERNATIONAL PRODUCT TECHNOLOGY, INC.;REEL/FRAME:015027/0885 Effective date: 20031020 |
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