DE69020696D1 - Verfahren zum Montieren eines elektrischen Bauteils auf einer Leiterplatte. - Google Patents
Verfahren zum Montieren eines elektrischen Bauteils auf einer Leiterplatte.Info
- Publication number
- DE69020696D1 DE69020696D1 DE69020696T DE69020696T DE69020696D1 DE 69020696 D1 DE69020696 D1 DE 69020696D1 DE 69020696 T DE69020696 T DE 69020696T DE 69020696 T DE69020696 T DE 69020696T DE 69020696 D1 DE69020696 D1 DE 69020696D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting
- circuit board
- printed circuit
- electrical component
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Details Of Resistors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1309056A JPH03171792A (ja) | 1989-11-30 | 1989-11-30 | 回路基板のパッドへの半田層形成方法 |
JP30905789 | 1989-11-30 | ||
JP22262790 | 1990-08-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69020696D1 true DE69020696D1 (de) | 1995-08-10 |
DE69020696T2 DE69020696T2 (de) | 1996-01-25 |
Family
ID=27330688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69020696T Expired - Fee Related DE69020696T2 (de) | 1989-11-30 | 1990-11-29 | Verfahren zum Montieren eines elektrischen Bauteils auf einer Leiterplatte. |
Country Status (8)
Country | Link |
---|---|
US (1) | US5118029A (de) |
EP (1) | EP0430240B1 (de) |
KR (1) | KR0124924B1 (de) |
CN (1) | CN1052765A (de) |
BR (1) | BR9006101A (de) |
CA (1) | CA2030865C (de) |
DE (1) | DE69020696T2 (de) |
ES (1) | ES2077004T3 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5296649A (en) * | 1991-03-26 | 1994-03-22 | The Furukawa Electric Co., Ltd. | Solder-coated printed circuit board and method of manufacturing the same |
KR940023325A (ko) * | 1993-03-11 | 1994-10-22 | 토모마쯔 켕고 | 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판 |
EP0651600B1 (de) * | 1993-11-02 | 1999-08-11 | Koninklijke Philips Electronics N.V. | Verfahren zur Lotbeschichtung und Lötpaste dafür |
DE69326009T2 (de) * | 1993-11-02 | 2000-02-24 | Koninklijke Philips Electronics N.V., Eindhoven | Verfahren zur Lotbeschichtung und Lötpaste dafür |
KR100203997B1 (ko) * | 1993-12-06 | 1999-06-15 | 하세가와 요시히로 | 땜납석출용 조성물 및 이조성물을 사용한 장착법 |
US5447680A (en) * | 1994-03-21 | 1995-09-05 | Mcdonnell Douglas Corporation | Fiber-reinforced, titanium based composites and method of forming without depletion zones |
US5539153A (en) * | 1994-08-08 | 1996-07-23 | Hewlett-Packard Company | Method of bumping substrates by contained paste deposition |
US6826827B1 (en) * | 1994-12-29 | 2004-12-07 | Tessera, Inc. | Forming conductive posts by selective removal of conductive material |
JPH11514300A (ja) | 1995-10-06 | 1999-12-07 | ブラウン ユニバーシティ リサーチ ファウンデーション | はんだ付けの方法及び配合物 |
US5668058A (en) * | 1995-12-28 | 1997-09-16 | Nec Corporation | Method of producing a flip chip |
US6609652B2 (en) | 1997-05-27 | 2003-08-26 | Spheretek, Llc | Ball bumping substrates, particuarly wafers |
US7007833B2 (en) * | 1997-05-27 | 2006-03-07 | Mackay John | Forming solder balls on substrates |
US7654432B2 (en) | 1997-05-27 | 2010-02-02 | Wstp, Llc | Forming solder balls on substrates |
US7819301B2 (en) * | 1997-05-27 | 2010-10-26 | Wstp, Llc | Bumping electronic components using transfer substrates |
US7288471B2 (en) * | 1997-05-27 | 2007-10-30 | Mackay John | Bumping electronic components using transfer substrates |
US6293456B1 (en) | 1997-05-27 | 2001-09-25 | Spheretek, Llc | Methods for forming solder balls on substrates |
US7842599B2 (en) * | 1997-05-27 | 2010-11-30 | Wstp, Llc | Bumping electronic components using transfer substrates |
JPH11307565A (ja) * | 1998-04-24 | 1999-11-05 | Mitsubishi Electric Corp | 半導体装置の電極およびその製造方法ならびに半導体装置 |
JP3287328B2 (ja) * | 1999-03-09 | 2002-06-04 | 日本電気株式会社 | 半導体装置及び半導体装置の製造方法 |
JP4142312B2 (ja) * | 2002-02-28 | 2008-09-03 | ハリマ化成株式会社 | 析出型はんだ組成物及びはんだ析出方法 |
US7182241B2 (en) * | 2002-08-09 | 2007-02-27 | Micron Technology, Inc. | Multi-functional solder and articles made therewith, such as microelectronic components |
US20040084206A1 (en) * | 2002-11-06 | 2004-05-06 | I-Chung Tung | Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method |
US7453157B2 (en) | 2004-06-25 | 2008-11-18 | Tessera, Inc. | Microelectronic packages and methods therefor |
GB2441265B (en) * | 2005-06-16 | 2012-01-11 | Imbera Electronics Oy | Method for manufacturing a circuit board structure, and a circuit board structure |
US20080150101A1 (en) * | 2006-12-20 | 2008-06-26 | Tessera, Inc. | Microelectronic packages having improved input/output connections and methods therefor |
KR20090007006A (ko) * | 2007-07-13 | 2009-01-16 | 삼성전자주식회사 | 액정 표시 장치 및 그의 제조 방법 |
JP5465942B2 (ja) * | 2009-07-16 | 2014-04-09 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
KR101055473B1 (ko) * | 2009-12-15 | 2011-08-08 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 |
US9137903B2 (en) | 2010-12-21 | 2015-09-15 | Tessera, Inc. | Semiconductor chip assembly and method for making same |
DE102017206932A1 (de) * | 2017-04-25 | 2018-10-25 | Siemens Aktiengesellschaft | Lotformteil zum Erzeugen einer Diffusionslötverbindung und Verfahren zum Erzeugen eines Lotformteils |
CN113068324A (zh) * | 2021-03-15 | 2021-07-02 | 德中(天津)技术发展股份有限公司 | 一种用重熔焊料作为可焊性保护层的制造电路板方法 |
CN113438822A (zh) * | 2021-07-02 | 2021-09-24 | 德中(天津)技术发展股份有限公司 | 一种综合优化裸板表面处理及元件贴装的电路板制造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3978378A (en) * | 1973-02-12 | 1976-08-31 | The Dow Chemical Company | Articles having electroconductive components of highly electroconductive resinous compositions |
JPS50112231A (de) * | 1974-02-15 | 1975-09-03 | ||
US4132341A (en) * | 1977-01-31 | 1979-01-02 | Zenith Radio Corporation | Hybrid circuit connector assembly |
US4490283A (en) * | 1981-02-27 | 1984-12-25 | Mitech Corporation | Flame retardant thermoplastic molding compounds of high electroconductivity |
US4728023A (en) * | 1986-01-22 | 1988-03-01 | Mcdonnell Douglas Corporation | Rosin-free solder composition |
JPS62227593A (ja) * | 1986-03-28 | 1987-10-06 | Harima Chem Inc | 有機半田 |
IN168174B (de) * | 1986-04-22 | 1991-02-16 | Siemens Ag | |
JPS63113073A (ja) * | 1986-05-19 | 1988-05-18 | Harima Chem Inc | 電子回路部材を接着し且つその端子間に選択的に電気的導通を得る方法 |
JP2604593B2 (ja) * | 1986-05-19 | 1997-04-30 | ハリマ化成 株式会社 | 金属表面に半田被膜を形成する方法 |
DE3716640C2 (de) * | 1986-05-19 | 1996-03-28 | Harima Chemicals Inc | Verfahren zur Herstellung eines Metallüberzuges auf einem Substratmetall |
US4661173A (en) * | 1986-07-25 | 1987-04-28 | Mcdonnell Douglas Corporation | Alloy-enriched solder cream |
GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
US4752027A (en) * | 1987-02-20 | 1988-06-21 | Hewlett-Packard Company | Method and apparatus for solder bumping of printed circuit boards |
JPH0747233B2 (ja) * | 1987-09-14 | 1995-05-24 | 古河電気工業株式会社 | 半田析出用組成物および半田析出方法 |
-
1990
- 1990-11-26 CA CA002030865A patent/CA2030865C/en not_active Expired - Fee Related
- 1990-11-26 US US07/618,031 patent/US5118029A/en not_active Expired - Fee Related
- 1990-11-29 EP EP90122853A patent/EP0430240B1/de not_active Expired - Lifetime
- 1990-11-29 ES ES90122853T patent/ES2077004T3/es not_active Expired - Lifetime
- 1990-11-29 DE DE69020696T patent/DE69020696T2/de not_active Expired - Fee Related
- 1990-11-30 BR BR909006101A patent/BR9006101A/pt not_active IP Right Cessation
- 1990-11-30 KR KR1019900019662A patent/KR0124924B1/ko not_active IP Right Cessation
- 1990-11-30 CN CN90110296A patent/CN1052765A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0430240A2 (de) | 1991-06-05 |
BR9006101A (pt) | 1991-09-24 |
EP0430240B1 (de) | 1995-07-05 |
ES2077004T3 (es) | 1995-11-16 |
EP0430240A3 (en) | 1992-07-01 |
CA2030865C (en) | 1993-01-12 |
CN1052765A (zh) | 1991-07-03 |
KR910011110A (ko) | 1991-06-29 |
CA2030865A1 (en) | 1991-05-31 |
DE69020696T2 (de) | 1996-01-25 |
US5118029A (en) | 1992-06-02 |
KR0124924B1 (ko) | 1997-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |