DE69404082D1 - Verfahren zum Montieren eines elektronischen Bauelements auf einer flexiblen Leiterplatte - Google Patents
Verfahren zum Montieren eines elektronischen Bauelements auf einer flexiblen LeiterplatteInfo
- Publication number
- DE69404082D1 DE69404082D1 DE69404082T DE69404082T DE69404082D1 DE 69404082 D1 DE69404082 D1 DE 69404082D1 DE 69404082 T DE69404082 T DE 69404082T DE 69404082 T DE69404082 T DE 69404082T DE 69404082 D1 DE69404082 D1 DE 69404082D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting
- circuit board
- printed circuit
- electronic component
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/114—Pad being close to via, but not surrounding the via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5100911A JPH06310839A (ja) | 1993-04-27 | 1993-04-27 | フレキシブル印刷回路板への電子部品の実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69404082D1 true DE69404082D1 (de) | 1997-08-14 |
DE69404082T2 DE69404082T2 (de) | 1997-10-30 |
Family
ID=14286529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69404082T Expired - Fee Related DE69404082T2 (de) | 1993-04-27 | 1994-04-25 | Verfahren zum Montieren eines elektronischen Bauelements auf einer flexiblen Leiterplatte |
Country Status (4)
Country | Link |
---|---|
US (2) | US5461775A (de) |
EP (1) | EP0622980B1 (de) |
JP (1) | JPH06310839A (de) |
DE (1) | DE69404082T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08335761A (ja) * | 1995-06-06 | 1996-12-17 | Matsushita Electric Ind Co Ltd | 電子部品の配線基板への装着方法およびこれを用いた照光式スイッチユニット |
US5758575A (en) * | 1995-06-07 | 1998-06-02 | Bemis Company Inc. | Apparatus for printing an electrical circuit component with print cells in liquid communication |
CA2224236A1 (en) * | 1995-10-07 | 1997-04-17 | Img Group Limited | An electrical circuit component formed of a conductive liquid printed directly onto a substrate |
JPH1027952A (ja) | 1996-07-09 | 1998-01-27 | Sharp Corp | プリント配線板及びその製造方法 |
EP0824301A3 (de) * | 1996-08-09 | 1999-08-11 | Hitachi, Ltd. | Gedruckte Schaltungsplatte, Chipkarte, und Verfahren zu deren Herstellung |
JPH1056099A (ja) | 1996-08-12 | 1998-02-24 | Shinko Electric Ind Co Ltd | 多層回路基板およびその製造方法 |
US7714235B1 (en) * | 1997-05-06 | 2010-05-11 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
US6024702A (en) * | 1997-09-03 | 2000-02-15 | Pmt Corporation | Implantable electrode manufactured with flexible printed circuit |
JP3435062B2 (ja) * | 1997-10-03 | 2003-08-11 | 矢崎総業株式会社 | シールド電線の接続構造及び接続方法並びに接続に用いられる超音波ホーン及び接続に用いる接地電線 |
JP4301661B2 (ja) * | 1999-11-12 | 2009-07-22 | 富士通マイクロエレクトロニクス株式会社 | ボールグリッドアレイ構造のデバイスに使用されるコンタクトフィルム及びデバイス実装構造体 |
EP1397946A1 (de) | 2001-04-02 | 2004-03-17 | Nashua Corporation | Schaltungselemente mit einer eingebetteten leiterbahn und verfahren zur herstellung |
EP1383364A3 (de) * | 2002-05-23 | 2006-01-04 | Nashua Corporation | Schaltungselemente mit tintenaufnehmender Beschichtung und einer Leiterbahn und Verfahren zu deren Herstellung |
DE10354118A1 (de) * | 2003-11-19 | 2005-06-02 | Ruwel Ag | Verfahren zur Herstellung von Leiterplatten und Leiterplatte |
US7317577B2 (en) * | 2004-05-14 | 2008-01-08 | Eastman Kodak Company | Methods for producing a black matrix on a lenticular lens |
DE102006004320A1 (de) * | 2006-01-31 | 2007-08-09 | Häusermann GmbH | Leiterplatte mit funktionalen Elementen und selektiv gefüllten und thermisch leitfähigen Durchsteigelöchern sowie Herstellverfahren und Anwendung |
KR20090078819A (ko) * | 2006-10-10 | 2009-07-20 | 티아이알 테크놀로지 엘피 | 인쇄 회로 기판, 인쇄 회로 기판의 준비 방법, 및 인쇄 회로 기판의 조립 방법 |
US8748909B2 (en) * | 2006-11-03 | 2014-06-10 | Apple Inc. | Display system |
KR101110865B1 (ko) * | 2007-11-27 | 2012-02-15 | 엘이디라이텍(주) | 램프유닛 |
TWI370714B (en) * | 2008-01-09 | 2012-08-11 | Ind Tech Res Inst | Circuit structure and menufacturing method thereof |
KR101518457B1 (ko) * | 2008-06-12 | 2015-05-12 | 서울반도체 주식회사 | 발광 다이오드 실장용 연성인쇄회로기판 |
JP2010061923A (ja) * | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | 電気接続方法及び電気接続された接続構造体 |
FR2961057B1 (fr) * | 2010-06-03 | 2016-01-29 | Nief Plastic | Procede de montage de composants electroniques ou electriques sur un support de circuit conducteur d'electricite |
JP6243764B2 (ja) | 2014-03-18 | 2017-12-06 | デクセリアルズ株式会社 | 可撓性実装モジュール体の製造方法 |
JP7511180B2 (ja) | 2020-07-27 | 2024-07-05 | パナソニックIpマネジメント株式会社 | 実装方法およびそれにより形成される実装構造体 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3699010A (en) * | 1971-03-22 | 1972-10-17 | North American Rockwell | Beam lead plating process |
US4631820A (en) * | 1984-08-23 | 1986-12-30 | Canon Kabushiki Kaisha | Mounting assembly and mounting method for an electronic component |
US4774634A (en) * | 1986-01-21 | 1988-09-27 | Key Tronic Corporation | Printed circuit board assembly |
JPS62169434A (ja) * | 1986-01-22 | 1987-07-25 | Sharp Corp | Lsi搭載方式 |
US4855796A (en) * | 1986-06-06 | 1989-08-08 | Hughes Aircraft Company | Beam lead mixer diode |
DE3785720T2 (de) * | 1986-09-25 | 1993-08-12 | Toshiba Kawasaki Kk | Verfahren zum herstellen eines filmtraegers. |
JPS63158711A (ja) * | 1986-12-22 | 1988-07-01 | 帝国通信工業株式会社 | フレキシブルプリント基板の端子構造 |
US4835847A (en) * | 1988-04-20 | 1989-06-06 | International Business Machines Corp. | Method and apparatus for mounting a flexible film electronic device carrier on a substrate |
US4900878A (en) * | 1988-10-03 | 1990-02-13 | Hughes Aircraft Company | Circuit terminations having improved electrical and structural integrity |
US4944087A (en) * | 1988-10-05 | 1990-07-31 | Rogers Corporation | Method of making a curved plastic body with circuit pattern |
JP2594644B2 (ja) * | 1989-05-01 | 1997-03-26 | 日本黒鉛工業株式会社 | ピン付きヒートシールコネクタの製造方法 |
JP2866873B2 (ja) * | 1989-07-19 | 1999-03-08 | 大四郎 藤島 | 食品の処理方法 |
JP2501702Y2 (ja) * | 1989-09-28 | 1996-06-19 | ブラザー工業株式会社 | 回路基板 |
US5049978A (en) * | 1990-09-10 | 1991-09-17 | General Electric Company | Conductively enclosed hybrid integrated circuit assembly using a silicon substrate |
US5291375A (en) * | 1991-09-30 | 1994-03-01 | Kabushiki Kaisha Toshiba | Printed circuit board and electric device configured to facilitate bonding |
JP3042132B2 (ja) * | 1992-02-10 | 2000-05-15 | 松下電器産業株式会社 | 回路基板への電気部品実装方法 |
-
1993
- 1993-04-27 JP JP5100911A patent/JPH06310839A/ja active Pending
-
1994
- 1994-04-19 US US08/230,033 patent/US5461775A/en not_active Expired - Lifetime
- 1994-04-25 EP EP94106414A patent/EP0622980B1/de not_active Expired - Lifetime
- 1994-04-25 DE DE69404082T patent/DE69404082T2/de not_active Expired - Fee Related
-
1995
- 1995-04-18 US US08/423,907 patent/US5569886A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69404082T2 (de) | 1997-10-30 |
EP0622980B1 (de) | 1997-07-09 |
JPH06310839A (ja) | 1994-11-04 |
US5569886A (en) | 1996-10-29 |
US5461775A (en) | 1995-10-31 |
EP0622980A1 (de) | 1994-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: JUNG, SCHIRDEWAHN, GRUENBERG, SCHNEIDER PATENTANWAELTE |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: ADVOTEC. PATENT- UND RECHTSANWAELTE, 80538 MUENCHE |
|
8339 | Ceased/non-payment of the annual fee |