DE69419300D1 - Leiterplatte und Randverbinder dafür, und Verfahren zur Vorbereitung eines Leiterplattenrandes - Google Patents

Leiterplatte und Randverbinder dafür, und Verfahren zur Vorbereitung eines Leiterplattenrandes

Info

Publication number
DE69419300D1
DE69419300D1 DE69419300T DE69419300T DE69419300D1 DE 69419300 D1 DE69419300 D1 DE 69419300D1 DE 69419300 T DE69419300 T DE 69419300T DE 69419300 T DE69419300 T DE 69419300T DE 69419300 D1 DE69419300 D1 DE 69419300D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
edge
preparing
connector therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69419300T
Other languages
English (en)
Other versions
DE69419300T2 (de
Inventor
Iosif Korsunsky
Dimitry G Grabbe
Robert Carl Klotz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Publication of DE69419300D1 publication Critical patent/DE69419300D1/de
Application granted granted Critical
Publication of DE69419300T2 publication Critical patent/DE69419300T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE69419300T 1993-10-29 1994-09-13 Leiterplatte und Randverbinder dafür, und Verfahren zur Vorbereitung eines Leiterplattenrandes Expired - Lifetime DE69419300T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/145,017 US5383095A (en) 1993-10-29 1993-10-29 Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge

Publications (2)

Publication Number Publication Date
DE69419300D1 true DE69419300D1 (de) 1999-08-05
DE69419300T2 DE69419300T2 (de) 2000-05-25

Family

ID=22511229

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69419300T Expired - Lifetime DE69419300T2 (de) 1993-10-29 1994-09-13 Leiterplatte und Randverbinder dafür, und Verfahren zur Vorbereitung eines Leiterplattenrandes

Country Status (9)

Country Link
US (1) US5383095A (de)
EP (1) EP0651468B1 (de)
JP (1) JP2807181B2 (de)
CN (1) CN1067178C (de)
BR (1) BR9404210A (de)
DE (1) DE69419300T2 (de)
HU (1) HU217389B (de)
MY (1) MY111786A (de)
PL (1) PL305412A1 (de)

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US6140977A (en) * 1999-08-02 2000-10-31 Visteon Global Technologies, Inc. Method for attaching an antenna to a circuit board and article produced thereby
US6360435B1 (en) * 1999-08-25 2002-03-26 Qualcomm Incorporated Bidirectional interface tool for PWB development
DE10010979A1 (de) * 2000-03-07 2001-09-13 Bosch Gmbh Robert Elektrische Schaltung und Substrat hierzu
TW535465B (en) * 2000-05-15 2003-06-01 Hitachi Aic Inc Electronic component device and method of manufacturing the same
US6409520B1 (en) * 2001-07-31 2002-06-25 Agilent Technologies, Inc. Structure and method for interconnection of printed circuit boards
US6801436B2 (en) * 2001-09-28 2004-10-05 Intel Corporation Extension mechanism and method for assembling overhanging components
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US7188408B2 (en) * 2002-12-31 2007-03-13 Hon Hai Precision Ind. Co., Ltd. Method of making a straddle mount connector
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CN101472386B (zh) * 2007-12-26 2012-03-28 鸿富锦精密工业（深圳）有限公司 印刷电路板
JP4489133B2 (ja) * 2008-09-10 2010-06-23 株式会社東芝 プリント配線板、電子機器
KR101019368B1 (ko) * 2008-10-21 2011-03-07 권용태 반도체 메모리 모듈 및 그와 결합 되는 전자 부품 소켓
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FR2982117B1 (fr) * 2011-10-28 2014-09-05 Continental Automotive France Procede de realisation d'une unite electronique, unite electronique realisee par la mise en oeuvre de ce procede, et circuit imprime integre dans cette unite electronique
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
TWI449271B (zh) * 2011-11-16 2014-08-11 Dawning Leading Technology Inc 具有連接介面的電子裝置、其電路基板以及其製造方法
US8834181B2 (en) 2012-04-18 2014-09-16 Fci Americas Technology Llc Straddle mount electrical connector with fusible elements
US9912083B2 (en) * 2015-07-21 2018-03-06 Sentinel Connector Systems, Inc. High speed plug
DE102015120788A1 (de) * 2015-11-30 2017-06-01 Phoenix Contact Gmbh & Co. Kg Schleifenbrücke
US10535938B2 (en) * 2017-03-10 2020-01-14 Tag-Connet, Llc Side-edge connector system providing electrical connection between devices in a manner which minimizes dedicated connection space
CN108811369B (zh) * 2018-06-29 2021-09-24 中国电子科技集团公司第二十九研究所 一种印制电路板边缘盲槽加工方法
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Also Published As

Publication number Publication date
PL305412A1 (en) 1995-05-02
BR9404210A (pt) 1995-06-27
JP2807181B2 (ja) 1998-10-08
US5383095A (en) 1995-01-17
HU9402499D0 (en) 1994-10-28
CN1108011A (zh) 1995-09-06
EP0651468B1 (de) 1999-06-30
JPH07170044A (ja) 1995-07-04
HU217389B (hu) 2000-01-28
HUT68512A (en) 1995-06-28
EP0651468A1 (de) 1995-05-03
CN1067178C (zh) 2001-06-13
DE69419300T2 (de) 2000-05-25
MY111786A (en) 2000-12-30

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Legal Events

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