DE69514895T2 - Verfahren zur Montage eines Anschlussstiftes in einer flexiblen Leiterplatte - Google Patents

Verfahren zur Montage eines Anschlussstiftes in einer flexiblen Leiterplatte

Info

Publication number
DE69514895T2
DE69514895T2 DE69514895T DE69514895T DE69514895T2 DE 69514895 T2 DE69514895 T2 DE 69514895T2 DE 69514895 T DE69514895 T DE 69514895T DE 69514895 T DE69514895 T DE 69514895T DE 69514895 T2 DE69514895 T2 DE 69514895T2
Authority
DE
Germany
Prior art keywords
mounting
circuit board
printed circuit
flexible printed
connector pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69514895T
Other languages
English (en)
Other versions
DE69514895D1 (de
Inventor
Haruo Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6291530A external-priority patent/JP2921417B2/ja
Priority claimed from JP6291531A external-priority patent/JP2806279B2/ja
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Application granted granted Critical
Publication of DE69514895D1 publication Critical patent/DE69514895D1/de
Publication of DE69514895T2 publication Critical patent/DE69514895T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69514895T 1994-11-25 1995-11-03 Verfahren zur Montage eines Anschlussstiftes in einer flexiblen Leiterplatte Expired - Fee Related DE69514895T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6291530A JP2921417B2 (ja) 1994-11-25 1994-11-25 フレキシブルプリント回路基板の半田付方法
JP6291531A JP2806279B2 (ja) 1994-11-25 1994-11-25 フレキシブルプリント回路基板の半田付方法

Publications (2)

Publication Number Publication Date
DE69514895D1 DE69514895D1 (de) 2000-03-09
DE69514895T2 true DE69514895T2 (de) 2000-06-15

Family

ID=26558585

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69514895T Expired - Fee Related DE69514895T2 (de) 1994-11-25 1995-11-03 Verfahren zur Montage eines Anschlussstiftes in einer flexiblen Leiterplatte

Country Status (3)

Country Link
US (1) US5692297A (de)
EP (1) EP0714226B1 (de)
DE (1) DE69514895T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY118036A (en) * 1996-01-22 2004-08-30 Lintec Corp Wafer dicing/bonding sheet and process for producing semiconductor device
US6007920A (en) * 1996-01-22 1999-12-28 Texas Instruments Japan, Ltd. Wafer dicing/bonding sheet and process for producing semiconductor device
DE19809138A1 (de) * 1998-03-04 1999-09-30 Philips Patentverwaltung Leiterplatte mit SMD-Bauelementen
JP2000163797A (ja) * 1998-11-27 2000-06-16 Mitsumi Electric Co Ltd 部品固定法
US6116492A (en) * 1999-04-28 2000-09-12 Behavior Tech Computer Corporation Jig for facilitating surface-soldering pin to laminated metal sheet
US6223973B1 (en) * 1999-11-16 2001-05-01 Visteon Global Technologies, Inc. Apparatus and method for connecting printed circuit boards through soldered lap joints
US6327155B1 (en) * 1999-12-16 2001-12-04 Nortel Networks Limited Method and apparatus for preventing flamespread in an equipment assembly
US6357864B1 (en) 1999-12-16 2002-03-19 Lexmark International, Inc. Tab circuit design for simplified use with hot bar soldering technique
US20040222271A1 (en) * 2003-05-06 2004-11-11 Visteon Global Technologies, Inc. Method and pallet assembly for reflow soldering of interconnections between printed circuits having low-temperature substrates
US20080241563A1 (en) * 2007-03-30 2008-10-02 Khamvong Thammasouk Polymer substrate for electronic components
CN101420817A (zh) * 2007-10-22 2009-04-29 鸿富锦精密工业（深圳）有限公司 具有改良焊盘的电路板
US20100319754A1 (en) * 2009-02-19 2010-12-23 Sajjad Basha S Photovoltaic module configuration
DE102015207891A1 (de) * 2014-07-07 2016-01-07 Conti Temic Microelectronic Gmbh Elektronische Komponente und Verfahren zur Herstellung einer elektronischen Komponente
JP6274196B2 (ja) * 2015-12-16 2018-02-07 株式会社オートネットワーク技術研究所 電気接続箱
US11452198B2 (en) 2019-07-25 2022-09-20 Borgwarner, Inc. Thermally insulated printed circuit board

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2833480C3 (de) * 1978-07-31 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Schaltungsplatte für die elektrische Nachrichtentechnik
US4216350A (en) * 1978-11-01 1980-08-05 Burroughs Corporation Multiple solder pre-form with non-fusible web
FR2632805B1 (fr) * 1988-06-08 1990-08-24 Bull Sa Plaque de masquage de carte de circuits imprimes equipee et son procede de fabrication
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US5092035A (en) * 1990-09-10 1992-03-03 Codex Corporation Method of making printed circuit board assembly
JPH0732042B2 (ja) * 1990-10-11 1995-04-10 富士通株式会社 スルーホール接続形電子デバイスとその実装方法
JP2664585B2 (ja) 1992-02-06 1997-10-15 住友電気工業株式会社 フレキシブル・プリンテッド・サーキット・ボードの半田付け方法
JPH05338370A (ja) * 1992-06-10 1993-12-21 Dainippon Screen Mfg Co Ltd スクリーン印刷用メタルマスク版
FR2693339B1 (fr) * 1992-07-01 1994-10-07 Marelli Autronica Procédé de liaison et de fixation de composants à broches sur un circuit imprimé souple, et circuit ainsi obtenu.

Also Published As

Publication number Publication date
EP0714226B1 (de) 2000-02-02
US5692297A (en) 1997-12-02
EP0714226A1 (de) 1996-05-29
DE69514895D1 (de) 2000-03-09

Similar Documents

Publication Publication Date Title
DE69419300D1 (de) Leiterplatte und Randverbinder dafür, und Verfahren zur Vorbereitung eines Leiterplattenrandes
DE60109262D1 (de) Anschlussleiter und Verfahren zur Montierung eines Anschlussleiters auf einer Leiterplatte
DE69737375D1 (de) Verfahren zur Befestigung eines elektronischen Bauteils auf einer Leiterplatte und System zum Ausführen des Verfahrens
DE69615038D1 (de) Verfahren zur oberflächenmontage eines kühlkörpers auf einer leiterplatte
DE69516042D1 (de) Winkelverbinder für Leiterplatten
DE69308241D1 (de) Verfahren zur Herstellung eines leitenden Endbereichs einer flexiblen Leiterplatte
DE69514895T2 (de) Verfahren zur Montage eines Anschlussstiftes in einer flexiblen Leiterplatte
DE69632516D1 (de) Verfahren und Vorrichtung zum Bestücken einer Leiterplatte mit elektronischen Bauteilen
DE69842092D1 (de) Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte
DE69323340D1 (de) Randverbinder für eine Leiterplatte
DE69732174D1 (de) Zweiteilige elektromagnetische Abschirmvorrichtung zur Befestigung auf einer Leiterplatte
DE69209921T2 (de) Randverbinder für Leiterkarten
DE69400551D1 (de) Verbinderanordnung für gedruckte Leiterplatte
DE59509074D1 (de) Koaxialer Winkelverbinder zur Montage auf einer Leiterplatte
DE69404082D1 (de) Verfahren zum Montieren eines elektronischen Bauelements auf einer flexiblen Leiterplatte
DE69318522T2 (de) Vorrichtung für die Befestigung eines Steckverbinders auf einer Leiterplatte
DE69812483D1 (de) Verfahren zum Herstellen eines Verbinders für eine Leiterplatte
DE69936159D1 (de) Verfahren zur Abstützung einer Leiterplatte
DE69810389T2 (de) Verfahren und Vorrichtung zur Befestigung von elektronischen Bauelementen auf einer Leiterplatte
DE69920629D1 (de) Verfahren zur Herstellung einer biegsamen Schaltungsplatte
DE69825079D1 (de) Einrichtung zur durchführung eines magnetkreises auf einer leiterplatte
DE69905229D1 (de) Verfahren zum Löten eines D-pak Bauteiles auf einer gedruckten Schaltungsplatte
DE69616419D1 (de) Verfahren und Apparat zur Anbringung eines elektrischen Verbinders auf einer gedruckten Leiterplatte
DE69925893D1 (de) Verfahren zur Herstellung einer doppelseitigen flexiblen Leiterplatte
DE69430707D1 (de) Elektrischer Verbinder zur Oberflächenmontage auf eine Leiterplatte

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee