DE69514895T2 - Verfahren zur Montage eines Anschlussstiftes in einer flexiblen Leiterplatte - Google Patents
Verfahren zur Montage eines Anschlussstiftes in einer flexiblen LeiterplatteInfo
- Publication number
- DE69514895T2 DE69514895T2 DE69514895T DE69514895T DE69514895T2 DE 69514895 T2 DE69514895 T2 DE 69514895T2 DE 69514895 T DE69514895 T DE 69514895T DE 69514895 T DE69514895 T DE 69514895T DE 69514895 T2 DE69514895 T2 DE 69514895T2
- Authority
- DE
- Germany
- Prior art keywords
- mounting
- circuit board
- printed circuit
- flexible printed
- connector pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
- Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6291531A JP2806279B2 (ja) | 1994-11-25 | 1994-11-25 | フレキシブルプリント回路基板の半田付方法 |
JP6291530A JP2921417B2 (ja) | 1994-11-25 | 1994-11-25 | フレキシブルプリント回路基板の半田付方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69514895D1 DE69514895D1 (de) | 2000-03-09 |
DE69514895T2 true DE69514895T2 (de) | 2000-06-15 |
Family
ID=26558585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69514895T Expired - Fee Related DE69514895T2 (de) | 1994-11-25 | 1995-11-03 | Verfahren zur Montage eines Anschlussstiftes in einer flexiblen Leiterplatte |
Country Status (3)
Country | Link |
---|---|
US (1) | US5692297A (de) |
EP (1) | EP0714226B1 (de) |
DE (1) | DE69514895T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY118036A (en) * | 1996-01-22 | 2004-08-30 | Lintec Corp | Wafer dicing/bonding sheet and process for producing semiconductor device |
US6007920A (en) * | 1996-01-22 | 1999-12-28 | Texas Instruments Japan, Ltd. | Wafer dicing/bonding sheet and process for producing semiconductor device |
DE19809138A1 (de) * | 1998-03-04 | 1999-09-30 | Philips Patentverwaltung | Leiterplatte mit SMD-Bauelementen |
JP2000163797A (ja) * | 1998-11-27 | 2000-06-16 | Mitsumi Electric Co Ltd | 部品固定法 |
US6116492A (en) * | 1999-04-28 | 2000-09-12 | Behavior Tech Computer Corporation | Jig for facilitating surface-soldering pin to laminated metal sheet |
US6223973B1 (en) * | 1999-11-16 | 2001-05-01 | Visteon Global Technologies, Inc. | Apparatus and method for connecting printed circuit boards through soldered lap joints |
US6327155B1 (en) * | 1999-12-16 | 2001-12-04 | Nortel Networks Limited | Method and apparatus for preventing flamespread in an equipment assembly |
US6357864B1 (en) | 1999-12-16 | 2002-03-19 | Lexmark International, Inc. | Tab circuit design for simplified use with hot bar soldering technique |
US20040222271A1 (en) * | 2003-05-06 | 2004-11-11 | Visteon Global Technologies, Inc. | Method and pallet assembly for reflow soldering of interconnections between printed circuits having low-temperature substrates |
US20080241563A1 (en) * | 2007-03-30 | 2008-10-02 | Khamvong Thammasouk | Polymer substrate for electronic components |
CN101420817A (zh) * | 2007-10-22 | 2009-04-29 | 鸿富锦精密工业(深圳)有限公司 | 具有改良焊盘的电路板 |
US20100319754A1 (en) * | 2009-02-19 | 2010-12-23 | Sajjad Basha S | Photovoltaic module configuration |
DE102015207891A1 (de) * | 2014-07-07 | 2016-01-07 | Conti Temic Microelectronic Gmbh | Elektronische Komponente und Verfahren zur Herstellung einer elektronischen Komponente |
JP6274196B2 (ja) * | 2015-12-16 | 2018-02-07 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
US11452198B2 (en) | 2019-07-25 | 2022-09-20 | Borgwarner, Inc. | Thermally insulated printed circuit board |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2833480C3 (de) * | 1978-07-31 | 1982-02-18 | Siemens AG, 1000 Berlin und 8000 München | Schaltungsplatte für die elektrische Nachrichtentechnik |
US4216350A (en) * | 1978-11-01 | 1980-08-05 | Burroughs Corporation | Multiple solder pre-form with non-fusible web |
FR2632805B1 (fr) * | 1988-06-08 | 1990-08-24 | Bull Sa | Plaque de masquage de carte de circuits imprimes equipee et son procede de fabrication |
US4842184A (en) * | 1988-06-23 | 1989-06-27 | Ltv Aerospace & Defense Company | Method and apparatus for applying solder preforms |
US5092035A (en) * | 1990-09-10 | 1992-03-03 | Codex Corporation | Method of making printed circuit board assembly |
JPH0732042B2 (ja) * | 1990-10-11 | 1995-04-10 | 富士通株式会社 | スルーホール接続形電子デバイスとその実装方法 |
JP2664585B2 (ja) | 1992-02-06 | 1997-10-15 | 住友電気工業株式会社 | フレキシブル・プリンテッド・サーキット・ボードの半田付け方法 |
JPH05338370A (ja) * | 1992-06-10 | 1993-12-21 | Dainippon Screen Mfg Co Ltd | スクリーン印刷用メタルマスク版 |
FR2693339B1 (fr) * | 1992-07-01 | 1994-10-07 | Marelli Autronica | Procédé de liaison et de fixation de composants à broches sur un circuit imprimé souple, et circuit ainsi obtenu. |
-
1995
- 1995-10-31 US US08/551,174 patent/US5692297A/en not_active Expired - Lifetime
- 1995-11-03 DE DE69514895T patent/DE69514895T2/de not_active Expired - Fee Related
- 1995-11-03 EP EP95117349A patent/EP0714226B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0714226B1 (de) | 2000-02-02 |
DE69514895D1 (de) | 2000-03-09 |
EP0714226A1 (de) | 1996-05-29 |
US5692297A (en) | 1997-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |