DE69201274T2 - Integrierschaltungsgerät mit verbesserten Pfosten für oberflächenmontiertes Gehäuse. - Google Patents

Integrierschaltungsgerät mit verbesserten Pfosten für oberflächenmontiertes Gehäuse.

Info

Publication number
DE69201274T2
DE69201274T2 DE69201274T DE69201274T DE69201274T2 DE 69201274 T2 DE69201274 T2 DE 69201274T2 DE 69201274 T DE69201274 T DE 69201274T DE 69201274 T DE69201274 T DE 69201274T DE 69201274 T2 DE69201274 T2 DE 69201274T2
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit device
mounted housing
posts
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69201274T
Other languages
English (en)
Other versions
DE69201274D1 (de
Inventor
Robert N Mclellan
Anthony M Chiu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69201274D1 publication Critical patent/DE69201274D1/de
Application granted granted Critical
Publication of DE69201274T2 publication Critical patent/DE69201274T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10696—Single-in-line [SIL] package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DE69201274T 1991-06-28 1992-06-26 Integrierschaltungsgerät mit verbesserten Pfosten für oberflächenmontiertes Gehäuse. Expired - Fee Related DE69201274T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/723,108 US5204287A (en) 1991-06-28 1991-06-28 Integrated circuit device having improved post for surface-mount package

Publications (2)

Publication Number Publication Date
DE69201274D1 DE69201274D1 (de) 1995-03-09
DE69201274T2 true DE69201274T2 (de) 1995-06-08

Family

ID=24904878

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69201274T Expired - Fee Related DE69201274T2 (de) 1991-06-28 1992-06-26 Integrierschaltungsgerät mit verbesserten Pfosten für oberflächenmontiertes Gehäuse.

Country Status (5)

Country Link
US (2) US5204287A (de)
EP (1) EP0520490B1 (de)
JP (1) JP3157611B2 (de)
KR (1) KR100261877B1 (de)
DE (1) DE69201274T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5204287A (en) * 1991-06-28 1993-04-20 Texas Instruments Incorporated Integrated circuit device having improved post for surface-mount package
JP3035403B2 (ja) * 1992-03-09 2000-04-24 富士通株式会社 半導体装置
US5413970A (en) * 1993-10-08 1995-05-09 Texas Instruments Incorporated Process for manufacturing a semiconductor package having two rows of interdigitated leads
US5647124A (en) * 1994-04-25 1997-07-15 Texas Instruments Incorporated Method of attachment of a semiconductor slotted lead to a substrate
US5610437A (en) * 1994-05-25 1997-03-11 Texas Instruments Incorporated Lead frame for integrated circuits
US5429992A (en) * 1994-05-25 1995-07-04 Texas Instruments Incorporated Lead frame structure for IC devices with strengthened encapsulation adhesion
US5689137A (en) * 1995-10-16 1997-11-18 Hestia Technologies, Inc. Method for transfer molding standard electronic packages and apparatus formed thereby
KR100192180B1 (ko) * 1996-03-06 1999-06-15 김영환 멀티-레이어 버텀 리드 패키지
JP3577848B2 (ja) * 1996-09-30 2004-10-20 ソニー株式会社 半導体装置の外形カット方法及びそれに用いる半導体製造装置
US5789813A (en) * 1996-09-30 1998-08-04 Lsi Logic Corporation Ball grid array package with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom
KR100268460B1 (ko) * 1996-12-07 2000-10-16 윤종용 표면실장용 반도체ic의 위치결정장치
US6048744A (en) 1997-09-15 2000-04-11 Micron Technology, Inc. Integrated circuit package alignment feature
KR19990055292A (ko) * 1997-12-27 1999-07-15 김영환 적층형 칩 스케일 패키지
US5940277A (en) * 1997-12-31 1999-08-17 Micron Technology, Inc. Semiconductor device including combed bond pad opening, assemblies and methods
US6803656B2 (en) * 1997-12-31 2004-10-12 Micron Technology, Inc. Semiconductor device including combed bond pad opening
US6991960B2 (en) * 2001-08-30 2006-01-31 Micron Technology, Inc. Method of semiconductor device package alignment and method of testing
US20040084211A1 (en) * 2002-10-30 2004-05-06 Sensonix, Inc. Z-axis packaging for electronic device and method for making same
US20070126445A1 (en) * 2005-11-30 2007-06-07 Micron Technology, Inc. Integrated circuit package testing devices and methods of making and using same

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE32714C (de) * FR. KNAPPE in Dessau Sägenschränkmaschine
US3987344A (en) * 1975-03-10 1976-10-19 Motorola, Inc. Plug-in module for electronic device having self-contained heat sink
US4138711A (en) * 1977-09-29 1979-02-06 Allen-Bradley Company Static control device for printed circuit package
JPS58209147A (ja) * 1982-05-31 1983-12-06 Toshiba Corp 樹脂封止型半導体装置
US4727513A (en) * 1983-09-02 1988-02-23 Wang Laboratories, Inc. Signal in-line memory module
US4656605A (en) * 1983-09-02 1987-04-07 Wang Laboratories, Inc. Single in-line memory module
US4575172A (en) * 1984-04-06 1986-03-11 Molex Incorporated Low insertion force electrical connector with stress controlled contacts
US4665614A (en) * 1985-04-04 1987-05-19 Molex Incorporated Method of making a multiconductor electrical connector arrangement
US4850892A (en) * 1985-12-16 1989-07-25 Wang Laboratories, Inc. Connecting apparatus for electrically connecting memory modules to a printed circuit board
US4908586A (en) * 1987-09-30 1990-03-13 Amp Incorporated Compact encapsulated filter assembly for printed circuit boards and method of manufacture thereof
JP2504510B2 (ja) * 1988-03-09 1996-06-05 ローム株式会社 電子部品
US4975763A (en) * 1988-03-14 1990-12-04 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
JPH02133985A (ja) * 1988-11-15 1990-05-23 Toshiba Corp パッケージ型ハイブリッド素子
US4951176A (en) * 1988-12-30 1990-08-21 Robert Bosch Gmbh Holder system for free-standing electronic components, especially hybrid modules
US4969827A (en) * 1989-06-12 1990-11-13 Motorola, Inc. Modular interconnecting electronic circuit blocks
US5200362A (en) * 1989-09-06 1993-04-06 Motorola, Inc. Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
US4967262A (en) * 1989-11-06 1990-10-30 Micron Technology, Inc. Gull-wing zig-zag inline lead package having end-of-package anchoring pins
JPH04243155A (ja) * 1991-01-17 1992-08-31 Nec Corp 混成集積回路装置
US5204287A (en) * 1991-06-28 1993-04-20 Texas Instruments Incorporated Integrated circuit device having improved post for surface-mount package
JPH05183029A (ja) * 1991-12-27 1993-07-23 Texas Instr Japan Ltd ソケット
KR950014123B1 (ko) * 1992-09-08 1995-11-21 삼성전자주식회사 반도체 패키지

Also Published As

Publication number Publication date
JP3157611B2 (ja) 2001-04-16
EP0520490A1 (de) 1992-12-30
EP0520490B1 (de) 1995-01-25
DE69201274D1 (de) 1995-03-09
KR930001385A (ko) 1993-01-16
US5555488A (en) 1996-09-10
US5204287A (en) 1993-04-20
KR100261877B1 (ko) 2000-07-15
JPH06204289A (ja) 1994-07-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee