IT220657Z2 - Dispositivo elettronico comprendente un circuito integrato montato su una basetta isolante. - Google Patents

Dispositivo elettronico comprendente un circuito integrato montato su una basetta isolante.

Info

Publication number
IT220657Z2
IT220657Z2 IT5334890U IT5334890U IT220657Z2 IT 220657 Z2 IT220657 Z2 IT 220657Z2 IT 5334890 U IT5334890 U IT 5334890U IT 5334890 U IT5334890 U IT 5334890U IT 220657 Z2 IT220657 Z2 IT 220657Z2
Authority
IT
Italy
Prior art keywords
electronic device
integrated circuit
device including
insulating base
circuit mounted
Prior art date
Application number
IT5334890U
Other languages
English (en)
Other versions
IT9053348U1 (it
IT9053348V0 (it
Inventor
Walter Bertoldo
Original Assignee
Marelli Autronica
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marelli Autronica filed Critical Marelli Autronica
Priority to IT5334890U priority Critical patent/IT220657Z2/it
Publication of IT9053348V0 publication Critical patent/IT9053348V0/it
Priority to DE1991613741 priority patent/DE69113741T2/de
Priority to EP19910830446 priority patent/EP0484286B1/en
Priority to ES91830446T priority patent/ES2078498T3/es
Publication of IT9053348U1 publication Critical patent/IT9053348U1/it
Application granted granted Critical
Publication of IT220657Z2 publication Critical patent/IT220657Z2/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
IT5334890U 1990-10-30 1990-10-30 Dispositivo elettronico comprendente un circuito integrato montato su una basetta isolante. IT220657Z2 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT5334890U IT220657Z2 (it) 1990-10-30 1990-10-30 Dispositivo elettronico comprendente un circuito integrato montato su una basetta isolante.
DE1991613741 DE69113741T2 (de) 1990-10-30 1991-10-22 Eine elektronische Vorrichtung mit einer auf einem isolierten Aufbau sitzenden integrierten Schaltung.
EP19910830446 EP0484286B1 (en) 1990-10-30 1991-10-22 An electronic device including an integrated circuit mounted on an insulating base
ES91830446T ES2078498T3 (es) 1990-10-30 1991-10-22 Un dispositivo electronico incluyendo un circuito integrado montado sobre una base aislante.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT5334890U IT220657Z2 (it) 1990-10-30 1990-10-30 Dispositivo elettronico comprendente un circuito integrato montato su una basetta isolante.

Publications (3)

Publication Number Publication Date
IT9053348V0 IT9053348V0 (it) 1990-10-30
IT9053348U1 IT9053348U1 (it) 1992-04-30
IT220657Z2 true IT220657Z2 (it) 1993-10-08

Family

ID=11282020

Family Applications (1)

Application Number Title Priority Date Filing Date
IT5334890U IT220657Z2 (it) 1990-10-30 1990-10-30 Dispositivo elettronico comprendente un circuito integrato montato su una basetta isolante.

Country Status (4)

Country Link
EP (1) EP0484286B1 (it)
DE (1) DE69113741T2 (it)
ES (1) ES2078498T3 (it)
IT (1) IT220657Z2 (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007014351A1 (de) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Elektrische Anordnung mit mindestens einem elektrischen Kontaktstift und einer hiermit kontaktierten Stromschienenanordnung
DE102015212177A1 (de) * 2015-06-30 2017-01-05 Osram Gmbh Schaltungsträger für eine elektronische Schaltung und Verfahren zum Herstellen eines derartigen Schaltungsträgers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4226492A (en) * 1979-07-30 1980-10-07 Bell Telephone Laboratories, Incorporated Electrical interconnection apparatus
US4677526A (en) * 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
WO1988006395A1 (en) * 1987-02-19 1988-08-25 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby

Also Published As

Publication number Publication date
DE69113741D1 (de) 1995-11-16
IT9053348U1 (it) 1992-04-30
EP0484286A3 (en) 1992-09-30
IT9053348V0 (it) 1990-10-30
EP0484286A2 (en) 1992-05-06
DE69113741T2 (de) 1996-03-21
ES2078498T3 (es) 1995-12-16
EP0484286B1 (en) 1995-10-11

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Legal Events

Date Code Title Description
0001 Granted