AU1298988A - Process for manufacturing plastic pin grid arrays and the product produced thereby - Google Patents
Process for manufacturing plastic pin grid arrays and the product produced therebyInfo
- Publication number
- AU1298988A AU1298988A AU12989/88A AU1298988A AU1298988A AU 1298988 A AU1298988 A AU 1298988A AU 12989/88 A AU12989/88 A AU 12989/88A AU 1298988 A AU1298988 A AU 1298988A AU 1298988 A AU1298988 A AU 1298988A
- Authority
- AU
- Australia
- Prior art keywords
- product produced
- pin grid
- grid arrays
- plastic pin
- manufacturing plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000003491 array Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/18—Construction of rack or frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
- H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1661487A | 1987-02-19 | 1987-02-19 | |
US016614 | 1987-02-19 | ||
US052327 | 1987-05-21 | ||
US07/052,327 US4816426A (en) | 1987-02-19 | 1987-05-21 | Process for manufacturing plastic pin grid arrays and the product produced thereby |
US07/145,977 US4965227A (en) | 1987-05-21 | 1988-02-02 | Process for manufacturing plastic pin grid arrays and the product produced thereby |
US145977 | 1988-02-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1298988A true AU1298988A (en) | 1988-09-14 |
Family
ID=27360610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU12989/88A Abandoned AU1298988A (en) | 1987-02-19 | 1988-02-10 | Process for manufacturing plastic pin grid arrays and the product produced thereby |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0382714A1 (en) |
JP (1) | JPH02502322A (en) |
KR (1) | KR960010011B1 (en) |
AU (1) | AU1298988A (en) |
MX (1) | MX166066B (en) |
MY (1) | MY103516A (en) |
WO (1) | WO1988006395A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03152999A (en) * | 1989-11-09 | 1991-06-28 | Nec Corp | Hybrid integrated circuit |
US5293072A (en) * | 1990-06-25 | 1994-03-08 | Fujitsu Limited | Semiconductor device having spherical terminals attached to the lead frame embedded within the package body |
JPH0462865A (en) * | 1990-06-25 | 1992-02-27 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
IT220657Z2 (en) * | 1990-10-30 | 1993-10-08 | Marelli Autronica | ELECTRONIC DEVICE INCLUDING AN INTEGRATED CIRCUIT MOUNTED ON AN INSULATING BASE. |
US5877554A (en) * | 1997-11-03 | 1999-03-02 | Advanced Interconnections Corp. | Converter socket terminal |
US6256202B1 (en) | 2000-02-18 | 2001-07-03 | Advanced Interconnections Corporation | Integrated circuit intercoupling component with heat sink |
CN101500963B (en) | 2006-08-08 | 2013-11-27 | 首尔大学校产学协力团 | Mixed powder including solid-solution powder and sintered body using mixed powder, mixed cermet powder including solid-solution powder and cermet using mixed cermet powder, and fabrication met |
CN107598324B (en) * | 2017-10-23 | 2024-02-20 | 中国电子科技集团公司第四十三研究所 | Packaged product preheating device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IN148328B (en) * | 1977-04-18 | 1981-01-17 | Rca Corp | |
JPS5471572A (en) * | 1977-11-18 | 1979-06-08 | Fujitsu Ltd | Semiconductor device |
US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
US4582556A (en) * | 1982-11-22 | 1986-04-15 | Olin Corporation | Adhesion primers for encapsulating epoxies |
US4521469A (en) * | 1982-11-22 | 1985-06-04 | Olin Corporation | Casing for electronic components |
US4525422A (en) * | 1982-11-22 | 1985-06-25 | Olin Corporation | Adhesion primers for encapsulating epoxies |
US4552422A (en) * | 1983-03-14 | 1985-11-12 | Amp Incorporated | Modular receptacle pin grid array |
USRE32540E (en) * | 1983-03-22 | 1987-11-10 | Advanced Interconnections, Inc. | Terminal positioning method and construction |
US4677526A (en) * | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
US4593342A (en) * | 1984-11-15 | 1986-06-03 | General Electric Company | Heat sink assembly for protecting pins of electronic devices |
US4549651A (en) * | 1984-12-21 | 1985-10-29 | Alemanni James C | Carrier for pin grid array |
US4618739A (en) * | 1985-05-20 | 1986-10-21 | General Electric Company | Plastic chip carrier package |
US4729010A (en) * | 1985-08-05 | 1988-03-01 | Hitachi, Ltd. | Integrated circuit package with low-thermal expansion lead pieces |
-
1988
- 1988-02-10 KR KR1019880701166A patent/KR960010011B1/en not_active IP Right Cessation
- 1988-02-10 AU AU12989/88A patent/AU1298988A/en not_active Abandoned
- 1988-02-10 EP EP19880902047 patent/EP0382714A1/en not_active Withdrawn
- 1988-02-10 WO PCT/US1988/000384 patent/WO1988006395A1/en not_active Application Discontinuation
- 1988-02-10 JP JP88501929A patent/JPH02502322A/en active Pending
- 1988-02-16 MY MYPI88000164A patent/MY103516A/en unknown
- 1988-02-17 MX MX010446A patent/MX166066B/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO1988006395A1 (en) | 1988-08-25 |
MY103516A (en) | 1993-07-31 |
KR890701001A (en) | 1989-04-28 |
KR960010011B1 (en) | 1996-07-25 |
EP0382714A4 (en) | 1990-06-05 |
JPH02502322A (en) | 1990-07-26 |
EP0382714A1 (en) | 1990-08-22 |
MX166066B (en) | 1992-12-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU5330390A (en) | G-tab manufacturing process and the product produced thereby | |
AU4939790A (en) | Polypropylene wax and process for the production thereof | |
AU2119988A (en) | Composite molded articles and process for producing same | |
EP0304293A3 (en) | Copolyester and process for producing the same | |
EP0303295A3 (en) | Hard candy and process for producing the same | |
AU4919490A (en) | Process for producing thermoplastic articles | |
AU624696B2 (en) | Dulled stretched molding and process for producing the same | |
AU1316688A (en) | Edible plastic product and process for the preparation thereof | |
AU3007989A (en) | Highly-refractive plastic lens and process for making the lens | |
EP0433906A3 (en) | Thermoplastic resin and process for producing the same | |
AU3618589A (en) | Hard transparent resins and process for the production thereof | |
AU4503589A (en) | Thermoplastic molding composition and process for preparing the same | |
AU590560B2 (en) | Thermoplastic compositions, a process for their manufacture and articles obtained therefrom | |
AU6152890A (en) | Thermoplastic web and process for manufacturing same | |
AU1298988A (en) | Process for manufacturing plastic pin grid arrays and the product produced thereby | |
EP0282271A3 (en) | Decorative article and process for making the same | |
EP0351905A3 (en) | Solid bodies production process | |
AU590484B2 (en) | Decorative article and process for making | |
AU6843190A (en) | A thermoplastic polyurethane and a process for the preparation thereof | |
HUT59686A (en) | Ester-cleavaging process in the cephalosporing production | |
GB8921328D0 (en) | Molding and process for its production | |
IL89516A0 (en) | Process for manufacturing superconducting materials and products obtained thereby | |
AU3111989A (en) | Sialosyl glyceride and process for producing the same | |
AU1531388A (en) | Electrically conductive plastic moldings and process for producing the same | |
ZA902392B (en) | Opacified molded product and process for producing the same |