IT9068055A0 - Dispositivo di schermatura ed isolamento di una scheda di circuito elettronico. - Google Patents

Dispositivo di schermatura ed isolamento di una scheda di circuito elettronico.

Info

Publication number
IT9068055A0
IT9068055A0 IT9068055A IT6805590A IT9068055A0 IT 9068055 A0 IT9068055 A0 IT 9068055A0 IT 9068055 A IT9068055 A IT 9068055A IT 6805590 A IT6805590 A IT 6805590A IT 9068055 A0 IT9068055 A0 IT 9068055A0
Authority
IT
Italy
Prior art keywords
isolating
shielding
circuit board
electronic circuit
electronic
Prior art date
Application number
IT9068055A
Other languages
English (en)
Other versions
IT9068055A1 (it
IT1241370B (it
Inventor
Claude Brisac
Rodolphe Pichereau
Original Assignee
Telemecanique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telemecanique filed Critical Telemecanique
Publication of IT9068055A0 publication Critical patent/IT9068055A0/it
Publication of IT9068055A1 publication Critical patent/IT9068055A1/it
Application granted granted Critical
Publication of IT1241370B publication Critical patent/IT1241370B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
IT68055A 1989-12-21 1990-12-21 Dispositivo di schermatura ed isolamento di una scheda di circuito elettronico. IT1241370B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8916986A FR2656494B1 (fr) 1989-12-21 1989-12-21 Dispositif de blindage et d'isolation d'une carte de circuit electronique.

Publications (3)

Publication Number Publication Date
IT9068055A0 true IT9068055A0 (it) 1990-12-21
IT9068055A1 IT9068055A1 (it) 1991-06-22
IT1241370B IT1241370B (it) 1994-01-10

Family

ID=9388817

Family Applications (1)

Application Number Title Priority Date Filing Date
IT68055A IT1241370B (it) 1989-12-21 1990-12-21 Dispositivo di schermatura ed isolamento di una scheda di circuito elettronico.

Country Status (5)

Country Link
DE (1) DE4041071A1 (it)
FR (1) FR2656494B1 (it)
GB (1) GB2254193B (it)
IT (1) IT1241370B (it)
SG (1) SG30552G (it)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05189084A (ja) * 1992-01-10 1993-07-30 Toshiba Corp 小形電子機器
US5519585A (en) * 1993-04-12 1996-05-21 Dell Usa, L.P. Sandwiched insulative/conductive layer EMI shield structure for printed circuit board
WO1995027341A1 (en) * 1994-04-04 1995-10-12 Motorola Inc. Shielded circuit assembly and method for forming same
US5597979A (en) * 1995-05-12 1997-01-28 Schlegel Corporation EMI shielding having flexible condustive sheet and I/O Gasket
FR2737068B1 (fr) * 1995-07-18 1997-10-03 Alcatel Mobile Comm France Appareil de communication avec protection electrostatique
FR2753335B1 (fr) * 1996-09-11 1998-11-27 Siemens Automotive Sa Dispositif de blindage d'un circuit electronique
US5867371A (en) * 1997-09-29 1999-02-02 Ericsson Inc. Cover member for sealed circuit board assembly
DE10142655A1 (de) * 2001-08-31 2003-04-03 Epcos Ag Bauelementanordnung
JP4096605B2 (ja) * 2002-04-23 2008-06-04 日本電気株式会社 半導体装置および半導体装置のシールド形成方法
DE10247676A1 (de) * 2002-10-12 2004-07-15 Hella Kg Hueck & Co. Elektrisches oder elektronisches Gerät mit einer Leiterplatte
JP4690908B2 (ja) * 2006-02-22 2011-06-01 ポリマテック株式会社 コネクタシート及び携帯型電子機器
JP6358405B2 (ja) * 2016-07-08 2018-07-18 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
JP2018060991A (ja) * 2016-09-28 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
TWI669991B (zh) * 2018-01-11 2019-08-21 和碩聯合科技股份有限公司 具靜電放電保護機制的電路板及具有此電路板的電子裝置
JP2021086985A (ja) * 2019-11-29 2021-06-03 日立Astemo株式会社 電子制御装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3895267A (en) * 1974-03-11 1975-07-15 Analogic Corp Electronic circuit module with printed circuit board and grounding means
US4218578A (en) * 1978-08-04 1980-08-19 Burr-Brown Research Corp. RF Shield for an electronic component

Also Published As

Publication number Publication date
FR2656494B1 (fr) 1992-04-30
DE4041071A1 (de) 1991-06-27
GB2254193B (en) 1994-11-30
FR2656494A1 (fr) 1991-06-28
IT9068055A1 (it) 1991-06-22
GB2254193A (en) 1992-09-30
GB9106487D0 (en) 1991-05-15
IT1241370B (it) 1994-01-10
SG30552G (en) 1995-09-18

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19961231