IT1241370B - Dispositivo di schermatura ed isolamento di una scheda di circuito elettronico. - Google Patents
Dispositivo di schermatura ed isolamento di una scheda di circuito elettronico.Info
- Publication number
- IT1241370B IT1241370B IT68055A IT6805590A IT1241370B IT 1241370 B IT1241370 B IT 1241370B IT 68055 A IT68055 A IT 68055A IT 6805590 A IT6805590 A IT 6805590A IT 1241370 B IT1241370 B IT 1241370B
- Authority
- IT
- Italy
- Prior art keywords
- screening
- insulation
- circuit board
- electronic circuit
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8916986A FR2656494B1 (fr) | 1989-12-21 | 1989-12-21 | Dispositif de blindage et d'isolation d'une carte de circuit electronique. |
Publications (3)
Publication Number | Publication Date |
---|---|
IT9068055A0 IT9068055A0 (it) | 1990-12-21 |
IT9068055A1 IT9068055A1 (it) | 1991-06-22 |
IT1241370B true IT1241370B (it) | 1994-01-10 |
Family
ID=9388817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT68055A IT1241370B (it) | 1989-12-21 | 1990-12-21 | Dispositivo di schermatura ed isolamento di una scheda di circuito elettronico. |
Country Status (5)
Country | Link |
---|---|
DE (1) | DE4041071A1 (it) |
FR (1) | FR2656494B1 (it) |
GB (1) | GB2254193B (it) |
IT (1) | IT1241370B (it) |
SG (1) | SG30552G (it) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05189084A (ja) * | 1992-01-10 | 1993-07-30 | Toshiba Corp | 小形電子機器 |
US5519585A (en) * | 1993-04-12 | 1996-05-21 | Dell Usa, L.P. | Sandwiched insulative/conductive layer EMI shield structure for printed circuit board |
WO1995027341A1 (en) * | 1994-04-04 | 1995-10-12 | Motorola Inc. | Shielded circuit assembly and method for forming same |
US5597979A (en) * | 1995-05-12 | 1997-01-28 | Schlegel Corporation | EMI shielding having flexible condustive sheet and I/O Gasket |
FR2737068B1 (fr) * | 1995-07-18 | 1997-10-03 | Alcatel Mobile Comm France | Appareil de communication avec protection electrostatique |
FR2753335B1 (fr) * | 1996-09-11 | 1998-11-27 | Siemens Automotive Sa | Dispositif de blindage d'un circuit electronique |
US5867371A (en) * | 1997-09-29 | 1999-02-02 | Ericsson Inc. | Cover member for sealed circuit board assembly |
DE10142655A1 (de) * | 2001-08-31 | 2003-04-03 | Epcos Ag | Bauelementanordnung |
JP4096605B2 (ja) | 2002-04-23 | 2008-06-04 | 日本電気株式会社 | 半導体装置および半導体装置のシールド形成方法 |
DE10247676A1 (de) * | 2002-10-12 | 2004-07-15 | Hella Kg Hueck & Co. | Elektrisches oder elektronisches Gerät mit einer Leiterplatte |
JP4690908B2 (ja) * | 2006-02-22 | 2011-06-01 | ポリマテック株式会社 | コネクタシート及び携帯型電子機器 |
WO2018008657A1 (ja) * | 2016-07-08 | 2018-01-11 | 住友ベークライト株式会社 | 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板 |
JP2018060991A (ja) * | 2016-09-28 | 2018-04-12 | 住友ベークライト株式会社 | 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板 |
TWI669991B (zh) * | 2018-01-11 | 2019-08-21 | 和碩聯合科技股份有限公司 | 具靜電放電保護機制的電路板及具有此電路板的電子裝置 |
JP2021086985A (ja) * | 2019-11-29 | 2021-06-03 | 日立Astemo株式会社 | 電子制御装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3895267A (en) * | 1974-03-11 | 1975-07-15 | Analogic Corp | Electronic circuit module with printed circuit board and grounding means |
US4218578A (en) * | 1978-08-04 | 1980-08-19 | Burr-Brown Research Corp. | RF Shield for an electronic component |
-
1989
- 1989-12-21 FR FR8916986A patent/FR2656494B1/fr not_active Expired - Lifetime
-
1990
- 1990-12-20 DE DE4041071A patent/DE4041071A1/de not_active Withdrawn
- 1990-12-21 IT IT68055A patent/IT1241370B/it active IP Right Grant
-
1991
- 1991-03-27 SG SG1995903902A patent/SG30552G/en unknown
- 1991-03-27 GB GB9106487A patent/GB2254193B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE4041071A1 (de) | 1991-06-27 |
GB9106487D0 (en) | 1991-05-15 |
GB2254193B (en) | 1994-11-30 |
FR2656494A1 (fr) | 1991-06-28 |
FR2656494B1 (fr) | 1992-04-30 |
IT9068055A1 (it) | 1991-06-22 |
IT9068055A0 (it) | 1990-12-21 |
GB2254193A (en) | 1992-09-30 |
SG30552G (en) | 1995-09-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19961231 |