BR8903107A - Capacitor multiplaca e arranjo de componentes eletronicos - Google Patents

Capacitor multiplaca e arranjo de componentes eletronicos

Info

Publication number
BR8903107A
BR8903107A BR898903107A BR8903107A BR8903107A BR 8903107 A BR8903107 A BR 8903107A BR 898903107 A BR898903107 A BR 898903107A BR 8903107 A BR8903107 A BR 8903107A BR 8903107 A BR8903107 A BR 8903107A
Authority
BR
Brazil
Prior art keywords
electronic component
component arrangement
multiple capacitor
capacitor
arrangement
Prior art date
Application number
BR898903107A
Other languages
English (en)
Inventor
Allen Joseph Arnold
Michael Eric Bariether
Shin-Wu Chiang
Hormazdyar Minocher Dalal
Robert Anderson Miller
Frank Alfred Montegari
James Michael Oberschmidt
David Tjeng-Ming Shen
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of BR8903107A publication Critical patent/BR8903107A/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
BR898903107A 1988-06-27 1989-06-26 Capacitor multiplaca e arranjo de componentes eletronicos BR8903107A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/212,361 US4831494A (en) 1988-06-27 1988-06-27 Multilayer capacitor

Publications (1)

Publication Number Publication Date
BR8903107A true BR8903107A (pt) 1990-02-06

Family

ID=22790683

Family Applications (1)

Application Number Title Priority Date Filing Date
BR898903107A BR8903107A (pt) 1988-06-27 1989-06-26 Capacitor multiplaca e arranjo de componentes eletronicos

Country Status (7)

Country Link
US (1) US4831494A (pt)
EP (1) EP0351343B1 (pt)
JP (1) JP2657953B2 (pt)
BR (1) BR8903107A (pt)
CA (1) CA1290414C (pt)
DE (1) DE68907658T2 (pt)
ES (1) ES2044199T3 (pt)

Families Citing this family (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036426A (en) * 1990-02-22 1991-07-30 Board Of Regents, The University Of Texas System Method and apparatus for tuning and matching an NMR coil
US5430605A (en) * 1992-08-04 1995-07-04 Murata Erie North America, Inc. Composite multilayer capacitive device and method for fabricating the same
US5367430A (en) * 1992-10-21 1994-11-22 Presidio Components, Inc. Monolithic multiple capacitor
KR960004092B1 (ko) * 1993-03-17 1996-03-26 금성일렉트론주식회사 반도체 소자의 범프 형성방법
US5369545A (en) * 1993-06-30 1994-11-29 Intel Corporation De-coupling capacitor on the top of the silicon die by eutectic flip bonding
US5616980A (en) * 1993-07-09 1997-04-01 Nanomotion Ltd. Ceramic motor
US5682076A (en) * 1993-08-03 1997-10-28 Nanomotion Ltd. Ceramic disc-drive actuator
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US5898562A (en) * 1997-05-09 1999-04-27 Avx Corporation Integrated dual frequency noise attenuator
US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
US6292350B1 (en) 1997-11-10 2001-09-18 Murata Manufacturing, Co., Ltd Multilayer capacitor
JP3514195B2 (ja) * 1999-12-27 2004-03-31 株式会社村田製作所 積層コンデンサ、配線基板、デカップリング回路および高周波回路
US6266228B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
US6266229B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
JP2991175B2 (ja) * 1997-11-10 1999-12-20 株式会社村田製作所 積層コンデンサ
US6549395B1 (en) 1997-11-14 2003-04-15 Murata Manufacturing Co., Ltd Multilayer capacitor
JP3336954B2 (ja) * 1998-05-21 2002-10-21 株式会社村田製作所 積層コンデンサ
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
JP3309813B2 (ja) * 1998-10-06 2002-07-29 株式会社村田製作所 積層コンデンサ
US6282079B1 (en) * 1998-11-30 2001-08-28 Kyocera Corporation Capacitor
US6212060B1 (en) * 1999-03-31 2001-04-03 Krypton Isolation, Inc. Multi-capacitor device
JP3548821B2 (ja) 1999-05-10 2004-07-28 株式会社村田製作所 積層コンデンサ、ならびにこれを用いた電子装置および高周波回路
JP3476127B2 (ja) 1999-05-10 2003-12-10 株式会社村田製作所 積層コンデンサ
US6104598A (en) * 1999-07-28 2000-08-15 Delaware Capital Formation, Inc. Free form capacitor
US6327134B1 (en) 1999-10-18 2001-12-04 Murata Manufacturing Co., Ltd. Multi-layer capacitor, wiring board, and high-frequency circuit
JP3489728B2 (ja) 1999-10-18 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板および高周波回路
US6292351B1 (en) * 1999-11-17 2001-09-18 Tdk Corporation Multilayer ceramic capacitor for three-dimensional mounting
JP3337018B2 (ja) 1999-11-19 2002-10-21 株式会社村田製作所 積層コンデンサ、配線基板、デカップリング回路および高周波回路
JP3489729B2 (ja) * 1999-11-19 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板、デカップリング回路および高周波回路
US6801422B2 (en) * 1999-12-28 2004-10-05 Intel Corporation High performance capacitor
US6441459B1 (en) 2000-01-28 2002-08-27 Tdk Corporation Multilayer electronic device and method for producing same
US6724611B1 (en) 2000-03-29 2004-04-20 Intel Corporation Multi-layer chip capacitor
JP4573956B2 (ja) * 2000-06-30 2010-11-04 京セラ株式会社 積層型電子部品およびその製法
JP2002057066A (ja) * 2000-08-10 2002-02-22 Taiyo Yuden Co Ltd チップアレイ及びその製造方法
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech Inc Wafersonde
EP1605478B1 (en) * 2000-12-28 2007-08-29 TDK Corporation Multilayer ceramic capacitor for three-dimensional mounting
US6477032B2 (en) * 2001-01-31 2002-11-05 Avx Corporation Low inductance chip with center via contact
US6459561B1 (en) * 2001-06-12 2002-10-01 Avx Corporation Low inductance grid array capacitor
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US6757152B2 (en) * 2001-09-05 2004-06-29 Avx Corporation Cascade capacitor
US7057878B2 (en) * 2002-04-12 2006-06-06 Avx Corporation Discrete component array
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
TWI260657B (en) 2002-04-15 2006-08-21 Avx Corp Plated terminations
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US6960366B2 (en) 2002-04-15 2005-11-01 Avx Corporation Plated terminations
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US6982863B2 (en) * 2002-04-15 2006-01-03 Avx Corporation Component formation via plating technology
WO2003107367A1 (ja) * 2002-06-18 2003-12-24 ティーディーケイ株式会社 固体電解コンデンサおよび固体電解コンデンサ内蔵基板ならびにそれらの製造方法
JP4208832B2 (ja) * 2002-06-18 2009-01-14 Tdk株式会社 固体電解コンデンサおよびその製造方法
AU2003244249A1 (en) * 2002-06-18 2003-12-31 Tdk Corporation Solid electrolytic capacitor and production method therefor
US6606237B1 (en) * 2002-06-27 2003-08-12 Murata Manufacturing Co., Ltd. Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
US7573698B2 (en) * 2002-10-03 2009-08-11 Avx Corporation Window via capacitors
US7016175B2 (en) * 2002-10-03 2006-03-21 Avx Corporation Window via capacitor
US6819543B2 (en) * 2002-12-31 2004-11-16 Intel Corporation Multilayer capacitor with multiple plates per layer
TW200503022A (en) * 2003-03-17 2005-01-16 Tdk Corp Capacitor element, solid electrolytic capacitor, process for producing the same, and combination of capacitor elements
GB2400493B (en) * 2003-04-08 2005-11-09 Avx Corp Plated terminations
US6950300B2 (en) * 2003-05-06 2005-09-27 Marvell World Trade Ltd. Ultra low inductance multi layer ceramic capacitor
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
JP4354227B2 (ja) 2003-07-23 2009-10-28 Tdk株式会社 固体電解コンデンサ
JP3897745B2 (ja) * 2003-08-29 2007-03-28 Tdk株式会社 積層コンデンサ及び積層コンデンサの実装構造
JP3942565B2 (ja) 2003-08-29 2007-07-11 Tdk株式会社 ノイズフィルタ
US7227739B2 (en) * 2003-09-26 2007-06-05 Tdk Corporation Solid electrolytic capacitor
JP4059181B2 (ja) * 2003-09-29 2008-03-12 株式会社村田製作所 多端子型積層セラミック電子部品の製造方法
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
JP4343652B2 (ja) * 2003-11-07 2009-10-14 Tdk株式会社 固体電解コンデンサ及び固体電解コンデンサデバイス
DE202004021093U1 (de) 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US6870728B1 (en) 2004-01-29 2005-03-22 Tdk Corporation Electrolytic capacitor
US7068490B2 (en) * 2004-04-16 2006-06-27 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
KR100691146B1 (ko) * 2004-12-24 2007-03-09 삼성전기주식회사 적층형 캐패시터 및 적층형 캐패시터가 내장된 인쇄회로기판
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7505239B2 (en) 2005-04-14 2009-03-17 Tdk Corporation Light emitting device
JP4146450B2 (ja) * 2005-04-19 2008-09-10 Tdk株式会社 発光装置
JP4146849B2 (ja) * 2005-04-14 2008-09-10 Tdk株式会社 発光装置
US7408763B2 (en) * 2005-07-19 2008-08-05 Apurba Roy Low inductance multilayer capacitor
JP4146858B2 (ja) * 2005-08-26 2008-09-10 Tdk株式会社 積層コンデンサ
US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7697262B2 (en) 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7724496B2 (en) * 2005-11-04 2010-05-25 Avx Corporation Multilayer vertically integrated array technology
US8169014B2 (en) 2006-01-09 2012-05-01 Taiwan Semiconductor Manufacturing Co., Ltd. Interdigitated capacitive structure for an integrated circuit
JP4462194B2 (ja) * 2006-01-17 2010-05-12 Tdk株式会社 積層型貫通コンデンサアレイ
US7292429B2 (en) * 2006-01-18 2007-11-06 Kemet Electronics Corporation Low inductance capacitor
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
JP4662368B2 (ja) * 2006-06-22 2011-03-30 Necトーキン株式会社 固体電解コンデンサの製造方法
DE102006054086A1 (de) * 2006-11-16 2008-05-29 Epcos Ag Vielschicht-Kondensator
US7961453B2 (en) * 2007-01-09 2011-06-14 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
US8238116B2 (en) 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
US8045319B2 (en) * 2007-06-13 2011-10-25 Avx Corporation Controlled ESR decoupling capacitor
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
JP5012432B2 (ja) * 2007-11-07 2012-08-29 Tdk株式会社 セラミック電子部品
US20090154056A1 (en) * 2007-12-17 2009-06-18 General Electric Company Low inductance capacitor and method of manufacturing same
JP2009295683A (ja) 2008-06-03 2009-12-17 Tdk Corp チップ型電子部品
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
TWI455012B (zh) * 2008-08-19 2014-10-01 Wistron Corp 顯示器分割畫面顯示方法及應用該方法之電子裝置
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
JP4998480B2 (ja) * 2009-01-07 2012-08-15 Tdk株式会社 セラミック電子部品
US20100188799A1 (en) * 2009-01-28 2010-07-29 Avx Corporation Controlled esr low inductance capacitor
US9675808B2 (en) 2011-09-27 2017-06-13 Medtronic, Inc. Battery and capacitor arrangement for an implantable medical device
US9093974B2 (en) 2012-09-05 2015-07-28 Avx Corporation Electromagnetic interference filter for implanted electronics
US20150021082A1 (en) 2013-07-17 2015-01-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same
KR101698167B1 (ko) * 2015-01-02 2017-01-19 삼화콘덴서공업주식회사 적층 세라믹 커패시터
US11636978B2 (en) * 2017-05-15 2023-04-25 KYOCERA AVX Components Corporation Multilayer capacitor and circuit board containing the same
JP2020526041A (ja) 2017-06-29 2020-08-27 エイブイエックス コーポレイション 表面実装積層結合コンデンサ、およびそれを含む回路板
MX2020007245A (es) 2017-10-23 2020-12-07 Kyocera Avx Components Corp Dispositivo electronico multicapas que mejora la conectividad y el metodo para lograrlo.

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303393A (en) * 1963-12-27 1967-02-07 Ibm Terminals for microminiaturized devices and methods of connecting same to circuit panels
US3398326A (en) * 1965-08-25 1968-08-20 Vitramon Inc Solid-state electrical component combining multiple capacitors with other kinds of impedance
US3448355A (en) * 1967-03-01 1969-06-03 Amp Inc Laminated electrical capacitor and methods for making
US3898541A (en) * 1973-12-17 1975-08-05 Vitramon Inc Capacitors and method of adjustment
US3921285A (en) * 1974-07-15 1975-11-25 Ibm Method for joining microminiature components to a carrying structure
US4349862A (en) * 1980-08-11 1982-09-14 International Business Machines Corporation Capacitive chip carrier and multilayer ceramic capacitors
FR2496970A1 (fr) * 1980-12-18 1982-06-25 Eurofarad Composant electronique multiple du type ceramique multi-couches avec sorties alternees et son procede de fabrication
FR2507379A1 (fr) * 1981-06-05 1982-12-10 Europ Composants Electron Bloc de condensateurs en serie et multiplicateur de tension utilisant un tel bloc de condensateurs
US4419714A (en) * 1982-04-02 1983-12-06 International Business Machines Corporation Low inductance ceramic capacitor and method for its making
US4458294A (en) * 1982-07-28 1984-07-03 Corning Glass Works Compliant termination for ceramic chip capacitors
US4430690A (en) * 1982-10-07 1984-02-07 International Business Machines Corporation Low inductance MLC capacitor with metal impregnation and solder bar contact
JPS6048230U (ja) * 1983-09-11 1985-04-04 株式会社村田製作所 積層コンデンサ
JPS60149125U (ja) * 1984-03-13 1985-10-03 株式会社村田製作所 積層コンデンサ
JPS6228743U (pt) * 1985-08-02 1987-02-21

Also Published As

Publication number Publication date
DE68907658T2 (de) 1994-02-17
EP0351343A1 (en) 1990-01-17
ES2044199T3 (es) 1994-01-01
US4831494A (en) 1989-05-16
CA1290414C (en) 1991-10-08
EP0351343B1 (en) 1993-07-21
JPH02256216A (ja) 1990-10-17
JP2657953B2 (ja) 1997-09-30
DE68907658D1 (de) 1993-08-26

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Legal Events

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FG Letter patent granted
B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 26/06/2004