KR930701839A - 피에조전기 부품장착 포일 및 그 제조방법 - Google Patents

피에조전기 부품장착 포일 및 그 제조방법

Info

Publication number
KR930701839A
KR930701839A KR1019930700475A KR930700475A KR930701839A KR 930701839 A KR930701839 A KR 930701839A KR 1019930700475 A KR1019930700475 A KR 1019930700475A KR 930700475 A KR930700475 A KR 930700475A KR 930701839 A KR930701839 A KR 930701839A
Authority
KR
South Korea
Prior art keywords
manufacturing
component mounting
piezoelectric component
mounting foil
foil
Prior art date
Application number
KR1019930700475A
Other languages
English (en)
Other versions
KR960008580B1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR930701839A publication Critical patent/KR930701839A/ko
Application granted granted Critical
Publication of KR960008580B1 publication Critical patent/KR960008580B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12375—All metal or with adjacent metals having member which crosses the plane of another member [e.g., T or X cross section, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/1241—Nonplanar uniform thickness or nonlinear uniform diameter [e.g., L-shape]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24008—Structurally defined web or sheet [e.g., overall dimension, etc.] including fastener for attaching to external surface
KR93700475A 1990-09-14 1993-02-19 Piezo electric component-mounting foil and foil-making method KR960008580B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58206790A 1990-09-14 1990-09-14
PCT/US1991/006668 WO1992005592A1 (en) 1990-09-14 1991-09-13 Piezoelectric component-mounting foil and foil-making method

Publications (2)

Publication Number Publication Date
KR930701839A true KR930701839A (ko) 1993-06-12
KR960008580B1 KR960008580B1 (en) 1996-06-28

Family

ID=24327698

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93700475A KR960008580B1 (en) 1990-09-14 1993-02-19 Piezo electric component-mounting foil and foil-making method

Country Status (6)

Country Link
US (1) US5353621A (ko)
EP (1) EP0551328A4 (ko)
JP (1) JPH06501141A (ko)
KR (1) KR960008580B1 (ko)
TW (1) TW394454U (ko)
WO (1) WO1992005592A1 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1007618A3 (nl) * 1993-10-13 1995-08-22 Philips Electronics Nv Flexibel bevestigingsorgaan alsmede object voorzien van een dergelijk bevestigingsorgaan, drager voorzien van een object en een dergelijk bevestigingsorgaan en verpakking voorzien van een aantal van dergelijke bevestigingsorganen.
US6308394B1 (en) * 1997-12-11 2001-10-30 Micron Technology, Inc. Method of mounting a motherboard to a chassis
US6728068B1 (en) 1999-05-07 2004-04-27 Seagate Technology Llc Head gimbal assembly interconnecting leads having improved robustness and lower stiffness
DE10139686B4 (de) 2000-10-05 2007-02-01 Eads Deutschland Gmbh Piezoelektrischer Dehnungsaktuator
DE10131621A1 (de) * 2001-06-29 2003-01-23 Epcos Ag Weiterkontaktierung für ein elektrisches Bauteil sowie piezoelektrisches Bauteil in Vielschichtbauweise
JP3815772B2 (ja) * 2001-08-20 2006-08-30 日本電波工業株式会社 水晶振動子
US7259499B2 (en) 2004-12-23 2007-08-21 Askew Andy R Piezoelectric bimorph actuator and method of manufacturing thereof
FR2884657B1 (fr) * 2005-04-13 2007-07-06 Micro Controle Sa Sa Systeme elastique de montage pour moteur lineaire piezo-electrique
US20090096326A1 (en) * 2005-08-31 2009-04-16 Nec Corporation Piezoelectric actuator, acoustic component, and electronic device
WO2008021374A2 (en) * 2006-08-15 2008-02-21 General Dynamics Advanced Information Systems, Inc Methods for two-dimensional autofocus in high resolution radar systems
JP4995527B2 (ja) * 2006-09-28 2012-08-08 日本電波工業株式会社 表面実装用の圧電発振器
US8196291B2 (en) * 2006-11-06 2012-06-12 General Dynamics Advanced Information Systems, Inc. Method for manufacturing leads
JPWO2009141970A1 (ja) * 2008-05-19 2011-09-29 株式会社村田製作所 振動装置
WO2010023801A1 (ja) * 2008-08-27 2010-03-04 株式会社村田製作所 振動装置
FR3018632B1 (fr) * 2014-03-13 2018-03-23 Hager Electro S.A. Dispositif piezoelectrique de generation de tension electrique
DE102016003988A1 (de) * 2015-04-10 2016-10-13 Marquardt Gmbh Baugruppe
DE202018102355U1 (de) * 2018-04-26 2018-06-04 Kyocera Display Europe Gmbh Haptische Rückwirkungsvorrichtung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2128420A (en) * 1936-06-12 1938-08-30 Bell Telephone Labor Inc Piezoelectric crystal mounting
US2954490A (en) * 1956-05-15 1960-09-27 Bell Telephone Labor Inc Crystal unit mounting
DE1157673B (de) * 1960-03-02 1963-11-21 Kristall Verarbeitung Neckarbi Zweiteiliges Keramikgehaeuse fuer einen Schwingquarz und Anordnungen zur Halterung eines Quarzes in einem derartigen Gehaeuse
DE2755116C2 (de) * 1977-12-10 1984-08-02 Standard Elektrik Lorenz Ag, 7000 Stuttgart Oszillator mit einem in einem Gehäuse dicht eingebauten Resonator
US4266157A (en) * 1979-05-18 1981-05-05 The United States Of America As Represented By The Secretary Of The Army Piezoelectric resonator assembly with thin molybdenum mounting clips
JPS60174312U (ja) * 1984-04-27 1985-11-19 京セラ株式会社 水晶発振器
FR2612021A1 (fr) * 1987-03-06 1988-09-09 Cepe Ressorts de suspension d'une lame vivrante piezoelectrique
US4827611A (en) * 1988-03-28 1989-05-09 Control Data Corporation Compliant S-leads for chip carriers

Also Published As

Publication number Publication date
EP0551328A4 (en) 1995-04-19
KR960008580B1 (en) 1996-06-28
US5353621A (en) 1994-10-11
WO1992005592A1 (en) 1992-04-02
TW394454U (en) 2000-06-11
JPH06501141A (ja) 1994-01-27
EP0551328A1 (en) 1993-07-21

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A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee