DE69314158T2 - Elektronisches bauelement und dessen herstellungsverfahren - Google Patents

Elektronisches bauelement und dessen herstellungsverfahren

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Publication number
DE69314158T2
DE69314158T2 DE69314158T DE69314158T DE69314158T2 DE 69314158 T2 DE69314158 T2 DE 69314158T2 DE 69314158 T DE69314158 T DE 69314158T DE 69314158 T DE69314158 T DE 69314158T DE 69314158 T2 DE69314158 T2 DE 69314158T2
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Germany
Prior art keywords
manufacturing
electronic component
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69314158T
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English (en)
Other versions
DE69314158D1 (de
Inventor
Roger Prost
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teledyne e2v Semiconductors SAS
Original Assignee
Thomson SCF Semiconducteurs Specifiques
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Application granted granted Critical
Publication of DE69314158D1 publication Critical patent/DE69314158D1/de
Publication of DE69314158T2 publication Critical patent/DE69314158T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
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    • H01L2924/013—Alloys
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    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/11—Device type
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
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    • H—ELECTRICITY
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
DE69314158T 1992-06-19 1993-06-16 Elektronisches bauelement und dessen herstellungsverfahren Expired - Fee Related DE69314158T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9207482A FR2692719A1 (fr) 1992-06-19 1992-06-19 Senseur pyroélectrique et procédé de fabrication.
PCT/FR1993/000586 WO1994000879A1 (fr) 1992-06-19 1993-06-16 Senseur pyroelectrique et procede de fabrication

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DE69314158D1 DE69314158D1 (de) 1997-10-30
DE69314158T2 true DE69314158T2 (de) 1998-01-15

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EP (1) EP0616724B1 (de)
JP (1) JP3241385B2 (de)
CA (1) CA2115659C (de)
DE (1) DE69314158T2 (de)
FR (1) FR2692719A1 (de)
WO (1) WO1994000879A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008012759B3 (de) * 2008-02-27 2009-06-10 Technische Universität Dresden Pyroelektrischer Detektor
DE102008021297A1 (de) * 2008-04-24 2009-11-19 Technische Universität Dresden Pyroelektrischer Infrarotsensor mit sehr geringer Mikrofonie

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2112471A1 (de) 2008-04-22 2009-10-28 Microcomponents AG Montagevorrichtung für elektronisches Bauteil
JP2012032233A (ja) * 2010-07-29 2012-02-16 Mitsubishi Materials Corp 赤外線センサ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61183957A (ja) * 1985-02-12 1986-08-16 Hitachi Ltd 固体撮像装置
DD244671A1 (de) * 1985-12-19 1987-04-08 Werk Fernsehelektronik Veb Flexible, hybridintegrierte schaltungsanordnung
JPS62190856A (ja) * 1986-02-18 1987-08-21 Matsushita Electronics Corp 半導体パツケ−ジ
US4715115A (en) * 1986-04-03 1987-12-29 Hewlett-Packard Company Package for water-scale semiconductor devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008012759B3 (de) * 2008-02-27 2009-06-10 Technische Universität Dresden Pyroelektrischer Detektor
DE102008021297A1 (de) * 2008-04-24 2009-11-19 Technische Universität Dresden Pyroelektrischer Infrarotsensor mit sehr geringer Mikrofonie
DE102008021297B4 (de) * 2008-04-24 2010-06-17 Dias Infraed Gmbh Pyroelektrischer Infrarotsensor mit sehr geringer Mikrofonie

Also Published As

Publication number Publication date
FR2692719A1 (fr) 1993-12-24
JPH06509912A (ja) 1994-11-02
JP3241385B2 (ja) 2001-12-25
CA2115659A1 (fr) 1994-01-06
EP0616724A1 (de) 1994-09-28
EP0616724B1 (de) 1997-09-24
CA2115659C (fr) 2003-08-12
WO1994000879A1 (fr) 1994-01-06
DE69314158D1 (de) 1997-10-30

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