GB2400493B - Plated terminations - Google Patents

Plated terminations

Info

Publication number
GB2400493B
GB2400493B GB0405993A GB0405993A GB2400493B GB 2400493 B GB2400493 B GB 2400493B GB 0405993 A GB0405993 A GB 0405993A GB 0405993 A GB0405993 A GB 0405993A GB 2400493 B GB2400493 B GB 2400493B
Authority
GB
United Kingdom
Prior art keywords
plurality
exposed
electronic components
component
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0405993A
Other versions
GB0405993D0 (en
GB2400493A (en
Inventor
Andrew Ritter
Ii Robert H Heistand
John L Galvagni
Sriram Dattaguru
Jeffrey A Horn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AVX Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US10/409,023 priority Critical patent/US7152291B2/en
Priority to US10/632,514 priority patent/US6960366B2/en
Application filed by AVX Corp filed Critical AVX Corp
Priority claimed from GB0425961A external-priority patent/GB2406714B/en
Publication of GB0405993D0 publication Critical patent/GB0405993D0/en
Publication of GB2400493A publication Critical patent/GB2400493A/en
Publication of GB2400493B publication Critical patent/GB2400493B/en
Application granted granted Critical
Application status is Expired - Fee Related legal-status Critical
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1605Process or apparatus coating on selected surface areas by masking
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008Thermistors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Abstract

A method of forming electroless plated terminations 78 for electronic components 74, the method comprises steps of: providing a plurality of electronic components, each component includes a plurality of ceramic substrate layers selectively interleaved with a plurality of internal electrode elements 52, 54, wherein selective portions of the internal electrodes are exposed at selected locations along the periphery of the electronic component; providing an electroless bath solution; and immersing said plurality of electronic components in the said bath solution for a predetermined time period such that termination material, such as copper or nickel, is deposited on the electronic component bridging the said exposed selected portions. Preferably the multilayer electronic component has at least one cover layer on the uppermost and bottommost surfaces of the interleaved layers, also known as the internal assembly, thus this structure now forming a monolithic component assembly. The said exposed portions may be tabs 68.
GB0405993A 2002-04-15 2004-03-17 Plated terminations Expired - Fee Related GB2400493B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/409,023 US7152291B2 (en) 2002-04-15 2003-04-08 Method for forming plated terminations
US10/632,514 US6960366B2 (en) 2002-04-15 2003-08-01 Plated terminations

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0425961A GB2406714B (en) 2003-04-08 2004-03-17 Plated terminations
GB0425963A GB2406715B (en) 2003-04-08 2004-03-17 Plated terminations

Publications (3)

Publication Number Publication Date
GB0405993D0 GB0405993D0 (en) 2004-04-21
GB2400493A GB2400493A (en) 2004-10-13
GB2400493B true GB2400493B (en) 2005-11-09

Family

ID=46205142

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0405993A Expired - Fee Related GB2400493B (en) 2002-04-15 2004-03-17 Plated terminations

Country Status (5)

Country Link
JP (2) JP2004312023A (en)
KR (1) KR20040087934A (en)
CN (1) CN1540692B (en)
GB (1) GB2400493B (en)
TW (1) TWI368923B (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
JP2006147901A (en) * 2004-11-22 2006-06-08 Murata Mfg Co Ltd Stacked electronic component, its manufacturing method, and measuring method of its characteristics
JP4158772B2 (en) 2005-01-25 2008-10-01 日本電気株式会社 Connection terminal with a printed circuit board and a manufacturing method thereof
JP2006253371A (en) 2005-03-10 2006-09-21 Tdk Corp Multi-terminal multilayer capacitor and its manufacturing method
JP4539440B2 (en) * 2005-06-01 2010-09-08 株式会社村田製作所 Mounting structure of the multilayer capacitor
US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
WO2007116566A1 (en) * 2006-04-07 2007-10-18 Murata Manufacturing Co., Ltd. Capacitor
US20090154056A1 (en) * 2007-12-17 2009-06-18 General Electric Company Low inductance capacitor and method of manufacturing same
JP5239731B2 (en) * 2007-12-21 2013-07-17 株式会社村田製作所 Multilayer ceramic electronic component and a method for manufacturing the same
US8194391B2 (en) 2007-12-21 2012-06-05 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and manufacturing method thereof
JP4743222B2 (en) 2008-04-25 2011-08-10 ソニー株式会社 Variable capacitance device and electronic apparatus
JP5217677B2 (en) 2008-06-20 2013-06-19 株式会社村田製作所 Multilayer ceramic electronic component and a method for manufacturing the same
JP5282634B2 (en) 2008-06-25 2013-09-04 株式会社村田製作所 Multilayer ceramic electronic component and a method for manufacturing the same
JP5217692B2 (en) 2008-07-02 2013-06-19 株式会社村田製作所 Multilayer ceramic electronic components
JP5347350B2 (en) 2008-07-02 2013-11-20 株式会社村田製作所 The method of manufacturing a multilayer electronic component
JP2010118499A (en) 2008-11-13 2010-05-27 Murata Mfg Co Ltd Laminated ceramic electronic component
KR101069989B1 (en) 2009-09-10 2011-10-04 삼성전기주식회사 Multilayer Chip Capacitor and Circuit Board Device
JP2012156315A (en) 2011-01-26 2012-08-16 Murata Mfg Co Ltd Multilayer ceramic electronic component
JP2012253245A (en) * 2011-06-03 2012-12-20 Tdk Corp Multilayer electronic component and manufacturing method of the same
JP2013021300A (en) 2011-06-16 2013-01-31 Murata Mfg Co Ltd Multilayer ceramic electronic component
JP2013021299A (en) 2011-06-16 2013-01-31 Murata Mfg Co Ltd Multilayer ceramic electronic component
JP2013051392A (en) 2011-08-02 2013-03-14 Murata Mfg Co Ltd Multilayer ceramic electronic component
JP5794222B2 (en) 2012-02-03 2015-10-14 株式会社村田製作所 Ceramic electronic components
JP5796568B2 (en) 2012-02-03 2015-10-21 株式会社村田製作所 Ceramic electronic components
JP5799948B2 (en) 2012-02-03 2015-10-28 株式会社村田製作所 Ceramic electronic component and a method of manufacturing the same
JP5971236B2 (en) 2013-03-26 2016-08-17 株式会社村田製作所 Ceramic electronic components and glass paste
KR20150089141A (en) * 2014-01-27 2015-08-05 삼성전기주식회사 Multi-layered ceramic capacitor and board for mounting the same
WO2015146814A1 (en) 2014-03-27 2015-10-01 株式会社村田製作所 Electronic component
CN107731524A (en) * 2016-08-10 2018-02-23 钰邦电子(无锡)有限公司 A thin film capacitor and its manufacturing method
CN107768142A (en) * 2016-08-19 2018-03-06 钰邦电子(无锡)有限公司 Thin-film capacitor used for increasing dielectric constant and manufacturing method thereof
CN106960882B (en) * 2017-03-20 2018-06-15 河北盛平电子科技有限公司 Species metallized ceramic surface cubes and production methods

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1540403A (en) * 1975-07-14 1979-02-14 Trw Inc Method for making multi-layer capacitors
US5576053A (en) * 1993-05-11 1996-11-19 Murata Manufacturing Co., Ltd. Method for forming an electrode on an electronic part

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4811162A (en) 1987-04-27 1989-03-07 Engelhard Corporation Capacitor end termination composition and method of terminating
US4831494A (en) 1988-06-27 1989-05-16 International Business Machines Corporation Multilayer capacitor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1540403A (en) * 1975-07-14 1979-02-14 Trw Inc Method for making multi-layer capacitors
US5576053A (en) * 1993-05-11 1996-11-19 Murata Manufacturing Co., Ltd. Method for forming an electrode on an electronic part

Also Published As

Publication number Publication date
TWI368923B (en) 2012-07-21
JP4425688B2 (en) 2010-03-03
GB0405993D0 (en) 2004-04-21
JP2004312023A (en) 2004-11-04
TW200503010A (en) 2005-01-16
KR20040087934A (en) 2004-10-15
CN1540692A (en) 2004-10-27
CN1540692B (en) 2011-04-27
GB2400493A (en) 2004-10-13
JP2004327983A (en) 2004-11-18

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20110317