ES2078498T3 - Un dispositivo electronico incluyendo un circuito integrado montado sobre una base aislante. - Google Patents

Un dispositivo electronico incluyendo un circuito integrado montado sobre una base aislante.

Info

Publication number
ES2078498T3
ES2078498T3 ES91830446T ES91830446T ES2078498T3 ES 2078498 T3 ES2078498 T3 ES 2078498T3 ES 91830446 T ES91830446 T ES 91830446T ES 91830446 T ES91830446 T ES 91830446T ES 2078498 T3 ES2078498 T3 ES 2078498T3
Authority
ES
Spain
Prior art keywords
integrated circuit
electronic device
device including
insulating base
circuit mounted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91830446T
Other languages
English (en)
Inventor
Walter Bertoldo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Europe SpA
Original Assignee
Magneti Marelli SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magneti Marelli SpA filed Critical Magneti Marelli SpA
Application granted granted Critical
Publication of ES2078498T3 publication Critical patent/ES2078498T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0388Other aspects of conductors
    • H05K2201/0397Tab
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/1059Connections made by press-fit insertion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

EL DISPOSITIVO INCLUYE UN CIRCUITO INTEGRADO (1) MONTADO SOBRE UNA PLACA AISLANTE Y TENIENDO VARIOS PERNOS TERMINALES (3) QUE SE EXTIENDEN A PARTIR DE UNA DE SUS CARAS. LA PLACA (4) TIENE UN AGUJERO (6) EN LA REGION EN LA CUAL EL CIRCUITO INTEGRADO (1) ESTA MONTADO Y PIEZAS CONDUCTORAS (7) ESTAN INMERSAS EN LA PLACA. LAS PIEZAS TENIENDO EXTREMOS LIBRES (7A) EN EL AGUJERO (6), LOS EXTREMOS ESTANDO DOBLADOS HACIA LA CARA DE LA PLACA (4) OPUESTA A AQUELLA PIRTANDO EL CIRCUITO INTEGRADO (1) Y SOLDADAS A LOS CORRESPONDIENTES TERMINALES (3) DEL CIRCUITO INTEGRADO (1).
ES91830446T 1990-10-30 1991-10-22 Un dispositivo electronico incluyendo un circuito integrado montado sobre una base aislante. Expired - Lifetime ES2078498T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT5334890U IT220657Z2 (it) 1990-10-30 1990-10-30 Dispositivo elettronico comprendente un circuito integrato montato su una basetta isolante.

Publications (1)

Publication Number Publication Date
ES2078498T3 true ES2078498T3 (es) 1995-12-16

Family

ID=11282020

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91830446T Expired - Lifetime ES2078498T3 (es) 1990-10-30 1991-10-22 Un dispositivo electronico incluyendo un circuito integrado montado sobre una base aislante.

Country Status (4)

Country Link
EP (1) EP0484286B1 (es)
DE (1) DE69113741T2 (es)
ES (1) ES2078498T3 (es)
IT (1) IT220657Z2 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007014351A1 (de) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Elektrische Anordnung mit mindestens einem elektrischen Kontaktstift und einer hiermit kontaktierten Stromschienenanordnung
DE102015212177A1 (de) * 2015-06-30 2017-01-05 Osram Gmbh Schaltungsträger für eine elektronische Schaltung und Verfahren zum Herstellen eines derartigen Schaltungsträgers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4226492A (en) * 1979-07-30 1980-10-07 Bell Telephone Laboratories, Incorporated Electrical interconnection apparatus
US4677526A (en) * 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
JPH02502322A (ja) * 1987-02-19 1990-07-26 オリン コーポレーション プラスチック製のピングリッドアレイを製作する方法及びそれにより生産される製品

Also Published As

Publication number Publication date
DE69113741D1 (de) 1995-11-16
EP0484286A2 (en) 1992-05-06
IT9053348U1 (it) 1992-04-30
EP0484286B1 (en) 1995-10-11
EP0484286A3 (en) 1992-09-30
DE69113741T2 (de) 1996-03-21
IT9053348V0 (it) 1990-10-30
IT220657Z2 (it) 1993-10-08

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