KR950012694A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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KR950012694A
KR950012694A KR1019940027250A KR19940027250A KR950012694A KR 950012694 A KR950012694 A KR 950012694A KR 1019940027250 A KR1019940027250 A KR 1019940027250A KR 19940027250 A KR19940027250 A KR 19940027250A KR 950012694 A KR950012694 A KR 950012694A
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lead frame
semiconductor chip
encapsulation
semiconductor device
envelope
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KR1019940027250A
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KR100191759B1 (ko
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와타루 다카하시
노리아키 도우센
노부유키 사토
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사또오 후미오
가부시기가이샤 도시바
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Publication of KR100191759B1 publication Critical patent/KR100191759B1/ko

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Abstract

본 발명은 수백 MHz 이상의 고속 동작이 가능하게 되는 Cu제의 리이드 프레임을 사용하더라도 반도체 장치의 신뢰 성 이 저하하는 것을 방지 한다.
반도체 장치 (11)는 고속 동작, 방열 특성, 전기 특성에 뛰어나 있는 세라믹으로 이루어지는 외위기(10)인 베이스부(13)와 봉지부(14)에 의하여 반도체 칩 (12)이 봉지된 구조로 구성된다. 상기 반도체 칩(12)과 전기적으로 접속된 Cu성의 리이드 프레임(17)은 베이스부(13)와 봉지부(14)에 기워져 있고 리이드 프레임(17)
에는 상기 끼워진 부분에 위치하는 앵커 홀(17a)이 설치되어 있다. 이 앵커 홀(17a)내, 상기 끼워진 부분 있다. 따라서 수백 MHz 이상의 고속 동작이 가능해지는 Cu제의 리이드 프레임을 사용해도, 반도체 장치의 신뢰성이 저하하는 것을 방지할 수 있다.

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 제1 의 실시예에 의한 반도체 장치의 요부를 나타내는 단면도,
제2도는 본 발명의 제1도에 보이는 반도체 장치에 있어서의 리이드 프레임의 요부를 나타내는 사시도.
제3도는 본 발명의 제2의 실시예에 의한 반도체 장치에 있어서의 리이드 프레임의 요부를 나타내는 사시도.

Claims (4)

  1. 베이스(13)와 봉지부(14)로 구성되는 외위기(10)와, 상기 외위기내에 설치된 반도체 칩(12)과 , 상기 반도체 칩과 전기적으로 접속되고, 상기 베이스부와 상기 봉지부에 기워진 Cu제의 리이드 프레임(17)과; 상기 리이드 프레임에 설치된 상기 끼워진 부분에 위치하는 앵커 홀(17a, 17c, l7d)과, 상기 앵커 홀내에서, 상기 끼워진 부분의 상기 리이드 프레임과 상기 베이스부 및 상기 봉지부 각각과의 사이에 설치된 유리계의 접착제 (16)를 구비하는 것을 특징으로 하는 반도체 장치.
  2. 제1항에 있어서, 상기 리이드 프레임(17)에 있어서의 전원 라인에 상당하는 리이드(17b)를 이 이외의 리이드 보다 굵게 하는 것을 특징으로 하는 반도체 장치.
  3. 베이스부(13)와 봉지부(14)로 구성되는 외위기(10)와 , 상기 외위기 내에 설치된 반도기 칩(12)과 ;상기 반도체 칩과 전기적으로 접속되고 상기 베이스부와 상기 봉지부에 기워진 Cu제의 리이드 프레임(17)과 ; 상기 끼워진 부분에 있어서의 상기 리이드 프레임에 코팅된 폴리이미드(21,22)와: 상기 폴리이비드와 상기 베이스부 및 상기 봉지부 각각쪽의 사이에 설치된 유리계의 접착제(16)를 구비하는 것을 특징으로 하는 반도체 장치.
  4. 베이스부(13)와 봉지부(14)로 구성되는 외위기 (10)와 ; 상기 외위기내에 설치된 반도체칩(12)과 : 상기 반도체과 전기적으로 접속되고 상기 베이스부와 상기 봉지부에 끼워진 Cu제의 리이드 프레임 (17)과; 상기 리이드 프레임에 설치된 상기 끼워진 부분에 위치하는 앵커 홀(17a, 17c, l7d)과; 상기 앵커 홀내 및 상기 끼워진 부분에 있어서의 상기 리이드 프레임 각각에 코팅된 폴리이미드(21, 22)와; 상기 폴리이미드와 상기 베이스부 및 상기 봉지부 각각과의 사이에 설치된 유리계의 접착제(16)를 구비하는 것을 특징으로 하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940027250A 1993-10-25 1994-10-25 반도체 장치 KR100191759B1 (ko)

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EP0650193A3 (en) 1996-07-31
US5783466A (en) 1998-07-21
EP0650193A2 (en) 1995-04-26
KR100191759B1 (ko) 1999-06-15

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