ES2135656T3 - Procedimiento de fabricacion y ensamblaje de una tarjeta con circuito integrado. - Google Patents

Procedimiento de fabricacion y ensamblaje de una tarjeta con circuito integrado.

Info

Publication number
ES2135656T3
ES2135656T3 ES95201548T ES95201548T ES2135656T3 ES 2135656 T3 ES2135656 T3 ES 2135656T3 ES 95201548 T ES95201548 T ES 95201548T ES 95201548 T ES95201548 T ES 95201548T ES 2135656 T3 ES2135656 T3 ES 2135656T3
Authority
ES
Spain
Prior art keywords
integrated circuit
accommodation
card
manufacture
conductive tracks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95201548T
Other languages
English (en)
Inventor
Francois Launay
Jacques Venambre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
De la Rue Cartes et Systemes SAS
Original Assignee
De la Rue Cartes et Systemes SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by De la Rue Cartes et Systemes SAS filed Critical De la Rue Cartes et Systemes SAS
Application granted granted Critical
Publication of ES2135656T3 publication Critical patent/ES2135656T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
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    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

LA TARJETA ELECTRONICA COMPRENDE U SOPORTE DE TARJETA COMPRENDE UN SOPORTE DE TARJETA ELECTRICAMENTE AISLANTE DOTADO CON UN ALOJAMIENTO (5) DESTINADO A RECIBIR UN CIRCUITO INTEGRADO (4) Y SOBRE UNA CARA, ZONAS METALICAS DE CONTACTO INTERNAS (2) CONECTADAS ELECTRICAMENTE A LOS CONTACTOS DE DICHO CIRCUITO INTEGRADO. LA INVENCION IMPLICA LAS SIGUIENTES ETAPAS: LA APLICACION, POR UNA TECNOLOGIA MID (MOULDED INTERCONNECTION DEVICE EN INGLES), DE PISTAS ELECTRICAMENTE CONDUCTORAS (,9), TODAS DISPUESTAS CONTRA EL FONDO (7) Y LAS PAREDES LATERALES (6) DE DICHO ALOJAMIENTO (5) Y CONECTADAS, CADA UNA, A UNA DE DICHAS ZONAS METALICAS DE CONTACTO (2), DISPUESTAS SOBRE LA CARA DE SOPORTE (3) QUE COMPRENDE DICHO ALOJAMIENTO (5). - LA REALIZACION DE LAS CONEXIONES ELECTRICAS (12) QUE CONECTAN LOS CONTACTOS DEL CIRCUITO INTEGRADO (4) COLOCADO EN EL ALOJAMIENTO (5) CON DICHAS PISTAS CONDUCTORAS (9) EN EL FONDO (7) DEL ALOJAMIENTO, - EL LLENADO DE DICHO ALOJAMIENTO (5) CON UNA RESINA DE PROTECCION (13) QUE SE POLIMERIZA A CONTINUACION. APLICACION EN LAS TARJETAS INTELIGENTES ELECTRONICAS.
ES95201548T 1994-06-15 1995-06-12 Procedimiento de fabricacion y ensamblaje de una tarjeta con circuito integrado. Expired - Lifetime ES2135656T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9407308 1994-06-15

Publications (1)

Publication Number Publication Date
ES2135656T3 true ES2135656T3 (es) 1999-11-01

Family

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Publication number Publication date
EP0688051A1 (fr) 1995-12-20
KR960002771A (ko) 1996-01-26
US5647122A (en) 1997-07-15
EP0688051B1 (fr) 1999-09-15
DE69512137D1 (de) 1999-10-21
JPH087066A (ja) 1996-01-12
DE69512137T2 (de) 2000-05-25

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