FR2786317B1 - Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede - Google Patents

Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede

Info

Publication number
FR2786317B1
FR2786317B1 FR9814802A FR9814802A FR2786317B1 FR 2786317 B1 FR2786317 B1 FR 2786317B1 FR 9814802 A FR9814802 A FR 9814802A FR 9814802 A FR9814802 A FR 9814802A FR 2786317 B1 FR2786317 B1 FR 2786317B1
Authority
FR
France
Prior art keywords
flushed
manufacturing
laser engraving
contact smart
engraving step
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9814802A
Other languages
English (en)
Other versions
FR2786317A1 (fr
Inventor
Didier Elbaz
Jean Christophe Fidalgo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR9814802A priority Critical patent/FR2786317B1/fr
Priority to PCT/FR1999/002865 priority patent/WO2000031686A1/fr
Priority to AU12784/00A priority patent/AU1278400A/en
Publication of FR2786317A1 publication Critical patent/FR2786317A1/fr
Application granted granted Critical
Publication of FR2786317B1 publication Critical patent/FR2786317B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR9814802A 1998-11-24 1998-11-24 Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede Expired - Fee Related FR2786317B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR9814802A FR2786317B1 (fr) 1998-11-24 1998-11-24 Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede
PCT/FR1999/002865 WO2000031686A1 (fr) 1998-11-24 1999-11-22 Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede
AU12784/00A AU1278400A (en) 1998-11-24 1999-11-22 Method for making a flush chip card using a laser engraving step and resulting chip card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9814802A FR2786317B1 (fr) 1998-11-24 1998-11-24 Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede

Publications (2)

Publication Number Publication Date
FR2786317A1 FR2786317A1 (fr) 2000-05-26
FR2786317B1 true FR2786317B1 (fr) 2002-12-27

Family

ID=9533138

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9814802A Expired - Fee Related FR2786317B1 (fr) 1998-11-24 1998-11-24 Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede

Country Status (3)

Country Link
AU (1) AU1278400A (fr)
FR (1) FR2786317B1 (fr)
WO (1) WO2000031686A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9854977B2 (en) 2006-01-10 2018-01-02 Accuvein, Inc. Scanned laser vein contrast enhancer using a single laser, and modulation circuitry
EP1818851A1 (fr) * 2006-02-09 2007-08-15 Axalto S.A. Objet portable avec interface de contact, et personnalisation d'une interface de contact.
EP2073154A1 (fr) 2007-12-20 2009-06-24 Gemalto SA Micro-module biométrique
EP2418609A1 (fr) * 2010-07-23 2012-02-15 Gemalto SA Module électronique sécurisé, dispositif à module électronique sécurisé et procédé de fabrication
CN107195560A (zh) * 2017-06-02 2017-09-22 深圳华创兆业科技股份有限公司 Ic卡的激光封装系统及方法
CN113299561B (zh) * 2021-05-21 2023-06-27 浙江集迈科微电子有限公司 一种腔底防溢胶结构的制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2695234B1 (fr) * 1992-08-26 1994-11-04 Gemplus Card Int Procédé de marquage d'une carte à puce.
ES2135656T3 (es) * 1994-06-15 1999-11-01 Rue Cartes Et Systemes De Procedimiento de fabricacion y ensamblaje de una tarjeta con circuito integrado.
EP0688050A1 (fr) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue
DE4441052A1 (de) * 1994-11-18 1996-05-23 Orga Kartensysteme Gmbh Trägerelement für einen IC-Baustein zum Einsatz in Chipkarten
DE19502157B4 (de) * 1995-01-25 2011-07-21 Sagem Orga GmbH, 33106 Trägerelement für einen IC-Baustein zum Einbau in Chipkarten
FR2736740A1 (fr) * 1995-07-11 1997-01-17 Trt Telecom Radio Electr Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue
DE19607212C1 (de) * 1996-02-26 1997-04-10 Richard Herbst Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen

Also Published As

Publication number Publication date
FR2786317A1 (fr) 2000-05-26
AU1278400A (en) 2000-06-13
WO2000031686A1 (fr) 2000-06-02

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20090731