FR2689360B1 - Procede de fabrication de cartes imprimees, et cartes imprimees obtenues par ledit procede. - Google Patents

Procede de fabrication de cartes imprimees, et cartes imprimees obtenues par ledit procede.

Info

Publication number
FR2689360B1
FR2689360B1 FR9302873A FR9302873A FR2689360B1 FR 2689360 B1 FR2689360 B1 FR 2689360B1 FR 9302873 A FR9302873 A FR 9302873A FR 9302873 A FR9302873 A FR 9302873A FR 2689360 B1 FR2689360 B1 FR 2689360B1
Authority
FR
France
Prior art keywords
printed cards
manufacturing
cards
manufacturing printed
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9302873A
Other languages
English (en)
Other versions
FR2689360A1 (fr
Inventor
Martinelli Marco
Schmidt Walter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dyconex AG
Original Assignee
Dyconex AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dyconex AG filed Critical Dyconex AG
Publication of FR2689360A1 publication Critical patent/FR2689360A1/fr
Application granted granted Critical
Publication of FR2689360B1 publication Critical patent/FR2689360B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
FR9302873A 1992-03-25 1993-03-12 Procede de fabrication de cartes imprimees, et cartes imprimees obtenues par ledit procede. Expired - Fee Related FR2689360B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH93892A CH687490A5 (de) 1992-03-25 1992-03-25 Leiterplattenverstaerkung.

Publications (2)

Publication Number Publication Date
FR2689360A1 FR2689360A1 (fr) 1993-10-01
FR2689360B1 true FR2689360B1 (fr) 1995-10-20

Family

ID=4198672

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9302873A Expired - Fee Related FR2689360B1 (fr) 1992-03-25 1993-03-12 Procede de fabrication de cartes imprimees, et cartes imprimees obtenues par ledit procede.

Country Status (4)

Country Link
CH (1) CH687490A5 (fr)
DE (1) DE4305399B4 (fr)
FR (1) FR2689360B1 (fr)
GB (1) GB2265496B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4439239A1 (de) * 1994-11-03 1996-05-09 Univ Dresden Tech Schaltungsträger mit beidseitig laminierten Foliensystem
GB2324200A (en) * 1997-04-08 1998-10-14 Option Technologies Int Limite Strengthening and venting of multi-layer printed circuit boards
US6237304B1 (en) 1997-07-18 2001-05-29 Henkel Corporation Laminate structural bulkhead
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
AU2001239090A1 (en) * 2000-03-31 2001-10-15 Dyconex Patente Ag Electrical connecting element and method of fabricating the same
US9313903B2 (en) * 2008-12-25 2016-04-12 Mitsubishi Electric Corporation Method of manufacturing printed wiring board
DE102010060855A1 (de) * 2010-11-29 2012-05-31 Schweizer Electronic Ag Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1312714A (en) * 1970-04-09 1973-04-04 Gen Electric Co Ltd Methods of making multilayer printed circuit assemblies
GB2080729A (en) * 1980-06-25 1982-02-10 Gen Electric A multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion and method for making same.
DE3027336A1 (de) * 1980-07-18 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zur bohrungsisolierung bei metallkernleiterplatten
JPS6433998A (en) * 1987-07-29 1989-02-03 Hitachi Chemical Co Ltd Manufacture of wiring board with high heat conduction
JPH0744344B2 (ja) * 1988-08-30 1995-05-15 富士通株式会社 金属コア内蔵型多層プリント基板の製造方法
EP0373363A3 (fr) * 1988-12-15 1991-09-11 International Business Machines Corporation Remplissage de trous dans un plan métallique
EP0393312A1 (fr) * 1989-04-21 1990-10-24 Dyconex AG Plaquette de circuit multicouche
ATE124599T1 (de) * 1990-04-05 1995-07-15 Dyconex Ag Herstellung von mehrschichtigen leiterplatten mit erhöhter leiterbahnendichte.

Also Published As

Publication number Publication date
DE4305399B4 (de) 2006-08-24
FR2689360A1 (fr) 1993-10-01
GB2265496B (en) 1995-05-31
CH687490A5 (de) 1996-12-13
DE4305399A1 (de) 1993-09-30
GB2265496A (en) 1993-09-29
GB9305962D0 (en) 1993-05-12

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Legal Events

Date Code Title Description
ST Notification of lapse