DE3687546T2 - Selbstloetbare flexible verbindung. - Google Patents

Selbstloetbare flexible verbindung.

Info

Publication number
DE3687546T2
DE3687546T2 DE8686304393T DE3687546T DE3687546T2 DE 3687546 T2 DE3687546 T2 DE 3687546T2 DE 8686304393 T DE8686304393 T DE 8686304393T DE 3687546 T DE3687546 T DE 3687546T DE 3687546 T2 DE3687546 T2 DE 3687546T2
Authority
DE
Germany
Prior art keywords
flexible circuit
lossable
self
flexible connection
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686304393T
Other languages
English (en)
Other versions
DE3687546D1 (de
Inventor
Harold B Kent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metcal Inc
Original Assignee
Metcal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metcal Inc filed Critical Metcal Inc
Application granted granted Critical
Publication of DE3687546D1 publication Critical patent/DE3687546D1/de
Publication of DE3687546T2 publication Critical patent/DE3687546T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Multi-Conductor Connections (AREA)
DE8686304393T 1985-06-20 1986-06-09 Selbstloetbare flexible verbindung. Expired - Fee Related DE3687546T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/746,796 US4788404A (en) 1985-06-20 1985-06-20 Self-soldering flexible circuit connector

Publications (2)

Publication Number Publication Date
DE3687546D1 DE3687546D1 (de) 1993-03-04
DE3687546T2 true DE3687546T2 (de) 1993-06-03

Family

ID=25002368

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686304393T Expired - Fee Related DE3687546T2 (de) 1985-06-20 1986-06-09 Selbstloetbare flexible verbindung.

Country Status (6)

Country Link
US (1) US4788404A (de)
EP (1) EP0206619B1 (de)
JP (1) JPS61294778A (de)
AT (1) ATE84928T1 (de)
CA (1) CA1255012A (de)
DE (1) DE3687546T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6466990A (en) * 1987-09-08 1989-03-13 Furukawa Electric Co Ltd Molded circuit board
US5093545A (en) * 1988-09-09 1992-03-03 Metcal, Inc. Method, system and composition for soldering by induction heating
FR2638050B1 (fr) * 1988-10-18 1996-03-01 Thomson Hybrides Dispositif de report de composant sur un circuit hybride
US5059756A (en) * 1988-11-29 1991-10-22 Amp Incorporated Self regulating temperature heater with thermally conductive extensions
US5103071A (en) * 1988-11-29 1992-04-07 Amp Incorporated Surface mount technology breakaway self regulating temperature heater
US5032703A (en) * 1988-11-29 1991-07-16 Amp Incorporated Self regulating temperature heater carrier strip
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
US4990736A (en) * 1988-11-29 1991-02-05 Amp Incorporated Generating electromagnetic fields in a self regulating temperature heater by positioning of a current return bus
US5065501A (en) * 1988-11-29 1991-11-19 Amp Incorporated Generating electromagnetic fields in a self regulating temperature heater by positioning of a current return bus
JPH0319389A (ja) * 1989-06-16 1991-01-28 Fujitsu Ltd プリント回路基板
US5004887A (en) * 1989-07-24 1991-04-02 Amp Incorporated Heating apparatus having Curie effect heater
US5007574A (en) * 1989-09-14 1991-04-16 Metcal, Inc. Desoldering device
FR2657220B1 (fr) * 1990-01-12 1993-11-05 Thomson Csf Circuit imprime pour le support et l'interconnexion de composants electroniques, comportant un dispositif de debrasage.
US5260548A (en) * 1990-02-23 1993-11-09 Toddco General, Inc. Soldering system controlled power supply apparatus and method of using same
US5182427A (en) * 1990-09-20 1993-01-26 Metcal, Inc. Self-regulating heater utilizing ferrite-type body
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
US5568892A (en) * 1994-06-16 1996-10-29 Lucent Technologies Inc. Alignment and bonding techniques
DE19540140B4 (de) * 1995-10-27 2006-08-24 Coherent Lübeck GmbH Substrat, Modul und Verfahren zum Befestigen von Komponenten des Moduls auf dem Substrat
EP1097797B1 (de) * 1999-11-02 2004-02-04 TOHOKU MUNEKATA Co., Ltd. Verbinden von thermoplastischen Gehäusen mit Deckeln durch Verschmelzen
US6423939B1 (en) * 2000-10-02 2002-07-23 Agilent Technologies, Inc. Micro soldering method and apparatus
US6870251B2 (en) * 2002-05-29 2005-03-22 Intel Corporation High-power LGA socket
US6710303B1 (en) * 2002-11-13 2004-03-23 W.E.T. Automotive Systems Ag Intermediate electrical connecting device for seat-heating systems
US20040112935A1 (en) * 2002-12-16 2004-06-17 Visteon Global Technologies, Inc. Integrated flex substrate metallurgical bonding
FR2912029B1 (fr) * 2007-01-31 2010-10-22 Hispano Suiza Sa Carte electronique incorporant une resistance chauffante.
KR102194717B1 (ko) * 2015-01-06 2020-12-23 삼성전기주식회사 인쇄회로기판 및 그 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2424646A1 (fr) * 1978-04-28 1979-11-23 Commissariat Energie Atomique Procede de raccordement de bornes de connexion d'ensembles electriques
DE2939922C2 (de) * 1978-10-12 1983-03-17 International Computers Ltd., London Elektrische Kabelverbinderanordnung
JPS5936540B2 (ja) * 1980-05-15 1984-09-04 敬一郎 長谷川 文化財などの保存消毒装置
JPS5811115A (ja) * 1981-07-13 1983-01-21 Asahi Fiber Glass Co Ltd リブを有するｆｒｐの製造方法
GB2127740B (en) * 1982-09-30 1985-10-23 Burr Brown Res Corp Improved hermetic sealing process
GB2134026B (en) * 1983-01-27 1985-11-20 Allen Bradley Int A method of joining a component part to an integrated circuit

Also Published As

Publication number Publication date
EP0206619A3 (en) 1988-10-26
EP0206619A2 (de) 1986-12-30
JPS61294778A (ja) 1986-12-25
CA1255012A (en) 1989-05-30
US4788404A (en) 1988-11-29
EP0206619B1 (de) 1993-01-20
ATE84928T1 (de) 1993-02-15
DE3687546D1 (de) 1993-03-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee