JPS6476608A - Aeolotropic conductive adhesive film - Google Patents

Aeolotropic conductive adhesive film

Info

Publication number
JPS6476608A
JPS6476608A JP23169687A JP23169687A JPS6476608A JP S6476608 A JPS6476608 A JP S6476608A JP 23169687 A JP23169687 A JP 23169687A JP 23169687 A JP23169687 A JP 23169687A JP S6476608 A JPS6476608 A JP S6476608A
Authority
JP
Japan
Prior art keywords
bumps
conductive
printed wiring
under pressure
film body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23169687A
Other languages
Japanese (ja)
Inventor
Toshiyuki Kawaguchi
Kazuya Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP23169687A priority Critical patent/JPS6476608A/en
Publication of JPS6476608A publication Critical patent/JPS6476608A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To secure continuity between terminals when applying printed wiring boards to each other or a printed wiring board to terminals provided in an electronic circuit part and pressing them or heating them under pressure for attaching them with each other by providing bumps consisting of a resin component having conductivity inside or in the surface of a film body having adhesive function. CONSTITUTION:Conductive bumps 2 in the form of columns, cones, pyramids, etc., are arranged in the flat surface of a film body 1 having adhesive property uniformly and regularly. Polystyrene, polyvinyl chloride, polyvinyl acetate, hot melt binding agent, rubber, or the like is used for the film 1, and a similar material of which surface is made conductive is used in the surface where bumps 2 are to be formed. For making the material conductive, powdery matters of gold, silver, copper, nickel, aluminum, etc., shall be included. Then bumps 2 are applied facing each other, and they are pressurized or heated under pressure, so the bumps are connected with each other. A good connection property can thus be obtained, and a shortcircuit or the like will not occur between the adjuscent bumps 2.
JP23169687A 1987-09-16 1987-09-16 Aeolotropic conductive adhesive film Pending JPS6476608A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23169687A JPS6476608A (en) 1987-09-16 1987-09-16 Aeolotropic conductive adhesive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23169687A JPS6476608A (en) 1987-09-16 1987-09-16 Aeolotropic conductive adhesive film

Publications (1)

Publication Number Publication Date
JPS6476608A true JPS6476608A (en) 1989-03-22

Family

ID=16927566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23169687A Pending JPS6476608A (en) 1987-09-16 1987-09-16 Aeolotropic conductive adhesive film

Country Status (1)

Country Link
JP (1) JPS6476608A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196371A (en) * 1989-12-18 1993-03-23 Epoxy Technology, Inc. Flip chip bonding method using electrically conductive polymer bumps
WO1995002313A1 (en) 1993-07-06 1995-01-19 Kabushiki Kaisha Toshiba Heat dissipating sheet
US5879761A (en) * 1989-12-18 1999-03-09 Polymer Flip Chip Corporation Method for forming electrically conductive polymer interconnects on electrical substrates
JP2014175054A (en) * 2013-03-05 2014-09-22 Sumitomo Electric Ind Ltd Adhesive sheet and method for producing the same
JP2014175323A (en) * 2013-03-05 2014-09-22 Sumitomo Electric Ind Ltd Adhesive sheet and method for producing the same
JP2015015322A (en) * 2013-07-03 2015-01-22 住友電工プリントサーキット株式会社 Adhesive sheet, electric component, and method for manufacturing the same
JP2015023065A (en) * 2013-07-16 2015-02-02 住友電工プリントサーキット株式会社 Electronic component, and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61277179A (en) * 1985-05-31 1986-12-08 ソニ−ケミカル株式会社 Conductive anisotropic adhesive sheet
JPS62117206A (en) * 1985-11-18 1987-05-28 株式会社リコー Anisotropic conductive sheet

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61277179A (en) * 1985-05-31 1986-12-08 ソニ−ケミカル株式会社 Conductive anisotropic adhesive sheet
JPS62117206A (en) * 1985-11-18 1987-05-28 株式会社リコー Anisotropic conductive sheet

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196371A (en) * 1989-12-18 1993-03-23 Epoxy Technology, Inc. Flip chip bonding method using electrically conductive polymer bumps
US5879761A (en) * 1989-12-18 1999-03-09 Polymer Flip Chip Corporation Method for forming electrically conductive polymer interconnects on electrical substrates
WO1995002313A1 (en) 1993-07-06 1995-01-19 Kabushiki Kaisha Toshiba Heat dissipating sheet
JP2014175054A (en) * 2013-03-05 2014-09-22 Sumitomo Electric Ind Ltd Adhesive sheet and method for producing the same
JP2014175323A (en) * 2013-03-05 2014-09-22 Sumitomo Electric Ind Ltd Adhesive sheet and method for producing the same
JP2015015322A (en) * 2013-07-03 2015-01-22 住友電工プリントサーキット株式会社 Adhesive sheet, electric component, and method for manufacturing the same
JP2015023065A (en) * 2013-07-16 2015-02-02 住友電工プリントサーキット株式会社 Electronic component, and manufacturing method thereof

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