JPS6476608A - Aeolotropic conductive adhesive film - Google Patents
Aeolotropic conductive adhesive filmInfo
- Publication number
- JPS6476608A JPS6476608A JP23169687A JP23169687A JPS6476608A JP S6476608 A JPS6476608 A JP S6476608A JP 23169687 A JP23169687 A JP 23169687A JP 23169687 A JP23169687 A JP 23169687A JP S6476608 A JPS6476608 A JP S6476608A
- Authority
- JP
- Japan
- Prior art keywords
- bumps
- conductive
- printed wiring
- under pressure
- film body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE:To secure continuity between terminals when applying printed wiring boards to each other or a printed wiring board to terminals provided in an electronic circuit part and pressing them or heating them under pressure for attaching them with each other by providing bumps consisting of a resin component having conductivity inside or in the surface of a film body having adhesive function. CONSTITUTION:Conductive bumps 2 in the form of columns, cones, pyramids, etc., are arranged in the flat surface of a film body 1 having adhesive property uniformly and regularly. Polystyrene, polyvinyl chloride, polyvinyl acetate, hot melt binding agent, rubber, or the like is used for the film 1, and a similar material of which surface is made conductive is used in the surface where bumps 2 are to be formed. For making the material conductive, powdery matters of gold, silver, copper, nickel, aluminum, etc., shall be included. Then bumps 2 are applied facing each other, and they are pressurized or heated under pressure, so the bumps are connected with each other. A good connection property can thus be obtained, and a shortcircuit or the like will not occur between the adjuscent bumps 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23169687A JPS6476608A (en) | 1987-09-16 | 1987-09-16 | Aeolotropic conductive adhesive film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23169687A JPS6476608A (en) | 1987-09-16 | 1987-09-16 | Aeolotropic conductive adhesive film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6476608A true JPS6476608A (en) | 1989-03-22 |
Family
ID=16927566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23169687A Pending JPS6476608A (en) | 1987-09-16 | 1987-09-16 | Aeolotropic conductive adhesive film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6476608A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5196371A (en) * | 1989-12-18 | 1993-03-23 | Epoxy Technology, Inc. | Flip chip bonding method using electrically conductive polymer bumps |
WO1995002313A1 (en) | 1993-07-06 | 1995-01-19 | Kabushiki Kaisha Toshiba | Heat dissipating sheet |
US5879761A (en) * | 1989-12-18 | 1999-03-09 | Polymer Flip Chip Corporation | Method for forming electrically conductive polymer interconnects on electrical substrates |
JP2014175054A (en) * | 2013-03-05 | 2014-09-22 | Sumitomo Electric Ind Ltd | Adhesive sheet and method for producing the same |
JP2014175323A (en) * | 2013-03-05 | 2014-09-22 | Sumitomo Electric Ind Ltd | Adhesive sheet and method for producing the same |
JP2015015322A (en) * | 2013-07-03 | 2015-01-22 | 住友電工プリントサーキット株式会社 | Adhesive sheet, electric component, and method for manufacturing the same |
JP2015023065A (en) * | 2013-07-16 | 2015-02-02 | 住友電工プリントサーキット株式会社 | Electronic component, and manufacturing method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61277179A (en) * | 1985-05-31 | 1986-12-08 | ソニ−ケミカル株式会社 | Conductive anisotropic adhesive sheet |
JPS62117206A (en) * | 1985-11-18 | 1987-05-28 | 株式会社リコー | Anisotropic conductive sheet |
-
1987
- 1987-09-16 JP JP23169687A patent/JPS6476608A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61277179A (en) * | 1985-05-31 | 1986-12-08 | ソニ−ケミカル株式会社 | Conductive anisotropic adhesive sheet |
JPS62117206A (en) * | 1985-11-18 | 1987-05-28 | 株式会社リコー | Anisotropic conductive sheet |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5196371A (en) * | 1989-12-18 | 1993-03-23 | Epoxy Technology, Inc. | Flip chip bonding method using electrically conductive polymer bumps |
US5879761A (en) * | 1989-12-18 | 1999-03-09 | Polymer Flip Chip Corporation | Method for forming electrically conductive polymer interconnects on electrical substrates |
WO1995002313A1 (en) | 1993-07-06 | 1995-01-19 | Kabushiki Kaisha Toshiba | Heat dissipating sheet |
JP2014175054A (en) * | 2013-03-05 | 2014-09-22 | Sumitomo Electric Ind Ltd | Adhesive sheet and method for producing the same |
JP2014175323A (en) * | 2013-03-05 | 2014-09-22 | Sumitomo Electric Ind Ltd | Adhesive sheet and method for producing the same |
JP2015015322A (en) * | 2013-07-03 | 2015-01-22 | 住友電工プリントサーキット株式会社 | Adhesive sheet, electric component, and method for manufacturing the same |
JP2015023065A (en) * | 2013-07-16 | 2015-02-02 | 住友電工プリントサーキット株式会社 | Electronic component, and manufacturing method thereof |
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