JPS6464295A - Manufacture of circuit board - Google Patents

Manufacture of circuit board

Info

Publication number
JPS6464295A
JPS6464295A JP62220686A JP22068687A JPS6464295A JP S6464295 A JPS6464295 A JP S6464295A JP 62220686 A JP62220686 A JP 62220686A JP 22068687 A JP22068687 A JP 22068687A JP S6464295 A JPS6464295 A JP S6464295A
Authority
JP
Japan
Prior art keywords
sheet
circuit board
board
thermoplastic resin
fused
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62220686A
Other languages
Japanese (ja)
Inventor
Akinori Motomiya
Kenichi Yoshida
Hiroshi Ohira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62220686A priority Critical patent/JPS6464295A/en
Publication of JPS6464295A publication Critical patent/JPS6464295A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To enable easily the electrical connection of a plurality of circuit boards, and realize miniaturization and improvement of physical strength, by using thermoplastic resin for the circuit board, and heating and pressing a plurality of the circuit boards so as to constitute a unified body. CONSTITUTION:For board material, a sheet 11 of polycarbonate resin (thermoplastic resin) is used, and a wiring pattern 12 is formed on the sheet 11, by using silver paste applying vinyl chloride to (thermoplastic resin) to binder. Then, the boards are overlapped in the manner in which the parts to be connected of the surface on which the wiring pattern is formed are in contract with each other. By using a hot press heated at a temperature of about 200 deg.C, the overlap of two circuit board elements is heated and pressed to constitute a unified body. Thus the sheets 11 are fused, and at the same time, the wiring patterns also are fused, which are electrically connected. The circuit board obtained in this manner has a thickness effectively equal to one sheet of board, and contains no unevenness and no steps. The strength is as sufficient as one- sheet board, and electric characteristics are also excellent.
JP62220686A 1987-09-03 1987-09-03 Manufacture of circuit board Pending JPS6464295A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62220686A JPS6464295A (en) 1987-09-03 1987-09-03 Manufacture of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62220686A JPS6464295A (en) 1987-09-03 1987-09-03 Manufacture of circuit board

Publications (1)

Publication Number Publication Date
JPS6464295A true JPS6464295A (en) 1989-03-10

Family

ID=16754889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62220686A Pending JPS6464295A (en) 1987-09-03 1987-09-03 Manufacture of circuit board

Country Status (1)

Country Link
JP (1) JPS6464295A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637418A (en) * 1992-06-02 1994-02-10 Internatl Business Mach Corp <Ibm> Structure for interconnection of electric packaging structure circuit card and its manufacture
JP2017152687A (en) * 2016-02-22 2017-08-31 日本メクトロン株式会社 Stretchable wiring substrate and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637418A (en) * 1992-06-02 1994-02-10 Internatl Business Mach Corp <Ibm> Structure for interconnection of electric packaging structure circuit card and its manufacture
JP2017152687A (en) * 2016-02-22 2017-08-31 日本メクトロン株式会社 Stretchable wiring substrate and method of manufacturing the same

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