JPS587078B2 - Print Banno Tanshisetzokuhouhou - Google Patents
Print Banno TanshisetzokuhouhouInfo
- Publication number
- JPS587078B2 JPS587078B2 JP50017584A JP1758475A JPS587078B2 JP S587078 B2 JPS587078 B2 JP S587078B2 JP 50017584 A JP50017584 A JP 50017584A JP 1758475 A JP1758475 A JP 1758475A JP S587078 B2 JPS587078 B2 JP S587078B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- conductive layer
- printed board
- terminals
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】
この発明はプリント板の端子を導出して他のプリント板
あるいは機器と電気的に接続する場合のプリント板の端
子接続方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for connecting terminals of a printed board when the terminals of the printed board are led out and electrically connected to another printed board or equipment.
プリント板相互やプリント板と電気機器とを電気的に接
続する場合には種々の方式があるが、プリント板に設け
られている多数の端子を一活して導出して接続する場合
には従来つぎのような方法がとられている。There are various methods for electrically connecting printed boards to each other or to electrical equipment, but when connecting by making full use of the large number of terminals provided on a printed board, there are conventional methods. The following methods are used.
すなわち、第１図および第２図で示すように、プリント
板ａの端子ｂ・・・に半田メツキＣを施すとともにフイ
ルム状のフラットケーブルｄの端子ｅ・・・に半田メツ
キＣを施し、プリント板ａとフラットケーブルｄの端子
ｂ，ｅ相互を重合させる。That is, as shown in FIGS. 1 and 2, solder plating C is applied to terminals b of printed board a, and solder plating C is applied to terminals e of film-shaped flat cable d, and the printed circuit board is printed. Terminals b and e of plate a and flat cable d are overlapped with each other.
そして、これら端子ｂ，ｅ相互の重合部ｆをリフローソ
ルダマシンによって加熱し、上記半田メツキＣを溶解し
て半田付けするかあるいは赤外線照射装置によって加熱
して同様に半田付げするようにしている。Then, the overlapping part f between terminals b and e is heated with a reflow solder machine to melt the solder plating C and soldered, or alternatively, it is heated with an infrared irradiation device and soldered in the same way. .
したがって、従来においてはりフローソルダマシンや赤
外線照射装置などの設備が必要となるとともにフラット
ケーブルは半田が溶解する際に発生する熱に耐えられる
材料にする必要がある。Therefore, in the past, equipment such as a beam flow soldering machine and an infrared ray irradiation device were required, and the flat cable needed to be made of a material that could withstand the heat generated when the solder melted.
そこで、従来はフラケットケーブルの材料をポリイミド
フイルムによって形成しているが、これは高価であるた
め実用的でないという事情がある。Therefore, conventionally, the material of the fracket cable is made of polyimide film, but this is expensive and therefore impractical.
この発明は上記事情にもとずきなされたもので、その目
的とするところは、合成樹脂フイルム上に接着剤を塗布
し、この接着剤の指触乾燥状態の後にその接着剤上に導
電性ペーストをスクリーン印刷にて塗布し導電層を形成
し、ついで上記接着剤を再活性してプリント板と圧着す
ることによりプリント板の端子と導電層・・・とを電気
的に接続するようにして、従来のようにリフローソルダ
マシンや赤外線照射装置などによって加熱することなく
、単に圧着するだけで接続ができ、しかも高価な耐熱性
フイルムを用いることのないプリント板の端子接続方法
を提供しようとするものである。This invention was made based on the above-mentioned circumstances, and its purpose is to apply an adhesive onto a synthetic resin film, and after the adhesive is dry to the touch, conductive material is formed on the adhesive. The paste is applied by screen printing to form a conductive layer, and then the adhesive is reactivated and crimped to the printed board to electrically connect the terminals of the printed board and the conductive layer... , attempts to provide a method for connecting terminals of a printed circuit board that can be connected simply by crimping without heating with a reflow solder machine or an infrared irradiation device as in the past, and does not require the use of an expensive heat-resistant film. It is something.
以下、この発明を第３図および第４図に示す一実施例に
もとすいて説明する。The present invention will be explained below based on an embodiment shown in FIGS. 3 and 4.
図中１はポリエステルなどの合成樹脂フイルムであり、
まずこの合成樹脂フイルム１の片面全体に接着剤２を１
００〜２００μ程度の厚みに塗布する。1 in the figure is a synthetic resin film such as polyester,
First, apply one layer of adhesive 2 to the entire one side of this synthetic resin film 1.
Apply to a thickness of about 00 to 200 μm.
この場合接着剤２は速乾性と後の再活性化することを考
慮してクロロフレンなどのゴム系接着剤が用いられてい
る。In this case, the adhesive 2 is a rubber-based adhesive such as chlorophrene, taking into consideration its quick drying properties and later reactivation.
このように合成樹脂フイルム１に対しての接着剤２の塗
布が完了してから数分ないし数十分自然放置すると、接
着剤２０表面は指触乾燥状態となり、つぎに、上記接着
剤２の表面にたとえばＡｇペーストなど導電性ペースト
を厚さ１００μ程度スクリーン印刷にて端子回路状に塗
布し乾燥させる。After the application of the adhesive 2 to the synthetic resin film 1 is completed in this way, if the adhesive 20 is allowed to stand for several minutes or tens of minutes, the surface of the adhesive 20 becomes dry to the touch, and then the adhesive 2 is applied to the synthetic resin film 1. A conductive paste such as Ag paste is applied to the surface by screen printing to a thickness of about 100 μm in the form of a terminal circuit and dried.
これによって、接着剤２の表面には後述するプリント板
の端子と対応した間隔および幅の導電層３・・・が得ら
れこれは接着剤２の表面よりわずかに陥没している。As a result, on the surface of the adhesive 2, there is obtained a conductive layer 3 having a spacing and width corresponding to terminals of a printed circuit board, which will be described later, and is slightly recessed from the surface of the adhesive 2.
つぎに、上記合成樹脂フイルム１上の接着剤２に溶剤を
塗布して接着剤２を再活性させ、この状態で導電層３・
・・とプリント板４に予めプリントされている端子５・
・・とを位置決めし、合成樹脂フイルム１とプリント板
４とを重ね合せて圧着することにより、プリント板４の
端子５・・・と合成樹脂フイルム１の導電層３・・・と
は接合され電気的導通状態となるとともに合成樹脂フイ
ルム１は接着剤２を介してプリント板４と固着する。Next, a solvent is applied to the adhesive 2 on the synthetic resin film 1 to reactivate the adhesive 2, and in this state, the conductive layer 3.
... and the terminal 5 printed on the printed board 4 in advance.
By positioning the synthetic resin film 1 and the printed board 4 and pressing them together, the terminals 5 of the printed board 4 and the conductive layer 3 of the synthetic resin film 1 are joined. When electrically conductive, the synthetic resin film 1 is fixed to the printed board 4 via the adhesive 2.
したがって、合成樹脂フイルム１および導電層３・・・
を延長して設けることにより、プリント板４を他のプリ
ント板あるいは電気機器等と接続することができる。Therefore, the synthetic resin film 1 and the conductive layer 3...
By extending and providing the printed board 4, the printed board 4 can be connected to other printed boards or electrical equipment.
なお、上記一実施例においては、接着剤としてゴム系の
接着剤を用いたが、速乾性と再活性化が可能なものであ
ればこれに限定されない。In the above embodiment, a rubber adhesive was used as the adhesive, but the adhesive is not limited to this as long as it dries quickly and can be reactivated.
この発明は以上説明したように、合成樹脂フイルム上に
接着剤を塗布し、この接着剤が指触乾燥状態になったの
ち、その接着剤上に導電性ペーストをスクリーン印刷に
よって塗布して導電層を形成し、ついで上記接着剤を再
活性してプリント板と圧着することにより導電層とプリ
ント板の端子とを接合して電気的に接続するようにした
から、両者の接続は単に圧着するという簡単な方法でな
され、従来のようにリフローソルダマシンや赤外線照射
装置を用いる必要はまったくない。As explained above, in this invention, an adhesive is applied onto a synthetic resin film, and after the adhesive becomes dry to the touch, a conductive paste is applied onto the adhesive by screen printing to form a conductive layer. Then, the conductive layer and the terminals of the printed board are bonded and electrically connected by reactivating the adhesive and crimping them with the printed board. Therefore, the connection between the two is simply crimped. This is done by a simple method, and there is no need to use a conventional reflow solder machine or infrared irradiation device.
したがって、設備費がかかることはないとともに加熱し
ないからフイルムも耐熱性が要求されず、従来のように
高価なポリイミドフイルムも不用となり材料費の節減を
図ることができる。Therefore, there is no equipment cost, and since no heating is required, the film is not required to be heat resistant, and the expensive polyimide film used in the past is not required, resulting in a reduction in material costs.
また、導電層と端子との接合部以外は全面がプリント基
板に接着されるため接着強度が強く、導電層と端子とが
離れて導電性を損うようなことが無く、長期に亘って安
定した導電性能が確保できるといった効果を奏する。In addition, since the entire surface is bonded to the printed circuit board except for the joint between the conductive layer and the terminal, the adhesive strength is strong, and the conductive layer and terminal will not separate and lose conductivity, making it stable over a long period of time. This has the effect of ensuring high conductive performance.
第１図は従来のプリント板の端子接続方法を説明するた
めの平面図、第２図は第１図■一■線に沿う断面図、第
３図および第４図はこの発明方法の一実施例を説明する
ためのもので、第３図は合成樹脂フイルム上に接着剤を
介して導電層を形成した状態の斜視図、第４図Ａ，Ｂは
接続順序を示す断面図である。
１・・・・・・合成樹脂フィルム、２・・・・・・接着
剤、３・・・・・・導電層、４・・・・・・プリント板
、５・・・・・・端子。Fig. 1 is a plan view for explaining the conventional terminal connection method of a printed circuit board, Fig. 2 is a cross-sectional view taken along the line 1 - 1 of Fig. 1, and Figs. 3 and 4 are one implementation of the method of the present invention. To explain an example, FIG. 3 is a perspective view of a state in which a conductive layer is formed on a synthetic resin film via an adhesive, and FIGS. 4A and 4B are sectional views showing the connection order. DESCRIPTION OF SYMBOLS 1... Synthetic resin film, 2... Adhesive, 3... Conductive layer, 4... Printed board, 5... Terminal.
Claims (1)
と、上記接着剤の指触乾燥状態後その接着剤上に導電性
ペーストをスクリーン印刷にて端子回路状に塗布し導電
層を形成する第２の手段と、上記フイルム上の接着剤に
溶剤を塗布し接着剤を再活性してプリント板と圧着しプ
リント板の端子と上記導電層とを電気的に接続する第３
の手段とを具備したことを特徴とするプリント板の端子
接続方法。1. A first means of applying an adhesive onto a synthetic resin film, and after the adhesive is dry to the touch, a conductive paste is applied onto the adhesive in the form of a terminal circuit by screen printing to form a conductive layer. a second means, and a third means of applying a solvent to the adhesive on the film, reactivating the adhesive, and crimping it to the printed board to electrically connect the terminals of the printed board and the conductive layer.
A method for connecting terminals of a printed circuit board, characterized by comprising the means of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50017584A JPS587078B2 (en) | 1975-02-12 | 1975-02-12 | Print Banno Tanshisetzokuhouhou |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50017584A JPS587078B2 (en) | 1975-02-12 | 1975-02-12 | Print Banno Tanshisetzokuhouhou |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5193364A JPS5193364A (en) | 1976-08-16 |
| JPS587078B2 true JPS587078B2 (en) | 1983-02-08 |
Family
ID=11947943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50017584A Expired JPS587078B2 (en) | 1975-02-12 | 1975-02-12 | Print Banno Tanshisetzokuhouhou |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS587078B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013004706A (en) * | 2011-06-16 | 2013-01-07 | Sumitomo Electric Ind Ltd | Wiring member |
| JP2013004314A (en) * | 2011-06-16 | 2013-01-07 | Sumitomo Electric Ind Ltd | Flat cable |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57128099A (en) * | 1981-01-30 | 1982-08-09 | Matsushita Electric Ind Co Ltd | Method of mounting and connecting chip part |
| CN102959803B (en) * | 2011-06-16 | 2015-05-13 | 住友电气工业株式会社 | Flat cable and method for manufacturing same |
| WO2012173179A1 (en) * | 2011-06-16 | 2012-12-20 | 住友電気工業株式会社 | Flat cable and method for manufacturing same |
-
1975
- 1975-02-12 JP JP50017584A patent/JPS587078B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013004706A (en) * | 2011-06-16 | 2013-01-07 | Sumitomo Electric Ind Ltd | Wiring member |
| JP2013004314A (en) * | 2011-06-16 | 2013-01-07 | Sumitomo Electric Ind Ltd | Flat cable |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5193364A (en) | 1976-08-16 |
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