JPH02165614A - Flat power supply device - Google Patents
Flat power supply deviceInfo
- Publication number
- JPH02165614A JPH02165614A JP63322392A JP32239288A JPH02165614A JP H02165614 A JPH02165614 A JP H02165614A JP 63322392 A JP63322392 A JP 63322392A JP 32239288 A JP32239288 A JP 32239288A JP H02165614 A JPH02165614 A JP H02165614A
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- circuit board
- lead terminal
- supply element
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004840 adhesive resin Substances 0.000 claims description 10
- 229920006223 adhesive resin Polymers 0.000 claims description 10
- 238000000034 method Methods 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 7
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 5
- 229910052744 lithium Inorganic materials 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、たとえば、ペーパー状の電池、電気二重層
コンデンサのような扁平型電源素子に関するもので、特
に、電源を取出すためのリード端子を備える扁平型電源
素子に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a flat type power supply element such as a paper battery or an electric double layer capacitor. The present invention relates to a flat type power supply element.
［従来の技術］
たとえば、ＩＣカードなどの薄型電子機器の電源として
は、ペーパー状のリチウム電池や電気二重層コンデンサ
が使用されている。[Prior Art] For example, paper-like lithium batteries and electric double layer capacitors are used as power sources for thin electronic devices such as IC cards.
第４図には、ペーパー状のリチウム電池の断面構造の一
例が概略的に示されている。電極を兼ねる、たとえばス
テンレス箔からなる２枚の外装板１および２が、絶縁封
口樹＆３を介して対向するように配置され、それによっ
て密閉された収納部４が形成される。収納部４には、図
示しないが、発電要素が収納される。FIG. 4 schematically shows an example of the cross-sectional structure of a paper-like lithium battery. Two exterior plates 1 and 2 made of stainless steel foil, for example, which also serve as electrodes, are arranged to face each other with an insulating sealant &3 interposed therebetween, thereby forming a sealed storage section 4. Although not shown in the drawings, the storage section 4 stores a power generation element.
第５図には、本件出願人が、先に出願したペーパー状の
電気二重層コンデンサの断面構造が概略的に示されてい
る（特願昭６２−２９６８７９号）。FIG. 5 schematically shows the cross-sectional structure of a paper-like electric double layer capacitor that was previously filed by the applicant (Japanese Patent Application No. 296879/1982).
それぞれ電極を兼ねる、ステンレス箔からなるケース半
休５および６は、周縁部７において、溶接されることに
よって封止される。一方のケース半体５には、開口８が
形成され、この開口８に臨むように、たとえばステンレ
ス箔からなる電極板９が配置される。電極板９とケース
半体５とは、絶縁性樹脂層１０によって互いに絶縁封止
された状態とされる。このようにして、密閉された収納
部１１が形成され、この収納部１１には、図示し、ない
が、静電容量発生要素が収納される。Case halves 5 and 6 made of stainless steel foil, each of which also serves as an electrode, are sealed by welding at a peripheral edge 7. An opening 8 is formed in one of the case halves 5, and an electrode plate 9 made of, for example, stainless steel foil is arranged so as to face the opening 8. The electrode plate 9 and the case half 5 are insulated and sealed from each other by an insulating resin layer 10. In this way, a sealed storage section 11 is formed, and a capacitance generating element (not shown) is stored in this storage section 11.
これらの扁平型電源素子を、電子機器に内蔵して、回路
基板と接続する場合、最も典型的には、第６図に示すよ
うな構成が採用されていた。この構成は、たとえば実開
昭６２−１０２２６０号公報に開示されるものと実質的
に同様である。すなわち、第６図において、上述したよ
うな電池または電気二重層コンデンサは、さらに概略的
に示された扁平型電源素子１２に対応している。回路基
板１３には、コンタクトピン１４および１５が設けられ
、これらコンタクトピン１４および１５の間に電源素子
１２を弾性的に挾みながら、コンタクトピン１４および
１５の各々が電源素子１２の相異なる電極に接触するよ
うにされていた。When these flat type power supply elements are built into electronic equipment and connected to a circuit board, a configuration as shown in FIG. 6 is most typically adopted. This configuration is substantially the same as that disclosed in, for example, Japanese Utility Model Application No. 62-102260. That is, in FIG. 6, the battery or electric double layer capacitor as described above corresponds to the flat power supply element 12 which is further schematically shown. The circuit board 13 is provided with contact pins 14 and 15, and while the power supply element 12 is elastically sandwiched between these contact pins 14 and 15, each of the contact pins 14 and 15 connects to a different electrode of the power supply element 12. was supposed to be in contact with.
しかしながら、第６図に示した構造では、コンタクトピ
ン１４および１５の存在のため、電源部の薄型化が困難
であるだけでなく、コンタクトピン１４および１５の電
源素子１２に対する加圧力を十分に強くできないため、
電気的接続の信頼性が低いという問題があった。However, in the structure shown in FIG. 6, the presence of the contact pins 14 and 15 not only makes it difficult to make the power supply section thinner, but also makes it difficult to apply a sufficiently strong pressing force to the power supply element 12 from the contact pins 14 and 15. Because it is not possible,
There was a problem that the reliability of the electrical connection was low.
上述した問題を解決し得るものとして、第７図に示すよ
うな扁平型電源素子１６も提案されている（実開昭６１
−１６２９４８号公報）。第７図に示す従来例では、扁
平型電源素子１６の各々の電極に予めリード端子１７お
よび１８を、溶接部１９が図示されているように、スポ
ット溶接などの方法で取付けておく。そして、このよう
な電源素子１６を電子機器に内蔵するとき、リード端子
１７および１８の各先端を回路基板に半田付けすること
が行なわれる。このような構造によれば、第６図に示し
た構造に比べて、電源部の薄型化が可能である。As a solution to the above-mentioned problems, a flat type power supply element 16 as shown in FIG.
-162948). In the conventional example shown in FIG. 7, lead terminals 17 and 18 are attached in advance to each electrode of the flat type power supply element 16 by a method such as spot welding, with a welded portion 19 shown. When such a power source element 16 is built into an electronic device, the ends of the lead terminals 17 and 18 are soldered to a circuit board. According to such a structure, the power supply section can be made thinner than the structure shown in FIG. 6.
［発明が解決しようとする課題］
しかしながら、第７図に示した構造にも、解決されるべ
き問題があった。[Problems to be Solved by the Invention] However, the structure shown in FIG. 7 also had problems to be solved.
まず、リード端子１７および１８が比較的幅広のフィル
ム状であるため、半田付けが容易でなく、したがって、
半田付は工程を機械化することが困難であった。また、
半田付は後において、洗浄という煩雑な工程が必要にな
るという問題もあった。First, since the lead terminals 17 and 18 are in the form of a relatively wide film, it is difficult to solder them.
It was difficult to mechanize the soldering process. Also,
There is also the problem that a complicated process of cleaning is required after soldering.
また、このような洗浄工程は、通常、加温された溶剤を
用いて行なわれるが、電源素子１６は、−般的に、耐熱
性および耐溶剤性が十分ないため、半田付は後において
、溶剤中に浸漬して洗浄するといった方法は採用できな
い。Further, such a cleaning process is usually performed using a heated solvent, but since the power supply element 16 generally does not have sufficient heat resistance and solvent resistance, it is necessary to solder it later. Methods such as immersion in a solvent for cleaning cannot be adopted.
そこで、この発明は、リード端子を有する扁平型電源素
子において、リード端子を改良し、回路基板との接続を
容易にし、機械化を可能にするとともに、電気的接続の
信頼性を向上し、しかも洗浄を不要にしようとするもの
である。Therefore, the present invention improves the lead terminal in a flat power supply element having a lead terminal, facilitates connection with a circuit board, enables mechanization, improves reliability of electrical connection, and improves cleaning. The aim is to make it unnecessary.
［課題を解決するための手段］
この発明は、上述した技術的課題を解決するため、リー
ド端子の少なくとも一部を、導電性を有する熱接着性樹
脂で被覆したことを特徴とするものである。[Means for Solving the Problems] In order to solve the above-mentioned technical problems, the present invention is characterized in that at least a part of the lead terminal is coated with a conductive heat-adhesive resin. .
［発明の作用および効果］
この発明によれば、リード端子を、これと接続される−
べき回路基板上に重ねれた状態とし、リード端子の所定
の部分を加圧しながら加熱することにより、リード端子
は、回路基板に対して、導電性を有する熱接着性樹脂を
介して電気的に接続されるとともに機械的に固定される
。[Operations and Effects of the Invention] According to the present invention, the lead terminal is connected to the -
By stacking the lead terminal on the circuit board to be used and heating it while applying pressure to a predetermined part of the lead terminal, the lead terminal becomes electrically connected to the circuit board through the conductive thermal adhesive resin. connected and mechanically fixed.
したがって、回路基板への接続工程が容易になり、これ
を機械化することも可能になる。また、半田付けを行な
わないので、接続後において洗浄する必要はない。また
、熱接着性樹脂で確実に電気的接続が達成されるので、
このような電気的接続の信頼性を向上できる。また、リ
ード端子を問題なく薄型化することができるので、この
ような電源素子をもって構成される電源部を薄型化する
のに適している。Therefore, the process of connecting to the circuit board becomes easy and can be mechanized. Furthermore, since no soldering is performed, there is no need to clean after connection. In addition, since a reliable electrical connection is achieved with thermoadhesive resin,
The reliability of such electrical connections can be improved. Further, since the lead terminal can be made thinner without any problem, it is suitable for making a power supply unit including such a power supply element thinner.
［実施例］
第１図には、この発明の一実施例としての扁平型電源素
子２０が斜視図で示されている。[Example] FIG. 1 shows a perspective view of a flat power supply element 20 as an example of the present invention.
電源素子２０は、第７図に示した電源素子１６と同様、
リード端子２１および２２が、溶接部２３で示したよう
に、異なる電極にたとえばスポット溶接により取付けら
れた構造を有している。なお、リード端子２１および２
２は、その平面方向での位置が互いにずらされている。The power supply element 20 is similar to the power supply element 16 shown in FIG.
The lead terminals 21 and 22 have a structure in which they are attached to different electrodes by, for example, spot welding, as shown by the welded portion 23. Note that the lead terminals 21 and 2
2, their positions in the plane direction are shifted from each other.
このようなリード端子２１および２２の各一部であって
、回路基板との接続部となるべき部分は、予め、導電性
を有する熱接着性樹脂２４で被覆される。Parts of each of the lead terminals 21 and 22 that are to be connected to the circuit board are coated in advance with a conductive heat-adhesive resin 24.
このような熱接着性樹脂２４としては、金属接着性のす
ぐれた変性ポリエチレンにケッチエンブラックを混合し
た後、５０μｍの厚みに成形したフィルム（体積固有抵
抗二３．６Ω・ｃｍ）が−例として用いられ、このよう
なフィルムがリード端子２１および２２の所定の部分に
貼り付けられる。なお、熱接着性樹脂２４としては、こ
れに限定されるものではなく、たとえば、リード端子２
１および２２等を構成する金属に適したホットメルト接
着剤に金属粉末やカーボンブラックを混合した材料を加
熱溶融状態でリード端子２１および２２の所定の部分に
塗布して形成してもよい。As such a thermal adhesive resin 24, for example, a film (volume specific resistance: 3.6 Ωcm) formed by mixing Ketchen Black with modified polyethylene having excellent metal adhesion and then molding the mixture to a thickness of 50 μm is used. Such a film is attached to predetermined portions of lead terminals 21 and 22. Note that the thermal adhesive resin 24 is not limited to this, and for example, the lead terminal 2
The lead terminals 21 and 22 may be formed by applying a material prepared by mixing a hot melt adhesive suitable for the metals composing the lead terminals 1 and 22 with metal powder or carbon black to predetermined portions of the lead terminals 21 and 22 in a heated and molten state.
第１図に示した電源素子２０は、たとえば、前述した第
４図に示したペーパー状のリチウム電池であると理解す
ればよい。したがって、第２図では、第４図に示す部分
に相当の部分には、同様の参照番号が付されている。第
２図を参照して、電源素子２０を回路基板２５に接続す
るにあたっては、回路基板２５上に、熱接着性樹脂２４
が接触するように、たとえばリード端子２１を重ね、熱
接着性樹脂２４が形成されたリード端子２１の所定の領
域を上方から加圧しながら加熱すればよい。The power supply element 20 shown in FIG. 1 may be understood to be, for example, the paper-shaped lithium battery shown in FIG. 4 described above. Therefore, in FIG. 2, parts corresponding to those shown in FIG. 4 are given the same reference numerals. Referring to FIG. 2, when connecting the power supply element 20 to the circuit board 25, a thermal adhesive resin 24 is placed on the circuit board 25.
For example, the lead terminals 21 may be overlapped so that they are in contact with each other, and a predetermined region of the lead terminal 21 on which the thermoadhesive resin 24 is formed is heated while being pressed from above.
これによって、はぼ瞬時に、電気的接続および機械的固
定が達成される。もう一方のリード端子２２についても
、同様の操作を行なえばよい。This achieves electrical connection and mechanical fixation almost instantaneously. Similar operations may be performed for the other lead terminal 22 as well.
第３図に示すように、リード端子２１ａおよび２２ａが
上下方向に整列して取付けられた扁平型電源素子２０ａ
とされてもよい。この電源素子２２ａによれば、回路基
板２５が、リード端子２１ａおよび２２ａによって挾持
され、そのため、１回の操作によって、リード端子２１
ａおよび２２ａの双方の接続を達成することができる。As shown in FIG. 3, a flat power supply element 20a has lead terminals 21a and 22a aligned in the vertical direction.
may be taken as According to this power supply element 22a, the circuit board 25 is held between the lead terminals 21a and 22a, and therefore, by one operation, the lead terminal 21
Both a and 22a connections can be achieved.
なお、この発明が適用される扁平型電源素子としては、
第４図に示すようなペーパー状のリチウム電池等の電池
のほか、同じく第４図に示すような構造を有する電気二
重層コンデンサであっても、あるいは、第５図に示すよ
うな構造を有する電気二重層コンデンサまたは電池であ
ってもよい。Note that the flat power supply element to which this invention is applied is as follows:
In addition to batteries such as paper-like lithium batteries as shown in Figure 4, electric double layer capacitors also have a structure as shown in Figure 4, or batteries as shown in Figure 5. It may be an electric double layer capacitor or a battery.
また、リード端子を被覆するように形成される導電性を
有する熱接着性樹脂は、少なくとも回路基板との接続部
となるべき部分に形成されていればよく、回路基板との
接続部が変更される場合には、それに応じて熱接着性樹
脂が形成される場所が変更されたりすることもあり得る
。また、扁平型電源素子の汎用性を考慮して、リード端
子の両面に熱接着性樹脂が形成されてもよい。Furthermore, the electrically conductive thermal adhesive resin formed to cover the lead terminals only needs to be formed at least in the part that should be connected to the circuit board, and the part connected to the circuit board is not changed. In this case, the location where the thermoadhesive resin is formed may be changed accordingly. Further, in consideration of the versatility of the flat power supply element, thermal adhesive resin may be formed on both surfaces of the lead terminal.
第１図は、この発明の一実施例としての扁平型電源素子
２０を示す斜視図である。第２図は、第１図に示した扁
平型電源素子２０を回路基板２５に接続した状態を示す
断面図である。第３図は、この発明の他の実施例として
の扁平型電源素子２０ａを回路基板２５に接続した状態
を示す断面図である。
第４図は、従来のペーパー状のリチウム電池の断面構造
の一例を概略的に示す図である。第５図は、本件出願人
が先に出願したペーパー状の電気二重層コンデンサの断
面構造を概略的に示す図である。
第６図は、第１の従来例としての扁平型電源素子１２と
回路基板１３との接続状態を示す正面図である。第７図
は、第２の従来例としての扁平型電源索子１６を示す斜
視図である。
図において、２０，２０ａは扁平型電源素子、２１．２
１ａ、２２，２２ａはリード端子、２３は溶接部、２４
は熱接着性樹脂、２５は回路基板である。FIG. 1 is a perspective view showing a flat power supply element 20 as an embodiment of the present invention. FIG. 2 is a sectional view showing a state in which the flat type power supply element 20 shown in FIG. 1 is connected to a circuit board 25. FIG. 3 is a sectional view showing a state in which a flat type power supply element 20a as another embodiment of the present invention is connected to a circuit board 25. FIG. 4 is a diagram schematically showing an example of the cross-sectional structure of a conventional paper-like lithium battery. FIG. 5 is a diagram schematically showing the cross-sectional structure of a paper-like electric double layer capacitor previously filed by the applicant of the present invention. FIG. 6 is a front view showing the connection state between the flat type power supply element 12 and the circuit board 13 as a first conventional example. FIG. 7 is a perspective view showing a flat power cord 16 as a second conventional example. In the figure, 20, 20a are flat power supply elements, 21.2
1a, 22, 22a are lead terminals, 23 is a welding part, 24
25 is a thermal adhesive resin, and 25 is a circuit board.
Claims (1)
ド端子の少なくとも一部が、導電性を有する熱接着性樹
脂で被覆されていることを特徴とする、扁平型電源素子
。1. A flat type power source element having lead terminals, wherein at least a portion of the lead terminals is coated with a conductive heat-adhesive resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63322392A JPH02165614A (en) | 1988-12-20 | 1988-12-20 | Flat power supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63322392A JPH02165614A (en) | 1988-12-20 | 1988-12-20 | Flat power supply device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02165614A true JPH02165614A (en) | 1990-06-26 |
Family
ID=18143154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63322392A Pending JPH02165614A (en) | 1988-12-20 | 1988-12-20 | Flat power supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02165614A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06349479A (en) * | 1993-06-11 | 1994-12-22 | Murata Mfg Co Ltd | Manufacture of flat power source element |
| JP2006004656A (en) * | 2004-06-15 | 2006-01-05 | Toppan Forms Co Ltd | Manufacturing method of power circuit and joining method of paper battery |
| GB2432051A (en) * | 2005-11-01 | 2007-05-09 | Avx Corp | Mounting a double layer capacitor on a printed circuit board |
| JP2017130442A (en) * | 2016-01-20 | 2017-07-27 | Fdk株式会社 | Laminate-type power storage element |
-
1988
- 1988-12-20 JP JP63322392A patent/JPH02165614A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06349479A (en) * | 1993-06-11 | 1994-12-22 | Murata Mfg Co Ltd | Manufacture of flat power source element |
| JP2006004656A (en) * | 2004-06-15 | 2006-01-05 | Toppan Forms Co Ltd | Manufacturing method of power circuit and joining method of paper battery |
| GB2432051A (en) * | 2005-11-01 | 2007-05-09 | Avx Corp | Mounting a double layer capacitor on a printed circuit board |
| JP2007129229A (en) * | 2005-11-01 | 2007-05-24 | Avx Corp | Low esr electrochemical capacitor with connector |
| US7599191B2 (en) | 2005-11-01 | 2009-10-06 | Avx Corporation | Electrochemical low ESR capacitor with connector |
| GB2432051B (en) * | 2005-11-01 | 2011-05-18 | Avx Corp | Electrochemical low ESR capacitor with connector |
| JP2013102224A (en) * | 2005-11-01 | 2013-05-23 | Avx Corp | Electrochemical low esr capacitor with connector |
| JP2017130442A (en) * | 2016-01-20 | 2017-07-27 | Fdk株式会社 | Laminate-type power storage element |
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