GB2288229B - Method and apparatus for perforating printed circuit board - Google Patents

Method and apparatus for perforating printed circuit board

Info

Publication number
GB2288229B
GB2288229B GB9506639A GB9506639A GB2288229B GB 2288229 B GB2288229 B GB 2288229B GB 9506639 A GB9506639 A GB 9506639A GB 9506639 A GB9506639 A GB 9506639A GB 2288229 B GB2288229 B GB 2288229B
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
perforating
perforating printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9506639A
Other versions
GB2288229A (en
GB9506639D0 (en
Inventor
Tsutomu Saito
Shinichi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Precision Inc
Seikosha KK
Original Assignee
Seiko Precision Inc
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Precision Inc, Seikosha KK filed Critical Seiko Precision Inc
Publication of GB9506639D0 publication Critical patent/GB9506639D0/en
Publication of GB2288229A publication Critical patent/GB2288229A/en
Application granted granted Critical
Publication of GB2288229B publication Critical patent/GB2288229B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/02—Means for moving the cutting member into its operative position for cutting
    • B26D5/06—Means for moving the cutting member into its operative position for cutting by electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
    • B26D5/30—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member controlled by scanning a record carrier
    • B26D5/34—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member controlled by scanning a record carrier scanning being effected by a photosensitive device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/015—Means for holding or positioning work for sheet material or piles of sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/08—Means for actuating the cutting member to effect the cut
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control Of Cutting Processes (AREA)
GB9506639A 1994-03-31 1995-03-31 Method and apparatus for perforating printed circuit board Expired - Fee Related GB2288229B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6063055A JP3030749B2 (en) 1994-03-31 1994-03-31 Drilling method and apparatus for printed circuit board

Publications (3)

Publication Number Publication Date
GB9506639D0 GB9506639D0 (en) 1995-05-24
GB2288229A GB2288229A (en) 1995-10-11
GB2288229B true GB2288229B (en) 1998-07-01

Family

ID=13218279

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9506639A Expired - Fee Related GB2288229B (en) 1994-03-31 1995-03-31 Method and apparatus for perforating printed circuit board

Country Status (4)

Country Link
JP (1) JP3030749B2 (en)
KR (1) KR0134917B1 (en)
GB (1) GB2288229B (en)
TW (1) TW247392B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118398A (en) * 2000-10-05 2002-04-19 Fuji Mach Mfg Co Ltd Method for detecting position of printed circuit board
US6701197B2 (en) 2000-11-08 2004-03-02 Orbotech Ltd. System and method for side to side registration in a printed circuit imager
TWI246382B (en) 2000-11-08 2005-12-21 Orbotech Ltd Multi-layer printed circuit board fabrication system and method
US6819789B1 (en) 2000-11-08 2004-11-16 Orbotech Ltd. Scaling and registration calibration especially in printed circuit board fabrication
JP4980857B2 (en) * 2007-11-13 2012-07-18 日立ビアメカニクス株式会社 Machining failure prevention method in drilling machine
US20120144968A1 (en) * 2010-12-09 2012-06-14 Cascade Dafo, Inc Clamping tool for use in manufacturing foot orthosis support devices
CN104149125B (en) * 2013-05-14 2015-12-23 大族激光科技产业集团股份有限公司 A kind of detection method of PCB mechanical drilling machine borehole accuracy
JP6148976B2 (en) * 2013-12-18 2017-06-14 株式会社ミマキエンジニアリング Boundary determination method and media cutting method
CN103707356B (en) * 2013-12-20 2015-08-19 沈阳橡胶研究设计院有限公司 A kind of large-scale rubber is all apart from fixed number drilling method
CN104802214A (en) * 2015-03-27 2015-07-29 深圳市五株科技股份有限公司 Drilling method of overlength printed circuit board
CN106813815B (en) * 2015-11-27 2019-03-01 苏州市亿利华电子有限公司 A kind of pcb board contraposition automatic detection device
JP6739259B2 (en) * 2016-07-06 2020-08-12 セイコータイムシステム株式会社 Punching device
JP6252809B1 (en) * 2016-09-14 2017-12-27 株式会社ムラキ Automatic transfer device applied to multilayer circuit board reference drilling machine
CN108966500A (en) * 2018-08-07 2018-12-07 向耀 The pcb board of view-based access control model tracking is secondary and multiple accurate drilling method
CN110831326B (en) * 2019-10-21 2021-07-09 鹤山市世安电子科技有限公司 Method, device and equipment for controlling tolerance of crimping hole and storage medium

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2243214A (en) * 1990-03-26 1991-10-23 Seikosha Kk Method and apparatus for machining or otherwise treating a member at at least two desired positions

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2550615B2 (en) * 1987-10-30 1996-11-06 ソニー株式会社 Numerically controlled drilling device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2243214A (en) * 1990-03-26 1991-10-23 Seikosha Kk Method and apparatus for machining or otherwise treating a member at at least two desired positions

Also Published As

Publication number Publication date
JPH07266198A (en) 1995-10-17
KR950026620A (en) 1995-10-16
JP3030749B2 (en) 2000-04-10
GB2288229A (en) 1995-10-11
GB9506639D0 (en) 1995-05-24
TW247392B (en) 1995-05-11
KR0134917B1 (en) 1998-04-23

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee