AU5536394A - Method and apparatus for soldering circuit boards - Google Patents

Method and apparatus for soldering circuit boards

Info

Publication number
AU5536394A
AU5536394A AU55363/94A AU5536394A AU5536394A AU 5536394 A AU5536394 A AU 5536394A AU 55363/94 A AU55363/94 A AU 55363/94A AU 5536394 A AU5536394 A AU 5536394A AU 5536394 A AU5536394 A AU 5536394A
Authority
AU
Australia
Prior art keywords
circuit boards
soldering circuit
soldering
boards
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU55363/94A
Inventor
Larry N Velie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Velie Circuits Inc
Original Assignee
Velie Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Velie Circuits Inc filed Critical Velie Circuits Inc
Publication of AU5536394A publication Critical patent/AU5536394A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU55363/94A 1993-09-20 1993-09-20 Method and apparatus for soldering circuit boards Abandoned AU5536394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1993/008950 WO1995008403A1 (en) 1993-09-20 1993-09-20 Method and apparatus for soldering circuit boards

Publications (1)

Publication Number Publication Date
AU5536394A true AU5536394A (en) 1995-04-10

Family

ID=22236982

Family Applications (1)

Application Number Title Priority Date Filing Date
AU55363/94A Abandoned AU5536394A (en) 1993-09-20 1993-09-20 Method and apparatus for soldering circuit boards

Country Status (4)

Country Link
EP (1) EP0669857A4 (en)
JP (1) JPH08504062A (en)
AU (1) AU5536394A (en)
WO (1) WO1995008403A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5876499A (en) * 1991-05-08 1999-03-02 Lymn; Peter P. Solder spray leveller
TW415867B (en) * 1998-07-29 2000-12-21 Calsonic Corp Method for applying flux for use in brazing aluminum material, flux coating apparatus, and method for manufacturing a heat exchanger
DE69914421T2 (en) * 1998-08-25 2004-07-01 Calsonic Kansei Corp. Method and device for producing a heat exchanger core
GB2417139A (en) * 2004-08-13 2006-02-15 Siemens Aktiengesellschaft Printed circuit board

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3298588A (en) * 1964-01-23 1967-01-17 Sanders Associates Inc Printed circuit board and machine for soldering same
CA1162732A (en) * 1980-01-14 1984-02-28 James L. Kennon Continuous coater
DE3149588C2 (en) * 1981-12-15 1983-10-27 Howaldtswerke-Deutsche Werft Ag Hamburg Und Kiel, 2300 Kiel Method and device for applying a coating to thin, rigid panels by means of application rollers
US4685605A (en) * 1984-05-25 1987-08-11 The Htc Corporation Continuous solder system
DE209995T1 (en) * 1985-07-10 1990-11-08 Evenoak Ltd., Witham, Essex SOLDERING PROCEDURE.
US4720324A (en) * 1985-10-03 1988-01-19 Hayward John S Process for manufacturing printed circuit boards
DE3810653C1 (en) * 1988-03-29 1989-05-18 Dieter Dr.-Ing. Friedrich
JPH01265547A (en) * 1988-04-15 1989-10-23 Seiko Epson Corp Manufacture of flexible substrate module
US5246731A (en) * 1992-03-16 1993-09-21 Velie Circuits, Inc. Method of and apparatus for depositing solder on the terminal pads of printed circuit boards

Also Published As

Publication number Publication date
EP0669857A4 (en) 1996-05-22
WO1995008403A1 (en) 1995-03-30
JPH08504062A (en) 1996-04-30
EP0669857A1 (en) 1995-09-06

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