GB2289640B - Method for soldering electronic component and apparatus therefor - Google Patents

Method for soldering electronic component and apparatus therefor

Info

Publication number
GB2289640B
GB2289640B GB9410245A GB9410245A GB2289640B GB 2289640 B GB2289640 B GB 2289640B GB 9410245 A GB9410245 A GB 9410245A GB 9410245 A GB9410245 A GB 9410245A GB 2289640 B GB2289640 B GB 2289640B
Authority
GB
United Kingdom
Prior art keywords
electronic component
apparatus therefor
soldering electronic
soldering
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9410245A
Other versions
GB9410245D0 (en
GB2289640A (en
Inventor
Toshiyuki Nagatsuka
Yumiko Iijima
Hiroyuki Ohira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP4336735A priority Critical patent/JP2683713B2/en
Priority to FR9406175A priority patent/FR2720018B1/en
Priority to DE4417866A priority patent/DE4417866C2/en
Application filed by TDK Corp filed Critical TDK Corp
Priority to GB9410245A priority patent/GB2289640B/en
Publication of GB9410245D0 publication Critical patent/GB9410245D0/en
Publication of GB2289640A publication Critical patent/GB2289640A/en
Application granted granted Critical
Publication of GB2289640B publication Critical patent/GB2289640B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
GB9410245A 1992-11-24 1994-05-23 Method for soldering electronic component and apparatus therefor Expired - Fee Related GB2289640B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP4336735A JP2683713B2 (en) 1992-11-24 1992-11-24 Electronic component soldering method and apparatus
FR9406175A FR2720018B1 (en) 1992-11-24 1994-05-20 Method and apparatus for soldering electronic components.
DE4417866A DE4417866C2 (en) 1992-11-24 1994-05-20 Process for soldering electronic components and device therefor
GB9410245A GB2289640B (en) 1992-11-24 1994-05-23 Method for soldering electronic component and apparatus therefor

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4336735A JP2683713B2 (en) 1992-11-24 1992-11-24 Electronic component soldering method and apparatus
FR9406175A FR2720018B1 (en) 1992-11-24 1994-05-20 Method and apparatus for soldering electronic components.
DE4417866A DE4417866C2 (en) 1992-11-24 1994-05-20 Process for soldering electronic components and device therefor
GB9410245A GB2289640B (en) 1992-11-24 1994-05-23 Method for soldering electronic component and apparatus therefor

Publications (3)

Publication Number Publication Date
GB9410245D0 GB9410245D0 (en) 1994-07-13
GB2289640A GB2289640A (en) 1995-11-29
GB2289640B true GB2289640B (en) 1998-03-11

Family

ID=27435977

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9410245A Expired - Fee Related GB2289640B (en) 1992-11-24 1994-05-23 Method for soldering electronic component and apparatus therefor

Country Status (4)

Country Link
JP (1) JP2683713B2 (en)
DE (1) DE4417866C2 (en)
FR (1) FR2720018B1 (en)
GB (1) GB2289640B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3222796B2 (en) * 1997-02-06 2001-10-29 ティーディーケイ株式会社 Electronic component soldering equipment
DE102010054114A1 (en) * 2010-12-10 2012-06-14 Centrotherm Photovoltaics Ag Drying device for drying electronic silk-screen printing paste on surface of solar cell for manufacturing electrical strip conductor, has transport unit defining transport plane that lies between openings of supplying and exhausting units

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1330881A (en) * 1969-09-22 1973-09-19 Chausson Usines Sa Brazing furnace and process for aluminium radiator cores
GB1402174A (en) * 1971-08-09 1975-08-06 Chausson Usines Sa Brazing furnaces
US5163599A (en) * 1989-10-06 1992-11-17 Hitachi Techno Engineering Co., Ltd. Reflow soldering apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02396A (en) * 1987-11-30 1990-01-05 Furukawa Electric Co Ltd:The Heating method of soldered circuit board
US4876437A (en) * 1988-07-14 1989-10-24 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus
JPH064187B2 (en) * 1988-10-04 1994-01-19 権士 近藤 Reflow soldering equipment
JPH03268864A (en) * 1990-03-19 1991-11-29 Fujitsu Ltd Soldering reflow furnace
US5180096A (en) * 1990-07-25 1993-01-19 Nihon Den-Netsu Keiki Co., Ltd. Method and apparatus for reflow-soldering of printed circuit boards
JPH0739483Y2 (en) * 1990-11-15 1995-09-13 千住金属工業株式会社 Reflow furnace
JP2722142B2 (en) * 1991-07-31 1998-03-04 日本電気株式会社 Automatic reflow soldering equipment
JP3103410B2 (en) * 1991-12-20 2000-10-30 大阪酸素工業株式会社 Soldering method using special atmosphere gas
CH683736A5 (en) * 1992-05-27 1994-04-29 Kontakt Systeme Ag Continuous reflow soldering furnace - has cassette modules for heating and soldering components fitted to circuit boards carried through on a permeable conveyor
DE4302976A1 (en) * 1992-07-22 1994-01-27 Bosch Gmbh Robert Device and method for soldering components on circuit boards

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1330881A (en) * 1969-09-22 1973-09-19 Chausson Usines Sa Brazing furnace and process for aluminium radiator cores
GB1402174A (en) * 1971-08-09 1975-08-06 Chausson Usines Sa Brazing furnaces
US5163599A (en) * 1989-10-06 1992-11-17 Hitachi Techno Engineering Co., Ltd. Reflow soldering apparatus

Also Published As

Publication number Publication date
GB9410245D0 (en) 1994-07-13
DE4417866A1 (en) 1995-11-23
JP2683713B2 (en) 1997-12-03
DE4417866C2 (en) 2000-07-20
FR2720018A1 (en) 1995-11-24
GB2289640A (en) 1995-11-29
JPH06226438A (en) 1994-08-16
FR2720018B1 (en) 1996-08-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20070523