TW247392B - Drilling process for printed circuit board and its device - Google Patents

Drilling process for printed circuit board and its device

Info

Publication number
TW247392B
TW247392B TW083111281A TW83111281A TW247392B TW 247392 B TW247392 B TW 247392B TW 083111281 A TW083111281 A TW 083111281A TW 83111281 A TW83111281 A TW 83111281A TW 247392 B TW247392 B TW 247392B
Authority
TW
Taiwan
Prior art keywords
identification mark
drilling
location
printed circuit
circuit board
Prior art date
Application number
TW083111281A
Other languages
Chinese (zh)
Inventor
Tsutomu Saitou
Shinichi Kato
Original Assignee
Seikosya Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosya Kk filed Critical Seikosya Kk
Application granted granted Critical
Publication of TW247392B publication Critical patent/TW247392B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/02—Means for moving the cutting member into its operative position for cutting
    • B26D5/06—Means for moving the cutting member into its operative position for cutting by electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
    • B26D5/30—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member controlled by scanning a record carrier
    • B26D5/34—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member controlled by scanning a record carrier scanning being effected by a photosensitive device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/015—Means for holding or positioning work for sheet material or piles of sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/08—Means for actuating the cutting member to effect the cut
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Drilling And Boring (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control Of Cutting Processes (AREA)

Abstract

A drilling process for printed circuit board, which is characterized in that the process comprises: clamping the printed circuit board base plate by a clamping mechanism to form a pair of identification mark on the board, installing first identification mark on a image domain which can be photographed by a photographic means; photographing the first identification mark by the photographic means; detecting out location of the first identification mark by location data detected by the movement detection means of the clamping mechanism and processed result from the image taken by the photographic means; moving the clamping element to move the printed circuit board base plate in order to move the second identification mark into the image domain of the photographic means; photographing the second identification mark by the photographic means; detecting out location of the second identification mark by location data detected by the movement detection means of the clamping mechanism and processed result from the image taken by the photographic means; comparing the location data of the first and second identification marks with hole location data stored in the memory circuit, and using the difference with the first identification mark as the first correction value and the difference with the second identification mark as the second correction value, and using the second correction value to calculate the location of second drill hole; drilling the second drill hole by using the drilling means; moving the clamping mechanism to move the printed circuit board base plate to set the first identification mark in the image domain of the photographic means; using the location data of clamping mechanism detected by the movement detection means and location data of the first and second identification marks to calculate the correction value of the first identification mark and the modified first drilling location; using the drilling means to drill hole at the first drilling location.
TW083111281A 1994-03-31 1994-12-05 Drilling process for printed circuit board and its device TW247392B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6063055A JP3030749B2 (en) 1994-03-31 1994-03-31 Drilling method and apparatus for printed circuit board

Publications (1)

Publication Number Publication Date
TW247392B true TW247392B (en) 1995-05-11

Family

ID=13218279

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111281A TW247392B (en) 1994-03-31 1994-12-05 Drilling process for printed circuit board and its device

Country Status (4)

Country Link
JP (1) JP3030749B2 (en)
KR (1) KR0134917B1 (en)
GB (1) GB2288229B (en)
TW (1) TW247392B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6701197B2 (en) 2000-11-08 2004-03-02 Orbotech Ltd. System and method for side to side registration in a printed circuit imager
CN104149125A (en) * 2013-05-14 2014-11-19 深圳市大族激光科技股份有限公司 Method for detecting drilling precision of PCB mechanical drilling machine
TWI716590B (en) * 2016-07-06 2021-01-21 日商精工計時系統有限公司 Boring device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118398A (en) * 2000-10-05 2002-04-19 Fuji Mach Mfg Co Ltd Method for detecting position of printed circuit board
TWI246382B (en) 2000-11-08 2005-12-21 Orbotech Ltd Multi-layer printed circuit board fabrication system and method
US6819789B1 (en) 2000-11-08 2004-11-16 Orbotech Ltd. Scaling and registration calibration especially in printed circuit board fabrication
JP4980857B2 (en) * 2007-11-13 2012-07-18 日立ビアメカニクス株式会社 Machining failure prevention method in drilling machine
US20120144968A1 (en) * 2010-12-09 2012-06-14 Cascade Dafo, Inc Clamping tool for use in manufacturing foot orthosis support devices
JP6148976B2 (en) * 2013-12-18 2017-06-14 株式会社ミマキエンジニアリング Boundary determination method and media cutting method
CN103707356B (en) * 2013-12-20 2015-08-19 沈阳橡胶研究设计院有限公司 A kind of large-scale rubber is all apart from fixed number drilling method
CN104802214A (en) * 2015-03-27 2015-07-29 深圳市五株科技股份有限公司 Drilling method of overlength printed circuit board
CN106813815B (en) * 2015-11-27 2019-03-01 苏州市亿利华电子有限公司 A kind of pcb board contraposition automatic detection device
JP6252809B1 (en) * 2016-09-14 2017-12-27 株式会社ムラキ Automatic transfer device applied to multilayer circuit board reference drilling machine
CN108966500A (en) * 2018-08-07 2018-12-07 向耀 The pcb board of view-based access control model tracking is secondary and multiple accurate drilling method
CN110831326B (en) * 2019-10-21 2021-07-09 鹤山市世安电子科技有限公司 Method, device and equipment for controlling tolerance of crimping hole and storage medium

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2550615B2 (en) * 1987-10-30 1996-11-06 ソニー株式会社 Numerically controlled drilling device
JP2561166B2 (en) * 1990-03-26 1996-12-04 株式会社精工舎 Method and device for punching printed circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6701197B2 (en) 2000-11-08 2004-03-02 Orbotech Ltd. System and method for side to side registration in a printed circuit imager
CN104149125A (en) * 2013-05-14 2014-11-19 深圳市大族激光科技股份有限公司 Method for detecting drilling precision of PCB mechanical drilling machine
CN104149125B (en) * 2013-05-14 2015-12-23 大族激光科技产业集团股份有限公司 A kind of detection method of PCB mechanical drilling machine borehole accuracy
TWI716590B (en) * 2016-07-06 2021-01-21 日商精工計時系統有限公司 Boring device

Also Published As

Publication number Publication date
KR0134917B1 (en) 1998-04-23
GB9506639D0 (en) 1995-05-24
JP3030749B2 (en) 2000-04-10
KR950026620A (en) 1995-10-16
GB2288229A (en) 1995-10-11
JPH07266198A (en) 1995-10-17
GB2288229B (en) 1998-07-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees