AU4907699A - Method and device for cleaning a printed-circuit board mask or a printed-circuitboard - Google Patents

Method and device for cleaning a printed-circuit board mask or a printed-circuitboard

Info

Publication number
AU4907699A
AU4907699A AU49076/99A AU4907699A AU4907699A AU 4907699 A AU4907699 A AU 4907699A AU 49076/99 A AU49076/99 A AU 49076/99A AU 4907699 A AU4907699 A AU 4907699A AU 4907699 A AU4907699 A AU 4907699A
Authority
AU
Australia
Prior art keywords
printed
circuitboard
cleaning
circuit board
board mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU49076/99A
Inventor
Hans-Erdreich Kiecker
Armin Rahn
Berthold Trampusch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Original Assignee
Air Liquide SA
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide SA, LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude filed Critical Air Liquide SA
Publication of AU4907699A publication Critical patent/AU4907699A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/02—Abrasive blasting machines or devices; Plants characterised by the arrangement of the component assemblies with respect to each other
    • B24C3/04—Abrasive blasting machines or devices; Plants characterised by the arrangement of the component assemblies with respect to each other stationary
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/083—Evaporation or sublimation of a compound, e.g. gas bubble generating agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cleaning In General (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU49076/99A 1998-06-29 1999-06-23 Method and device for cleaning a printed-circuit board mask or a printed-circuitboard Abandoned AU4907699A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19828987A DE19828987A1 (en) 1998-06-29 1998-06-29 Method and device for cleaning a circuit board template or a circuit board
DE19828987 1998-06-29
PCT/EP1999/004697 WO2000000326A1 (en) 1998-06-29 1999-06-23 Method and device for cleaning a printed-circuit board mask or a printed-circuit board

Publications (1)

Publication Number Publication Date
AU4907699A true AU4907699A (en) 2000-01-17

Family

ID=7872396

Family Applications (1)

Application Number Title Priority Date Filing Date
AU49076/99A Abandoned AU4907699A (en) 1998-06-29 1999-06-23 Method and device for cleaning a printed-circuit board mask or a printed-circuitboard

Country Status (6)

Country Link
EP (1) EP1091830A1 (en)
JP (1) JP2002519205A (en)
CN (1) CN1305404A (en)
AU (1) AU4907699A (en)
DE (1) DE19828987A1 (en)
WO (1) WO2000000326A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468833B2 (en) 2000-03-31 2002-10-22 American Air Liquide, Inc. Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods
DE10040335A1 (en) * 2000-08-17 2002-03-14 Messer Griesheim Gmbh Cleaning method for electronic components such as circuit boards contaminated with solder paste or adhesive in production process, using dry ice particle beam
GB2451656A (en) * 2007-08-07 2009-02-11 Boc Group Plc Method and apparatus for cleaning a printed circuit board
FR2932642B1 (en) * 2008-06-16 2011-01-07 Air Liquide METHOD FOR BRAZING ELECTRONIC COMPONENTS INCORPORATING A COMBINED COOLING STEP AND CLEANING THE CARDS AFTER BRAZING
FR2956600B1 (en) * 2010-02-22 2012-09-28 Erick Canicas PROCESS FOR THE ECOLOGICAL CLEANING OF A COOKING RACK
DE102010047275A1 (en) 2010-10-01 2012-04-05 Emitec Gesellschaft Für Emissionstechnologie Mbh exhaust system
CN102198640A (en) * 2011-05-17 2011-09-28 张家港玉成精机有限公司 Cantilever water gun
DE102015219429A1 (en) 2015-10-07 2017-04-13 Bayerische Motoren Werke Aktiengesellschaft Process for cleaning with solid carbon dioxide
DE102015219430A1 (en) * 2015-10-07 2017-04-13 Bayerische Motoren Werke Aktiengesellschaft Device for cleaning adhesive surfaces
DE102015117558A1 (en) * 2015-10-15 2017-04-20 Lpkf Laser & Electronics Ag Process for producing structured coatings on a molded part and apparatus for carrying out the process
GB201721176D0 (en) * 2017-12-18 2018-01-31 Semblant Ltd Method and apparatus for removing a conformal coating from a circuit board
DE102018115026A1 (en) * 2018-06-22 2019-12-24 Ifm Electronic Gmbh Cleaning process for an electronic board equipped with electronic components
DE102019215745B4 (en) * 2019-10-14 2022-03-03 Festo Se & Co. Kg processing facility
DE102020133006B4 (en) 2019-12-10 2024-10-24 Ifm Electronic Gmbh Cleaning process for a flexible conductor film equipped with electronic components
WO2021259424A1 (en) * 2020-06-22 2021-12-30 Mycon Gmbh Method for cooling and/or separating adhesively bonded components and/or removing adhesive residues from surfaces and jet apparatus herefor
CN112566384B (en) * 2020-12-03 2022-08-19 江西威尔高电子股份有限公司 PCB prevents surface oxidation equipment

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409418A (en) * 1992-09-28 1995-04-25 Hughes Aircraft Company Electrostatic discharge control during jet spray
US5545073A (en) * 1993-04-05 1996-08-13 Ford Motor Company Silicon micromachined CO2 cleaning nozzle and method
US5366156A (en) * 1993-06-14 1994-11-22 International Business Machines Corporation Nozzle apparatus for producing aerosol
US5364472A (en) * 1993-07-21 1994-11-15 At&T Bell Laboratories Probemat cleaning system using CO2 pellets
US5390450A (en) * 1993-11-08 1995-02-21 Ford Motor Company Supersonic exhaust nozzle having reduced noise levels for CO2 cleaning system
US5520572A (en) * 1994-07-01 1996-05-28 Alpheus Cleaning Technologies Corp. Apparatus for producing and blasting sublimable granules on demand
DE19535557B4 (en) * 1995-09-25 2005-06-09 Air Liquide Gmbh Method and device for cleaning an inner wall of a mold by means of dry ice
US5616067A (en) * 1996-01-16 1997-04-01 Ford Motor Company CO2 nozzle and method for cleaning pressure-sensitive surfaces
DE19636304A1 (en) * 1996-09-06 1998-03-12 Linde Ag Method for finishing paint=covered wooden surfaces
DE29723141U1 (en) * 1997-03-25 1998-04-16 Air Liquide Gmbh Device for cleaning an inner wall of a mold using dry ice

Also Published As

Publication number Publication date
JP2002519205A (en) 2002-07-02
WO2000000326A1 (en) 2000-01-06
CN1305404A (en) 2001-07-25
DE19828987A1 (en) 2000-01-05
EP1091830A1 (en) 2001-04-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase