DE69616419D1 - Verfahren und Apparat zur Anbringung eines elektrischen Verbinders auf einer gedruckten Leiterplatte - Google Patents

Verfahren und Apparat zur Anbringung eines elektrischen Verbinders auf einer gedruckten Leiterplatte

Info

Publication number
DE69616419D1
DE69616419D1 DE69616419T DE69616419T DE69616419D1 DE 69616419 D1 DE69616419 D1 DE 69616419D1 DE 69616419 T DE69616419 T DE 69616419T DE 69616419 T DE69616419 T DE 69616419T DE 69616419 D1 DE69616419 D1 DE 69616419D1
Authority
DE
Germany
Prior art keywords
mounting
circuit board
printed circuit
electrical connector
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69616419T
Other languages
English (en)
Inventor
Stephen L Clark
David C Horchler
Stuart C Stoner
Glenn J Pontius
Iii William K Nailor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Berg Electronics Manufacturing BV
Original Assignee
Berg Electronics Manufacturing BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Berg Electronics Manufacturing BV filed Critical Berg Electronics Manufacturing BV
Application granted granted Critical
Publication of DE69616419D1 publication Critical patent/DE69616419D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7047—Locking or fixing a connector to a PCB with a fastener through a screw hole in the coupling device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69616419T 1995-05-17 1996-05-15 Verfahren und Apparat zur Anbringung eines elektrischen Verbinders auf einer gedruckten Leiterplatte Expired - Lifetime DE69616419D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/443,789 US5815917A (en) 1995-05-17 1995-05-17 Method and apparatus for mounting an electrical connector on a printed wiring board

Publications (1)

Publication Number Publication Date
DE69616419D1 true DE69616419D1 (de) 2001-12-06

Family

ID=23762214

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69616419T Expired - Lifetime DE69616419D1 (de) 1995-05-17 1996-05-15 Verfahren und Apparat zur Anbringung eines elektrischen Verbinders auf einer gedruckten Leiterplatte

Country Status (3)

Country Link
US (3) US5815917A (de)
EP (1) EP0743704B1 (de)
DE (1) DE69616419D1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5815917A (en) * 1995-05-17 1998-10-06 Berg Technology, Inc. Method and apparatus for mounting an electrical connector on a printed wiring board
US6231403B1 (en) 1997-03-07 2001-05-15 Berg Technology, Inc. Apparatus for assembling an electrical connector and method of use
TW354199U (en) * 1997-12-31 1999-03-01 Hon Hai Prec Ind Co Ltd Press-in aid for electric connector
US6507998B1 (en) * 1998-03-05 2003-01-21 Tektronix, Inc. Method of mounting an electrical receptacle on a substrate
BE1011920A3 (nl) * 1998-05-15 2000-03-07 Framatome Connectors Belgium Werkwijze en inrichting voor het positioneren van een plaat met bedrukte schakelingen in een pers.
US6233805B1 (en) 1999-09-15 2001-05-22 Lucent Technologiesinc. Arrangement for manipulating an pin in an electrical assembly including a reciprocating engaging member
US6581274B1 (en) 2000-05-24 2003-06-24 Trans Tron Ltd., Inc. Apparatus for configuring and inserting component leads into printed-circuit boards
US7678465B2 (en) * 2002-07-24 2010-03-16 Applied Thin Films, Inc. Aluminum phosphate compounds, compositions, materials and related metal coatings
WO2004016548A2 (en) * 2002-08-14 2004-02-26 Applied Thin Films, Inc. Aluminum phosphate compounds, compositions, materials and related composites.
US9055879B2 (en) * 2013-06-14 2015-06-16 Suunto Oy Device and method for assembling an electronic device and a flexible element for facilitating assembly of electronic components
KR20220159181A (ko) * 2021-05-25 2022-12-02 삼성전자주식회사 디스플레이 장치 및 그 제조 방법

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2856593A (en) * 1954-06-21 1958-10-14 United Shoe Machinery Corp Connector joint and method of making same
GB1196457A (en) * 1967-07-06 1970-06-24 Konstantin Alexee Konstantinov A Device for Upsetting Tubular Rivets
US3924325A (en) * 1974-07-02 1975-12-09 Molex Inc Method and apparatus for mounting terminal pins from a single side of a double sided terminal board
US3980367A (en) 1975-03-19 1976-09-14 Sealectro Corporation Electrical connector for joining conductors attached to printed circuit boards
US4287667A (en) * 1978-02-14 1981-09-08 Alps Electric Co., Ltd. Method of mounting an electrical component
US4328613A (en) * 1980-03-27 1982-05-11 Bell Telephone Laboratories, Incorporated Connector lead insertion method
US4812130A (en) * 1985-06-27 1989-03-14 Rca Licensing Corp. Printed circuit board with mounted terminal
US4717219A (en) 1986-06-19 1988-01-05 Amp Incorporated Electrical connector and assembly eyelets
US4719695A (en) * 1986-08-06 1988-01-19 Rca Corporation Printed circuit board support fixture for connector wire wrap pins
US4721470A (en) * 1987-04-13 1988-01-26 E. I. Du Pont De Nemours And Company Keys for electrical connectors
US4884336A (en) * 1987-09-22 1989-12-05 Amp Incorporated Method and apparatus for mounting electrical connectors to printed circuit boards
FR2646312B1 (fr) * 1989-04-21 1991-06-07 Cit Alcatel Support de composant pour fixation dudit composant a un circuit imprime, et procede de realisation et d'utilisation d'un tel support
US4953061A (en) * 1989-07-03 1990-08-28 Zenith Electronics Corporation Holder for printed circuit board components
US5066237A (en) 1990-10-22 1991-11-19 Itt Corporation Connector press fit eyelet
US5277618A (en) * 1991-05-02 1994-01-11 E. I. Du Pont Nemours And Company Connector having fixing means for mounting on a substrate
US5108308A (en) * 1991-05-31 1992-04-28 Amp Incorporated Pylon actuated locking eyelet
US5230639A (en) 1992-06-12 1993-07-27 Amp Incorporated Top activated eyelet and tool for use therewith
CA2104438C (en) * 1992-11-02 1996-07-02 James Stephen Chapman Method and apparatus for mounting connectors
US5815917A (en) * 1995-05-17 1998-10-06 Berg Technology, Inc. Method and apparatus for mounting an electrical connector on a printed wiring board
US5762523A (en) 1996-03-27 1998-06-09 Berg Technology, Inc. Device for mounting an electrical connector on a printed circuit board

Also Published As

Publication number Publication date
US5815917A (en) 1998-10-06
US6038762A (en) 2000-03-21
EP0743704A3 (de) 1997-07-23
EP0743704A2 (de) 1996-11-20
EP0743704B1 (de) 2001-10-31
US6230392B1 (en) 2001-05-15

Similar Documents

Publication Publication Date Title
DE69737375D1 (de) Verfahren zur Befestigung eines elektronischen Bauteils auf einer Leiterplatte und System zum Ausführen des Verfahrens
DE60109262D1 (de) Anschlussleiter und Verfahren zur Montierung eines Anschlussleiters auf einer Leiterplatte
DE69632516D1 (de) Verfahren und Vorrichtung zum Bestücken einer Leiterplatte mit elektronischen Bauteilen
DE69020696D1 (de) Verfahren zum Montieren eines elektrischen Bauteils auf einer Leiterplatte.
DE69410737D1 (de) Vorrichtung und Verfahren zum Löten von elektronischen Baugruppen auf Leiterplatten
DE69419300D1 (de) Leiterplatte und Randverbinder dafür, und Verfahren zur Vorbereitung eines Leiterplattenrandes
AU4813093A (en) A contactless test method and system for testing printed circuit boards
DE69032459T2 (de) Verfahren und Gerät zur Untersuchung eines leitenden Musters auf einer Leiterplatte
DE69125760D1 (de) Verfahren und Vorrichtung zur Prüfung eines Musters einer gedruckten Leiterplatte
GB2288084B (en) Apparatus and method for testing circuit traces on a flexible substrate
DE69810389D1 (de) Verfahren und Vorrichtung zur Befestigung von elektronischen Bauelementen auf einer Leiterplatte
DE69404082D1 (de) Verfahren zum Montieren eines elektronischen Bauelements auf einer flexiblen Leiterplatte
DE69113537D1 (de) Verfahren und Vorrichtung zur Musterprüfung gedrukter Schaltungsplatten.
DE59712869D1 (de) Vorrichtung und Verfahren zum Prüfen von Leiterplatten
DE69825079D1 (de) Einrichtung zur durchführung eines magnetkreises auf einer leiterplatte
DE69616419D1 (de) Verfahren und Apparat zur Anbringung eines elektrischen Verbinders auf einer gedruckten Leiterplatte
EP0488206A3 (en) Method of and apparatus for inspecting pattern on printed board
DE69314984D1 (de) Verfahren und Vorrichtung zum Austausch von elektronischen Bauelementen auf einer Leiterplatte
EP0488031A3 (en) Method of and apparatus for inspecting a printed circuit board
DE69514895T2 (de) Verfahren zur Montage eines Anschlussstiftes in einer flexiblen Leiterplatte
GB2288229B (en) Method and apparatus for perforating printed circuit board
DE69625127D1 (de) Verfahren zum Montieren eines elektronischen Bauteils auf einem Leitersubstrat und elektronische Vorrichtung unter Verwendung dieses Montierungsverfahrens
DE69005444T2 (de) Verfahren und vorrichtung zur fixierung eines elektronischen schaltungssubstrates auf einem träger.
DE59712870D1 (de) Vorrichtung und Verfahren zum Prüfen von unbestückten Leiterplatten
EP0487954A3 (en) Method of and apparatus for inspecting line width on printed board

Legal Events

Date Code Title Description
8332 No legal effect for de