AT380993B - Vorrichtung zur befestigung von schaltungselementen an einer leiterplatte fuer gedruckte schaltungen - Google Patents
Vorrichtung zur befestigung von schaltungselementen an einer leiterplatte fuer gedruckte schaltungenInfo
- Publication number
- AT380993B AT380993B AT0238881A AT238881A AT380993B AT 380993 B AT380993 B AT 380993B AT 0238881 A AT0238881 A AT 0238881A AT 238881 A AT238881 A AT 238881A AT 380993 B AT380993 B AT 380993B
- Authority
- AT
- Austria
- Prior art keywords
- printed circuits
- fastening
- circuit board
- circuit elements
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
- Y10S156/941—Means for delaminating semiconductive product
- Y10S156/942—Means for delaminating semiconductive product with reorientation means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
- Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
- Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
- Y10T156/1771—Turret or rotary drum-type conveyor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/5317—Laminated device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53435—Means to assemble or disassemble including assembly pallet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7275380A JPS571240A (en) | 1980-06-02 | 1980-06-02 | Equipping machine of chip type electronic parts |
JP7929680U JPS574275U (de) | 1980-06-09 | 1980-06-09 | |
JP1980164510U JPS6311759Y2 (de) | 1980-11-17 | 1980-11-17 | |
JP16450980U JPS6311755Y2 (de) | 1980-11-17 | 1980-11-17 | |
JP1980164813U JPS6311757Y2 (de) | 1980-11-19 | 1980-11-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA238881A ATA238881A (de) | 1985-12-15 |
AT380993B true AT380993B (de) | 1986-08-11 |
Family
ID=27524405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT0238881A AT380993B (de) | 1980-06-02 | 1981-05-27 | Vorrichtung zur befestigung von schaltungselementen an einer leiterplatte fuer gedruckte schaltungen |
Country Status (10)
Country | Link |
---|---|
US (1) | US4372802A (de) |
AT (1) | AT380993B (de) |
AU (1) | AU541607B2 (de) |
CA (1) | CA1165462A (de) |
CH (1) | CH656772A5 (de) |
DE (1) | DE3121716A1 (de) |
FR (1) | FR2483701A1 (de) |
GB (1) | GB2076709B (de) |
IT (1) | IT1136632B (de) |
NL (1) | NL8102679A (de) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4458412A (en) * | 1981-05-06 | 1984-07-10 | Universal Instruments Corporation | Leadless chip placement machine for printed circuit boards |
GB2108015B (en) * | 1981-08-24 | 1985-03-06 | Tdk Electronics Co Ltd | Apparatus for mounting chip type circuit elements on printed circuit boards |
NL8201532A (nl) * | 1982-04-13 | 1983-11-01 | Philips Nv | Werkwijze en inrichting voor het controleren van de aanwezigheid respectievelijk afwezigheid van een voorwerp op het uiteinde van een vacuuem-opnemer. |
JPS59161040A (ja) * | 1983-03-03 | 1984-09-11 | Shinkawa Ltd | インナ−リ−ドボンダ− |
CA1217572A (en) * | 1983-05-02 | 1987-02-03 | Kenichi Saito | Mounting apparatus for chip type electronic parts |
US4551913A (en) * | 1983-06-07 | 1985-11-12 | Zenith Electronics Corporation | Component delivery system |
SE454643B (sv) * | 1983-06-13 | 1988-05-16 | Sincotron Aps | Sett och anordning for att pa ett kretskort montera elektroniska komponenter |
US4915565A (en) * | 1984-03-22 | 1990-04-10 | Sgs-Thomson Microelectronics, Inc. | Manipulation and handling of integrated circuit dice |
US4626167A (en) * | 1984-03-22 | 1986-12-02 | Thomson Components-Mostek Corporation | Manipulation and handling of integrated circuit dice |
CA1246625A (en) * | 1984-04-06 | 1988-12-13 | Stanley R. Vancelette | Placement mechanism |
DE3532500C2 (de) * | 1984-09-17 | 1996-03-14 | Tdk Corp | Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette |
US4593462A (en) * | 1984-09-24 | 1986-06-10 | Tdk Corporation | Apparatus for automatically mounting chip-type circuit elements on substrate |
US4561178A (en) * | 1984-10-25 | 1985-12-31 | Amp Incorporated | Apparatus for installing connectors on flat cable having automatic connector delivery system and selective orientation feature for the connectors |
US4587703A (en) * | 1985-01-16 | 1986-05-13 | Apple Computer, Inc. | Method and apparatus using a multifaceted turret for robotic assembly |
US4978414A (en) * | 1985-01-18 | 1990-12-18 | Nippon Cmk Corp. | Apparatus for stretching silk including means to move cramp members independently of each other |
US4769904A (en) * | 1985-08-02 | 1988-09-13 | Universal Instruments Corporation | Method and apparatus for handling leaded and leadless surface mountable components |
US4802816A (en) * | 1985-10-08 | 1989-02-07 | Excellon Industries | Pick and place machine having improved centering jaws |
US4694570A (en) * | 1985-11-21 | 1987-09-22 | Amistar Corporation | Surface mounted component transport mechanism |
US4797994A (en) * | 1986-04-22 | 1989-01-17 | Kulicke & Soffa Industries, Inc. | Apparatus for and methods of die bonding |
US4876791A (en) * | 1986-04-22 | 1989-10-31 | Kulicke & Soffa Industries, Inc. | Apparatus for and methods of die bonding |
KR910000998B1 (ko) * | 1986-09-12 | 1991-02-19 | 마쯔시다덴기산교 가부시기가이샤 | 전자부품의 실장방법 |
JPH0191500A (ja) * | 1987-01-20 | 1989-04-11 | Ikegami Tsushinki Co Ltd | チップ部品の自動装着装置 |
GB8702617D0 (en) * | 1987-02-05 | 1987-03-11 | Dynapert Precima Ltd | Handling electrical/electronic components |
JPH088292B2 (ja) * | 1987-08-31 | 1996-01-29 | 住友電気工業株式会社 | チップ実装装置 |
DE3870811D1 (de) * | 1987-11-10 | 1992-06-11 | Siemens Ag | Vorrichtung und verfahren zum bestuecken von leiterplatten mit bauelementen. |
USRE35027E (en) * | 1988-09-22 | 1995-08-29 | Delaware Capital Formation, Inc. | Pick and place method and apparatus |
US4872258A (en) * | 1988-09-22 | 1989-10-10 | Universal Instruments Corporation | Pick and place method and apparatus |
KR900015590A (ko) * | 1989-03-23 | 1990-10-27 | 프레데릭 얀 스미트 | 캐리어상에 부품을 배치하는 방법 및 그 방법을 수행하기 위한 장치 |
US4995157A (en) * | 1989-05-16 | 1991-02-26 | Reel-Tech Inc. | Component feeder system |
DE59002636D1 (de) * | 1989-06-01 | 1993-10-14 | Siemens Ag | Vorrichtung zum handhaben von objekten und anwendung der vorrichtung. |
US4987676A (en) * | 1989-08-23 | 1991-01-29 | Quad Systems Corporation | End effector for a robotic system |
JP2773307B2 (ja) * | 1989-10-17 | 1998-07-09 | 松下電器産業株式会社 | 電子部品の実装方法 |
JPH0710493Y2 (ja) * | 1991-02-05 | 1995-03-08 | 株式会社エンヤシステム | ウエーハ貼付板 |
KR950011672B1 (ko) * | 1991-09-25 | 1995-10-07 | 가부시끼가이샤 도시바 | 연속식 워크피이스 운반조작에 의해서 워크피이스를 운반하는 방법 및 장치 |
TW200628B (de) * | 1991-09-26 | 1993-02-21 | Nippon Tobacco Sangyo Kk | |
JPH0590796A (ja) * | 1991-09-26 | 1993-04-09 | Japan Tobacco Inc | ワーク実装機 |
JPH0590789A (ja) * | 1991-09-26 | 1993-04-09 | Japan Tobacco Inc | ワーク実装機 |
TW199259B (de) * | 1991-09-26 | 1993-02-01 | Nippon Tobacco Sangyo Kk | |
US5327640A (en) * | 1991-10-31 | 1994-07-12 | The Whitaker Corporation | Press for assembling an electrical connector to a printed circuit board |
US5547537A (en) * | 1992-05-20 | 1996-08-20 | Kulicke & Soffa, Investments, Inc. | Ceramic carrier transport for die attach equipment |
US5265792A (en) * | 1992-08-20 | 1993-11-30 | Hewlett-Packard Company | Light source and technique for mounting light emitting diodes |
JP3368923B2 (ja) * | 1992-12-28 | 2003-01-20 | 松下電器産業株式会社 | 電子部品実装装置 |
JP2823481B2 (ja) * | 1993-05-26 | 1998-11-11 | 三洋電機株式会社 | 電子部品自動装着装置 |
US5397423A (en) * | 1993-05-28 | 1995-03-14 | Kulicke & Soffa Industries | Multi-head die bonding system |
KR0145258B1 (ko) * | 1993-11-16 | 1998-08-17 | 모리시타 요이찌 | 전자부품의 본딩장치 |
JP3313224B2 (ja) * | 1994-01-25 | 2002-08-12 | 松下電器産業株式会社 | 電子部品実装装置 |
JP2941658B2 (ja) * | 1994-07-08 | 1999-08-25 | 株式会社三協精機製作所 | 電子部品表面実装装置 |
JPH08162797A (ja) * | 1994-12-08 | 1996-06-21 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
WO1996028278A1 (en) * | 1995-03-13 | 1996-09-19 | Super Marketing, Inc. | An apparatus for retrieving randomly organized articles |
JP3132353B2 (ja) * | 1995-08-24 | 2001-02-05 | 松下電器産業株式会社 | チップの搭載装置および搭載方法 |
US5649356A (en) * | 1995-09-22 | 1997-07-22 | Universal Instruments Corporation | Method and apparatus for supplying and placing components |
JP3387881B2 (ja) * | 1999-03-17 | 2003-03-17 | ティーディーケイ株式会社 | 電子部品挿入ヘッドおよび電子部品挿入装置 |
US6192576B1 (en) * | 1999-06-15 | 2001-02-27 | Advanced Micro Devices, Inc. | Mechanism for loading a respective fuzz button into each of a high number of button holes within an IC contactor |
US7052225B2 (en) * | 2001-12-12 | 2006-05-30 | Intel Corporation | Apparatus for handling mass produced work pieces |
DE10203601A1 (de) * | 2002-01-30 | 2003-08-14 | Siemens Ag | Chipentnahmevorrichtung, Chipentnahmesystem, Bestücksystem und Verfahren zum Entnehmen von Chips von einem Wafer |
TW200616874A (en) * | 2004-09-22 | 2006-06-01 | Hallys Corp | Conveyance device |
DE602005020330D1 (de) * | 2004-09-22 | 2010-05-12 | Hallys Corp | Übertragungsvorrichtung |
DE102015013495B4 (de) * | 2015-10-16 | 2018-04-26 | Mühlbauer Gmbh & Co. Kg | Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2916165A (en) * | 1957-02-25 | 1959-12-08 | United Shoe Machinery Corp | Mechanisms for feeding disk-type capacitors and like articles |
US3499203A (en) * | 1965-05-27 | 1970-03-10 | Ibm | Chip positioning machine |
US3453714A (en) * | 1967-02-10 | 1969-07-08 | Ibm | Vacuum operated chip placement head |
US3475805A (en) * | 1967-06-26 | 1969-11-04 | Ibm | Apparatus for positioning articles on substrates |
US3909933A (en) * | 1973-03-30 | 1975-10-07 | Western Electric Co | Method for transferring and bonding articles |
US3946931A (en) * | 1974-11-27 | 1976-03-30 | Western Electric Company, Inc. | Methods of and apparatus for bonding an article to a substrate |
JPS52124168A (en) * | 1976-04-12 | 1977-10-18 | Matsushita Electric Ind Co Ltd | Method of assembling electronic device circuit |
US4135630A (en) * | 1977-12-08 | 1979-01-23 | Universal Instruments Corporation | Centering device for automatic placement of chip components in hybrid circuits |
US4189137A (en) * | 1978-04-14 | 1980-02-19 | The Mccall Pattern Company | Vacuum pickup device |
US4292116A (en) * | 1978-04-18 | 1981-09-29 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on a printed circuit board |
JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
FR2457057A1 (fr) * | 1979-05-14 | 1980-12-12 | Jaz Sa | Dispositif pour le montage de circuits integres sur une plaque de circuit imprime |
JPS55165643A (en) * | 1979-06-12 | 1980-12-24 | Fujitsu Ltd | Device for bonding pellet |
-
1981
- 1981-05-21 US US06/266,109 patent/US4372802A/en not_active Expired - Fee Related
- 1981-05-27 AT AT0238881A patent/AT380993B/de not_active IP Right Cessation
- 1981-05-29 GB GB8116472A patent/GB2076709B/en not_active Expired
- 1981-06-01 DE DE19813121716 patent/DE3121716A1/de not_active Withdrawn
- 1981-06-01 CA CA000378748A patent/CA1165462A/en not_active Expired
- 1981-06-02 CH CH3606/81A patent/CH656772A5/de not_active IP Right Cessation
- 1981-06-02 AU AU71255/81A patent/AU541607B2/en not_active Ceased
- 1981-06-02 FR FR8110918A patent/FR2483701A1/fr active Granted
- 1981-06-02 IT IT8122101A patent/IT1136632B/it active
- 1981-06-02 NL NL8102679A patent/NL8102679A/nl not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DE3121716A1 (de) | 1982-02-25 |
US4372802A (en) | 1983-02-08 |
IT8122101A0 (it) | 1981-06-02 |
FR2483701A1 (fr) | 1981-12-04 |
GB2076709B (en) | 1983-10-26 |
CH656772A5 (de) | 1986-07-15 |
NL8102679A (nl) | 1982-01-04 |
GB2076709A (en) | 1981-12-09 |
IT1136632B (it) | 1986-09-03 |
AU541607B2 (en) | 1985-01-10 |
FR2483701B1 (de) | 1984-05-04 |
AU7125581A (en) | 1981-12-10 |
ATA238881A (de) | 1985-12-15 |
CA1165462A (en) | 1984-04-10 |
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