CA1246625A - Placement mechanism - Google Patents
Placement mechanismInfo
- Publication number
- CA1246625A CA1246625A CA000474188A CA474188A CA1246625A CA 1246625 A CA1246625 A CA 1246625A CA 000474188 A CA000474188 A CA 000474188A CA 474188 A CA474188 A CA 474188A CA 1246625 A CA1246625 A CA 1246625A
- Authority
- CA
- Canada
- Prior art keywords
- spindle
- component
- rod
- placement
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Abstract
ABSTRACT
A placement mechanism for vertically displacing a micro-electronic component to place the component on a printed circuit board. The mechanism has a spindle that is displaceable on a vertical axis and rotatable on the vertical axis to align the component leads with the lands of the circuit on the board. The spindle carries a placement rod in communication with a vacuum source to enable the component to be retrieved and placed on the board. The placement rod has a resilient interconnection with the spindle to allow for varying board heights and to buffer the impact of the placement of the component on the board.
A placement mechanism for vertically displacing a micro-electronic component to place the component on a printed circuit board. The mechanism has a spindle that is displaceable on a vertical axis and rotatable on the vertical axis to align the component leads with the lands of the circuit on the board. The spindle carries a placement rod in communication with a vacuum source to enable the component to be retrieved and placed on the board. The placement rod has a resilient interconnection with the spindle to allow for varying board heights and to buffer the impact of the placement of the component on the board.
Description
PLACEMENT MECHANISM
.
Thls inventiorl relates to a meehanism for pieking up and placing on a substrate small artleles sueh as miero-elec-tronic componen-ts.
In the processing of micro-eleetronie eomponents (chips), the component is obtained from a supply source and trans-ported to a plaeement head having a placement mecharlism which pieks up the eomponent and places it on a printed circuit board. In eommonly owned U.S. Patent No. 4,501,064 issued February 26, 1985 sueh a component proeessing appara-tus is disclosed. Also disclosed in eommonly owned Canadian patent applica-tion Serial No. 469,748 filed Deeember 10, 1984 there is a mechanism for adjusting the position of the plaeemen-t head for different sized eomponents. In both of the above disclosures, -the placement head performs a motion on a vertical axis Erom the position of reeeiving the component to positioning the eomponent on -the printed cireuit board.
There are maehines for automa-tieally obtaining ehip si~e eomponents from a supply souree and transporting the component to a placement head which positions -the eomponent on a printed cireuit board. Examples of these maehines are illustrated in U.S. Patent Nos. 4,307,832; 4,327,482;
4,346,514 and 4,393,579. None of these maehines have a plaeement meehanism with a vertieal motion on a single axis during which the mechanism pieks up the component and moves the eomponent down to the board for positioning between the conduetive lands of -the eireuit on the board.
Further, the plaeement mechanisms are not rotationally positionable on the same axis -to align the eomponent with the eireuit on -the board.
~' i: :
:, .` ~``.~ ,~
.
4~
r~ ~S ~;
RIEF ~ RY OF THE IN~ rION
It is the purpose of this invention to provide a placement mechani~m that is vertically displaced to receive a micro-electronic component and place the cc~onent between the conductive lands on a printed circuit board.
It is also an object of this in~ention to provide a place~.ent mech~nism which can be moved on a single axis vertically from a position to receive a co~ponent and place the co~ponent on a board and also be rotated on the sane verticaI axis to align the leads of the component with the conductive lands of the circuit on the board.
It is a further object of this inventiorl to provide in a placement mecharlism a housing adapted to be posltioned above an article conveyor for receiving an article from the conveyor and placing the same on a substrate. A spindle is m~unted in the housing for up and down movement on a verticle axis and is adapted to rotate on that axis to properly align the article with preselected portions of the substrate. A plac~ment rod is mounted in the spindle and has a tip for receiving and holding the article.
There is a resilient interconnection between the spindle and the placement rod to buffer the i~pact o~ the plac~ment of the article on the substrate and to acconmodate variable thicknesses in the substrate. A resilient part of the tip also buffers the i~pact of the placenPnt Or the component on the board~ The rod ~d tip have a central opening which when subjected to a vacuum will retain the article on the tip and when subjected to an air blast wi]l release the article from the tip onto the substrate.
:
.. ~. . .
::
.
Thls inventiorl relates to a meehanism for pieking up and placing on a substrate small artleles sueh as miero-elec-tronic componen-ts.
In the processing of micro-eleetronie eomponents (chips), the component is obtained from a supply source and trans-ported to a plaeement head having a placement mecharlism which pieks up the eomponent and places it on a printed circuit board. In eommonly owned U.S. Patent No. 4,501,064 issued February 26, 1985 sueh a component proeessing appara-tus is disclosed. Also disclosed in eommonly owned Canadian patent applica-tion Serial No. 469,748 filed Deeember 10, 1984 there is a mechanism for adjusting the position of the plaeemen-t head for different sized eomponents. In both of the above disclosures, -the placement head performs a motion on a vertical axis Erom the position of reeeiving the component to positioning the eomponent on -the printed cireuit board.
There are maehines for automa-tieally obtaining ehip si~e eomponents from a supply souree and transporting the component to a placement head which positions -the eomponent on a printed cireuit board. Examples of these maehines are illustrated in U.S. Patent Nos. 4,307,832; 4,327,482;
4,346,514 and 4,393,579. None of these maehines have a plaeement meehanism with a vertieal motion on a single axis during which the mechanism pieks up the component and moves the eomponent down to the board for positioning between the conduetive lands of -the eireuit on the board.
Further, the plaeement mechanisms are not rotationally positionable on the same axis -to align the eomponent with the eireuit on -the board.
~' i: :
:, .` ~``.~ ,~
.
4~
r~ ~S ~;
RIEF ~ RY OF THE IN~ rION
It is the purpose of this invention to provide a placement mechani~m that is vertically displaced to receive a micro-electronic component and place the cc~onent between the conductive lands on a printed circuit board.
It is also an object of this in~ention to provide a place~.ent mech~nism which can be moved on a single axis vertically from a position to receive a co~ponent and place the co~ponent on a board and also be rotated on the sane verticaI axis to align the leads of the component with the conductive lands of the circuit on the board.
It is a further object of this inventiorl to provide in a placement mecharlism a housing adapted to be posltioned above an article conveyor for receiving an article from the conveyor and placing the same on a substrate. A spindle is m~unted in the housing for up and down movement on a verticle axis and is adapted to rotate on that axis to properly align the article with preselected portions of the substrate. A plac~ment rod is mounted in the spindle and has a tip for receiving and holding the article.
There is a resilient interconnection between the spindle and the placement rod to buffer the i~pact o~ the plac~ment of the article on the substrate and to acconmodate variable thicknesses in the substrate. A resilient part of the tip also buffers the i~pact of the placenPnt Or the component on the board~ The rod ~d tip have a central opening which when subjected to a vacuum will retain the article on the tip and when subjected to an air blast wi]l release the article from the tip onto the substrate.
:
.. ~. . .
::
2~;
STATEMENT OF INVENTION
According to a still further broad aspect of the present invention -there is provided a placement mechanism for orient-ing and positioning an electrical component on a substrate.
The mechanism comprises a housing adapted to be supported above the substrate and includes a cylindrical opening. A
spindle is rotatably mounted in -the opening about a vertical axis. The spindle has a lower end portion slidably receiving a placement rod that receives a component, and places the component on the substrate. A piston surrounds the spindle and is carried in the opening and movable in response to a fluid medium -to move -the spindle toward and away from the substrate along the ver-tical axis. Means interconnects the spin~le and the rod. This interconnecting means comprises a collar on the sp:Lndle and set screws threaded into the collar. The set screws are engageable with flat sides on the rod to maintain the spindle and the rod in axial align-ment. The collar is adjustably threaded onto the spidle ~o permit vertical adjustment Qf the rod relative to the spindle along the vertical axis. Means is provided to resiliently interconnect the spindle and the rod to cushion impact of the placement of the component-onto khe subs-trate and accom-modate substrates of different thickness. Means is also provided for rotating -the spindle and the rod to orient the component prior to its being positioned on the substrate.
BRIEF DECRIPTION OF THE DRAWINGS
. . _ Figure 1 is a side elevational view oE the placemerlt head;
Figure 2 is a sectional view of the placement mechanism of this invention; and Figure 3 is an exploded view of the placement mechanlsm of this invention.
:
.
DESCRIPTION OF THE PREFERRED EMBODIMENT
. . . _ The micro-electronic component assembly machine in which the placemen-t mechanism of this inventi.on is utili~ed in the type disclosed in commonly owned U.S. Patent No. 4,501,064 which issued on February 26, 1985. That component assembly machine utilizes an air conveyor to transport a cornponent from a s~pply source to apparatus receiving the component beneath the placemerlt head which positions the component on the board. In that disclosure and the disclosure of commonly owned Canadian Patent Appiication Serial No.
469,748 filed on December 10, 1984, the component receiving means is adjustable in position to accommodate various sizes of components to center the component in the placement head to assure the component leads are placed on -the conduc-tive lands of the circuit on the board. The disclosures of both -the aforementioned prior applications are incorporated here:in by reference.
In the componerlt placement machine illus-trated, a place-ment head 8 comprises an air conveyor 10 which transports the component (c) from a supply source (not shown) to a receiving means 12 positioned below the placement mechanism 14. The receiving means 12 comprises an adjustable shelf 16 posi-tioned by a piston 18 in a cylinder 20. The air in line 22 will move the piston 18 to position the shelf 16 inward underneath the placement mechanism 14 so that the component (c) in the shelf 16 can be picked up by the placement mechanism 14. Thereafter, air in line 24 will move the piston 18 to the right to move the shelf 16 outward to permit the placement.mechanism to move toward the board (not shown) to place the component on the board. A stop mechanism 26 ~ontrols the rearward movement of the piston 1~ to control the position of the shelf 16 underneath the placement mechanism.
~ :
1 ~e placement mechanism 14 is carried in a housing 28 supported on the machine support (not shown). The housing 28 has a stepped bore 30 having an upper portic)n 32 and a lower portion 34. A
spindle 36 is carried in the bore 30 an~ has a lower opening 38 car~ying a placement ro~ 40. The placen~nt rod 40 has an upper area 42 received within the opening 38 and a lower area 44 into which a tip or nozzle 46 is threaded at 48. An opening 50 passes through the placemen~ rod 40 and communicates with the interior of opening 38. A vacul~ line 52 is attached at 54 to the lower bore 34 and provides va~uun to the nozzle 46 through openings 56 in the spindle 36. A seal 58 surrounds the end 60 of placem~,nt rod 40. The rod 40 is norn~lly bia,sed downward by a spring 62 positioned bet~veen the end 6~ of opening 3$ ~md a plug 66. A collnr 68 is threaded around the end 70 of the spindle 36 and has set screws 72, 74 which ride against the flattened ides 76, 78 of the placement rod 40 to prevent rotation of the placement rod 40 in the spindle 36 for reasons that will bec~ne appflrent hereafter. The position of the collar 68 on the spindle 36 will adjust the spacin~ of the tip 46 from the shelf 16. The collar 58 is locked on spindle 36 by lock nut B9 to vertically position the tip 46 from the shelf 16. A
bearing gland 80 and seal 82 nre positioned around the spindle 36 to seal the lower bore 34 and provide thè lower bearing surface for the spindle 36. An additional seal 83 surrounds the spindle 36. In the operation of the placement mechani~n thus far described, vacuwn in the placement rod will retain a cor.ponent on the nozzle 4G. A~ a co~ponent is placed on the board, the spring 62 acting against the end of the placement rod 40 through plug 66 and will allow for ~arying board heights and buffer the i~pact of the placen~nt of the cc~ponent on the board.
.. ~
:
:
`
1 Attentio~ is now directed to ~igures 1 and 2 which illustrate the portion of the placemellt mechanisn ~Jhich lowers the placement rod 40 so that after a component is removed fra~ the shelf 16, the component can be lowered to a position on the board. kn insert 84 ~- 5 and seal 86 are located in the upper bore 32 to isolate the upperand lower portions of bore 30. ~n additional seal 87 surrounds the spindle 36. Positioned against the shoulder 88 of spindle 36 is a piston 90. The piston 90 is retained o~l the spindle 36 by a nut 92.
A resilient bu~,per 94 ~surrounds the spindle 36 between the piston 90 and the insert 84 to soften the impact of the piston 90 against the : insert 84.
I~e top 96 of the upper bore 32 in the housing 28 is enclosed by fl cap asse~ly 98 which permits the spindlc 36 to be n~vecl ~ ~d down in the housing d~ring the placement of the component on the board. The cap assembly 98 also permits the spindle 36 to be rotated so that the leads of the component (C) curried on noz~le 46 can be aligned with the lands of the circuit on the boa~d.
The cap assexbly 98 comprises a cup 100 having a bott~n portion 102 extending into the top 96 of the up~er bore 32. An annular : 20 groove 104 surrounds the bott~m portion 102 and contains a seal 106, to seal the bore 32. The spindle 36 is mounted through fl bearing 111 and a seal 110 in the opening 112 in the bott~ portion 102 of the cap assembly 98. The seal 110 is retained in opening 112 by a snap rin~ 114. The botton portion 102 also has a recess llG to 25~ acco~modate the nut 92 when the piston 90 is in the upper position.
A bumper 108 surrounds the bottom portion 1~2 to soften the i~pact ~ ~ of the piston 90 againæt the cap ass3Tbly 98.
: ~ A collar 118 is mounted in bearings 120, 122 which are separated by ~ spacer 124. A cap 126 is positioned between the béaring 120 and a pulley 128 intregal with the collar 118. A snap ~ .
~ .
:
1 ring 132 in annular groove 134 retains the bearings 120, 122 and spacer 124 on collar 118. Cap 126 is attached through cup 100 to housing 28 with screws 150. A spring washer 136 is positioned between the bearing 120 and the cap 126 in recess 138 to preload bearings 120, 122 for the purpose of remo~ing bearin~ clearanee which will give collar 118 a m~ore precise ~nd stable rotating motion.
A square rod 140 is positioned in the opening 142 in collar 118 and rests on the shoulder 144 on the spindle 360 An extensi~n 146 is threaded onto the end 148 of spindle 36 and secures the rod 140 to the spindle. The sclllare opening 142 in the collar 118 through which the ro~ 140 is posit~oned pernits the pulley 128 to rotatc the spindle 3fi while the spindle is reciprocnting. Ihe pulley 128 is driven by a belt 152 carried on a drive pulley 154 of motor 156.
Ihe motor 1~6, in response to progra~med control, rotates the spindle 36 and thus placement rod 40 to ~lign the corponent held on the end of the plac~ment rod with the desired locatic~n on the board.
The cap 126 and cap assembly 98 are assembled to the housing 28 ~y screws 150. In the assen~led condition ~Fig. 2) the bearing 122 Z rests against the shculder 158 in opening 160 of the CUp 100.
In operntion, after the vacutnn tip 46 picks the cc~ponent fron the shelf 16 ancl the shelf 16 mo~es forward, air in line 164 will Ic~er the pistOlt 90 an~ thus spindle 3~ to pe~mit the plac~ment rod to lower the cc~onent onto the printed circuit board. ~ith the resilient interconnection between the spindle and placement rod varying thicl~ess of the substrate are accc~moclated.
Since there is a cle~rance 165 arot~d the spindle 36 in the lower bore 3~t the vacut~n will continue to hold the component on the nozzle 46. Also, at the tin~ the cc~ponent reaches the board, the .
. . .
~L p"t ~
1 vacu~n in line 52 will be relieved and an air blast in line 52 will release the component frc~ the tip or no~zle ~6 onto the board.
Thereafter, air in line 162 will raise the spindle 36 uncl the shelf 16 will move inward to receive another comp~nent so that the tip 46 can pick another cc~ponent frcm shelf 16. Further, during this place~ent sequence, the rotational m~unting of the spin~le pe~mits the co~ponent to be aligned to assure that the component leads are properly placed on the lands of the circuit on the board.
The extension 146 on spindle 36 COflCtS with the switches 166 on the housing 28 to give an indication of the positiorl of the spindle 36.
Attention ls also directecl to the fnct that the nozzle 4fi has R
reccss or groove 17~1 in-to which the chip type corrponent nests. The gYoove 170 has an energy absor~ing material 172 to help bwffer the impact of the placenent of the co~ponent on the boarcl. F~lrtherj the co~onent iæ held between the sides 174, 176 of the groove 170 when the spindle 36 is rotated during the aligr~ent o~ the co~ponent with the circuit on the board.
It caIl thus be seen with the use of a spindle rotatably mounted in the placem~nt head housing and movable toward and away from the board, a cc~onent can be properly aligned with the circuit and easily ancl accurately placed on the board. FurtherJ with the placement rod slidably mounted in the spindle, the cc~ponent can be placed OTI uneven bvard surfaces with no damage to the co~ponent.
.~ .
, . . .
STATEMENT OF INVENTION
According to a still further broad aspect of the present invention -there is provided a placement mechanism for orient-ing and positioning an electrical component on a substrate.
The mechanism comprises a housing adapted to be supported above the substrate and includes a cylindrical opening. A
spindle is rotatably mounted in -the opening about a vertical axis. The spindle has a lower end portion slidably receiving a placement rod that receives a component, and places the component on the substrate. A piston surrounds the spindle and is carried in the opening and movable in response to a fluid medium -to move -the spindle toward and away from the substrate along the ver-tical axis. Means interconnects the spin~le and the rod. This interconnecting means comprises a collar on the sp:Lndle and set screws threaded into the collar. The set screws are engageable with flat sides on the rod to maintain the spindle and the rod in axial align-ment. The collar is adjustably threaded onto the spidle ~o permit vertical adjustment Qf the rod relative to the spindle along the vertical axis. Means is provided to resiliently interconnect the spindle and the rod to cushion impact of the placement of the component-onto khe subs-trate and accom-modate substrates of different thickness. Means is also provided for rotating -the spindle and the rod to orient the component prior to its being positioned on the substrate.
BRIEF DECRIPTION OF THE DRAWINGS
. . _ Figure 1 is a side elevational view oE the placemerlt head;
Figure 2 is a sectional view of the placement mechanism of this invention; and Figure 3 is an exploded view of the placement mechanlsm of this invention.
:
.
DESCRIPTION OF THE PREFERRED EMBODIMENT
. . . _ The micro-electronic component assembly machine in which the placemen-t mechanism of this inventi.on is utili~ed in the type disclosed in commonly owned U.S. Patent No. 4,501,064 which issued on February 26, 1985. That component assembly machine utilizes an air conveyor to transport a cornponent from a s~pply source to apparatus receiving the component beneath the placemerlt head which positions the component on the board. In that disclosure and the disclosure of commonly owned Canadian Patent Appiication Serial No.
469,748 filed on December 10, 1984, the component receiving means is adjustable in position to accommodate various sizes of components to center the component in the placement head to assure the component leads are placed on -the conduc-tive lands of the circuit on the board. The disclosures of both -the aforementioned prior applications are incorporated here:in by reference.
In the componerlt placement machine illus-trated, a place-ment head 8 comprises an air conveyor 10 which transports the component (c) from a supply source (not shown) to a receiving means 12 positioned below the placement mechanism 14. The receiving means 12 comprises an adjustable shelf 16 posi-tioned by a piston 18 in a cylinder 20. The air in line 22 will move the piston 18 to position the shelf 16 inward underneath the placement mechanism 14 so that the component (c) in the shelf 16 can be picked up by the placement mechanism 14. Thereafter, air in line 24 will move the piston 18 to the right to move the shelf 16 outward to permit the placement.mechanism to move toward the board (not shown) to place the component on the board. A stop mechanism 26 ~ontrols the rearward movement of the piston 1~ to control the position of the shelf 16 underneath the placement mechanism.
~ :
1 ~e placement mechanism 14 is carried in a housing 28 supported on the machine support (not shown). The housing 28 has a stepped bore 30 having an upper portic)n 32 and a lower portion 34. A
spindle 36 is carried in the bore 30 an~ has a lower opening 38 car~ying a placement ro~ 40. The placen~nt rod 40 has an upper area 42 received within the opening 38 and a lower area 44 into which a tip or nozzle 46 is threaded at 48. An opening 50 passes through the placemen~ rod 40 and communicates with the interior of opening 38. A vacul~ line 52 is attached at 54 to the lower bore 34 and provides va~uun to the nozzle 46 through openings 56 in the spindle 36. A seal 58 surrounds the end 60 of placem~,nt rod 40. The rod 40 is norn~lly bia,sed downward by a spring 62 positioned bet~veen the end 6~ of opening 3$ ~md a plug 66. A collnr 68 is threaded around the end 70 of the spindle 36 and has set screws 72, 74 which ride against the flattened ides 76, 78 of the placement rod 40 to prevent rotation of the placement rod 40 in the spindle 36 for reasons that will bec~ne appflrent hereafter. The position of the collar 68 on the spindle 36 will adjust the spacin~ of the tip 46 from the shelf 16. The collar 58 is locked on spindle 36 by lock nut B9 to vertically position the tip 46 from the shelf 16. A
bearing gland 80 and seal 82 nre positioned around the spindle 36 to seal the lower bore 34 and provide thè lower bearing surface for the spindle 36. An additional seal 83 surrounds the spindle 36. In the operation of the placement mechani~n thus far described, vacuwn in the placement rod will retain a cor.ponent on the nozzle 4G. A~ a co~ponent is placed on the board, the spring 62 acting against the end of the placement rod 40 through plug 66 and will allow for ~arying board heights and buffer the i~pact of the placen~nt of the cc~ponent on the board.
.. ~
:
:
`
1 Attentio~ is now directed to ~igures 1 and 2 which illustrate the portion of the placemellt mechanisn ~Jhich lowers the placement rod 40 so that after a component is removed fra~ the shelf 16, the component can be lowered to a position on the board. kn insert 84 ~- 5 and seal 86 are located in the upper bore 32 to isolate the upperand lower portions of bore 30. ~n additional seal 87 surrounds the spindle 36. Positioned against the shoulder 88 of spindle 36 is a piston 90. The piston 90 is retained o~l the spindle 36 by a nut 92.
A resilient bu~,per 94 ~surrounds the spindle 36 between the piston 90 and the insert 84 to soften the impact of the piston 90 against the : insert 84.
I~e top 96 of the upper bore 32 in the housing 28 is enclosed by fl cap asse~ly 98 which permits the spindlc 36 to be n~vecl ~ ~d down in the housing d~ring the placement of the component on the board. The cap assembly 98 also permits the spindle 36 to be rotated so that the leads of the component (C) curried on noz~le 46 can be aligned with the lands of the circuit on the boa~d.
The cap assexbly 98 comprises a cup 100 having a bott~n portion 102 extending into the top 96 of the up~er bore 32. An annular : 20 groove 104 surrounds the bott~m portion 102 and contains a seal 106, to seal the bore 32. The spindle 36 is mounted through fl bearing 111 and a seal 110 in the opening 112 in the bott~ portion 102 of the cap assembly 98. The seal 110 is retained in opening 112 by a snap rin~ 114. The botton portion 102 also has a recess llG to 25~ acco~modate the nut 92 when the piston 90 is in the upper position.
A bumper 108 surrounds the bottom portion 1~2 to soften the i~pact ~ ~ of the piston 90 againæt the cap ass3Tbly 98.
: ~ A collar 118 is mounted in bearings 120, 122 which are separated by ~ spacer 124. A cap 126 is positioned between the béaring 120 and a pulley 128 intregal with the collar 118. A snap ~ .
~ .
:
1 ring 132 in annular groove 134 retains the bearings 120, 122 and spacer 124 on collar 118. Cap 126 is attached through cup 100 to housing 28 with screws 150. A spring washer 136 is positioned between the bearing 120 and the cap 126 in recess 138 to preload bearings 120, 122 for the purpose of remo~ing bearin~ clearanee which will give collar 118 a m~ore precise ~nd stable rotating motion.
A square rod 140 is positioned in the opening 142 in collar 118 and rests on the shoulder 144 on the spindle 360 An extensi~n 146 is threaded onto the end 148 of spindle 36 and secures the rod 140 to the spindle. The sclllare opening 142 in the collar 118 through which the ro~ 140 is posit~oned pernits the pulley 128 to rotatc the spindle 3fi while the spindle is reciprocnting. Ihe pulley 128 is driven by a belt 152 carried on a drive pulley 154 of motor 156.
Ihe motor 1~6, in response to progra~med control, rotates the spindle 36 and thus placement rod 40 to ~lign the corponent held on the end of the plac~ment rod with the desired locatic~n on the board.
The cap 126 and cap assembly 98 are assembled to the housing 28 ~y screws 150. In the assen~led condition ~Fig. 2) the bearing 122 Z rests against the shculder 158 in opening 160 of the CUp 100.
In operntion, after the vacutnn tip 46 picks the cc~ponent fron the shelf 16 ancl the shelf 16 mo~es forward, air in line 164 will Ic~er the pistOlt 90 an~ thus spindle 3~ to pe~mit the plac~ment rod to lower the cc~onent onto the printed circuit board. ~ith the resilient interconnection between the spindle and placement rod varying thicl~ess of the substrate are accc~moclated.
Since there is a cle~rance 165 arot~d the spindle 36 in the lower bore 3~t the vacut~n will continue to hold the component on the nozzle 46. Also, at the tin~ the cc~ponent reaches the board, the .
. . .
~L p"t ~
1 vacu~n in line 52 will be relieved and an air blast in line 52 will release the component frc~ the tip or no~zle ~6 onto the board.
Thereafter, air in line 162 will raise the spindle 36 uncl the shelf 16 will move inward to receive another comp~nent so that the tip 46 can pick another cc~ponent frcm shelf 16. Further, during this place~ent sequence, the rotational m~unting of the spin~le pe~mits the co~ponent to be aligned to assure that the component leads are properly placed on the lands of the circuit on the board.
The extension 146 on spindle 36 COflCtS with the switches 166 on the housing 28 to give an indication of the positiorl of the spindle 36.
Attention ls also directecl to the fnct that the nozzle 4fi has R
reccss or groove 17~1 in-to which the chip type corrponent nests. The gYoove 170 has an energy absor~ing material 172 to help bwffer the impact of the placenent of the co~ponent on the boarcl. F~lrtherj the co~onent iæ held between the sides 174, 176 of the groove 170 when the spindle 36 is rotated during the aligr~ent o~ the co~ponent with the circuit on the board.
It caIl thus be seen with the use of a spindle rotatably mounted in the placem~nt head housing and movable toward and away from the board, a cc~onent can be properly aligned with the circuit and easily ancl accurately placed on the board. FurtherJ with the placement rod slidably mounted in the spindle, the cc~ponent can be placed OTI uneven bvard surfaces with no damage to the co~ponent.
.~ .
, . . .
Claims (6)
1. A placement mechanism for orienting and positioning an electrical component on a substrate, comprising:
(a) a housing adapted to be supported above the substrate and including a cylindrical opening;
(b) a spindle rotatably mounted in said opening about a vertical axis, said spindle having a lower end portion slidably receiving a placement rod that receives a component and places the component on the substrate;
(c) a piston surrounding said spindle and carried in said opening, and movable in response to a fluid medium to move said spindle toward and away from said substrate along said vertical axis;
(e) means interconnecting said spindle and said rod, comprising a collar on said spindle and set screws threaded into said collar, said set screws being engageable with flat sides on said rod to maintain said spindle and said rod in axial alignment, and said collar being adjustably threaded onto said spindle to permit vertical adjustment of said rod relative to said spindle along said vertical axis;
(f) means resiliently interconnecting said spindle and said rod to cushion impact of the placement of the component onto the substrate and accommodate substrates of different thickness; and (g) means for rotating said spindle and said rod to orient the component prior to its being positioned on the substrate.
(a) a housing adapted to be supported above the substrate and including a cylindrical opening;
(b) a spindle rotatably mounted in said opening about a vertical axis, said spindle having a lower end portion slidably receiving a placement rod that receives a component and places the component on the substrate;
(c) a piston surrounding said spindle and carried in said opening, and movable in response to a fluid medium to move said spindle toward and away from said substrate along said vertical axis;
(e) means interconnecting said spindle and said rod, comprising a collar on said spindle and set screws threaded into said collar, said set screws being engageable with flat sides on said rod to maintain said spindle and said rod in axial alignment, and said collar being adjustably threaded onto said spindle to permit vertical adjustment of said rod relative to said spindle along said vertical axis;
(f) means resiliently interconnecting said spindle and said rod to cushion impact of the placement of the component onto the substrate and accommodate substrates of different thickness; and (g) means for rotating said spindle and said rod to orient the component prior to its being positioned on the substrate.
2. The placement mechanism of claim 1 wherein said placement rod has a tip adapted to hold the component, a central opening in said rod and said tip when subjected to vacuum will retain the component on said tip and when subjected to air pressure will release the component from said tip onto the substrate.
3. The placement mechanism of claim 2 wherein said tip includes means to confine the component during rotational movement of said spindle and buffer the positioning of the component on the substrate.
4. The placement mechanism of claim 1 wherein said spindle has an upper end, and a cap assembly is mounted in an end of the bore in said housing with the upper end of said spindle being rotatably mounted in said cap assembly.
5. The placement mechanism of claim 4 wherein said cap assembly includes a cup member sealed in said end of said bore and supporting said spindle mounting.
6. The placement mechanism of claim 5 wherein said spindle supports a driven pulley.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US59734184A | 1984-04-06 | 1984-04-06 | |
| US597,341 | 1984-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1246625A true CA1246625A (en) | 1988-12-13 |
Family
ID=24391111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000474188A Expired CA1246625A (en) | 1984-04-06 | 1985-02-13 | Placement mechanism |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS60229396A (en) |
| KR (1) | KR920005074B1 (en) |
| BE (1) | BE902032A (en) |
| CA (1) | CA1246625A (en) |
| DE (1) | DE3511132A1 (en) |
| FR (1) | FR2562751B1 (en) |
| GB (1) | GB2156710B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4799854A (en) * | 1987-07-20 | 1989-01-24 | Hughes Aircraft Company | Rotatable pick and place vacuum sense head for die bonding apparatus |
| FR2632480B1 (en) * | 1988-06-03 | 1990-08-24 | Loupot Sa J | SEMI-AUTOMATIC SURFACE MOUNTING MACHINE AND MOUNTING HEAD |
| US5446323A (en) * | 1991-09-25 | 1995-08-29 | Systems, Machines, Automation Components Corporation | Actuator with translational and rotational control |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3597824A (en) * | 1968-03-19 | 1971-08-10 | Matsushita Electric Ind Co Ltd | Full-automatic electric part mounting apparatus |
| JPS5325368A (en) * | 1976-08-23 | 1978-03-09 | Hitachi Ltd | Pellet attaching collet |
| US4151945A (en) * | 1977-12-08 | 1979-05-01 | Universal Instruments Corporation | Automated hybrid circuit board assembly apparatus |
| JPS5599795A (en) * | 1979-01-25 | 1980-07-30 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
| US4231153A (en) * | 1979-02-22 | 1980-11-04 | Browne Lawrence T | Article placement system |
| NL8001114A (en) * | 1980-02-25 | 1981-09-16 | Philips Nv | DEVICE FOR MOUNTING CONNECTION WIRELESS PLATE OR BLOCKED ELECTRONIC COMPONENTS ON A SUBSTRATE. |
| GB2096498B (en) * | 1980-06-02 | 1983-10-26 | Tdk Electronics Co Ltd | Apparatus for mounting chip type circuit elements |
| US4372802A (en) * | 1980-06-02 | 1983-02-08 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on printed circuit boards |
| US4503606A (en) * | 1980-12-26 | 1985-03-12 | Citizen Watch Company Limited | Automatic assembling machine |
| US4458412A (en) * | 1981-05-06 | 1984-07-10 | Universal Instruments Corporation | Leadless chip placement machine for printed circuit boards |
| US4501064A (en) * | 1981-09-08 | 1985-02-26 | Usm Corporation | Micro component assembly machine |
| NL8201593A (en) * | 1982-04-16 | 1983-11-16 | Philips Nv | DEVICE FOR TRANSFERRING AN ELECTRICAL OR ELECTRONIC COMPONENT TO A MOUNTING PANEL. |
| JPS5928399A (en) * | 1982-08-09 | 1984-02-15 | 三洋電機株式会社 | Device for mounting electronic part |
-
1985
- 1985-02-13 CA CA000474188A patent/CA1246625A/en not_active Expired
- 1985-03-20 FR FR858504145A patent/FR2562751B1/en not_active Expired - Fee Related
- 1985-03-27 BE BE0/214718A patent/BE902032A/en not_active IP Right Cessation
- 1985-03-27 DE DE19853511132 patent/DE3511132A1/en not_active Withdrawn
- 1985-04-01 GB GB08508413A patent/GB2156710B/en not_active Expired
- 1985-04-04 KR KR1019850002264A patent/KR920005074B1/en not_active IP Right Cessation
- 1985-04-05 JP JP60072482A patent/JPS60229396A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB8508413D0 (en) | 1985-05-09 |
| JPS60229396A (en) | 1985-11-14 |
| KR920005074B1 (en) | 1992-06-26 |
| BE902032A (en) | 1985-07-16 |
| FR2562751A1 (en) | 1985-10-11 |
| GB2156710A (en) | 1985-10-16 |
| DE3511132A1 (en) | 1985-10-17 |
| GB2156710B (en) | 1987-08-05 |
| KR850007364A (en) | 1985-12-02 |
| FR2562751B1 (en) | 1991-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1246625A (en) | Placement mechanism | |
| WO2004035253A1 (en) | An apparatus and method for filling a ball grid array template | |
| US5850683A (en) | Component mounting apparatus | |
| US4646432A (en) | Placement mechanism | |
| US6651866B2 (en) | Precision bond head for mounting semiconductor chips | |
| US20040089697A1 (en) | Bump ball crimping apparatus | |
| JPS6012740A (en) | Chuck unit for receiving wafer | |
| IL122586A0 (en) | Device for positioning a machining spindle | |
| JP3951117B2 (en) | Conductive ball mounting device | |
| JPH0521986A (en) | Tape-feeder driving apparatus | |
| JPH081804Y2 (en) | Wafer take-out device in slicing machine | |
| JPS5945563B2 (en) | parts supply device | |
| JPH049720Y2 (en) | ||
| KR200143294Y1 (en) | Button positioning device | |
| JP2546696Y2 (en) | Parts supply equipment | |
| JPS6234557B2 (en) | ||
| JPS5928986Y2 (en) | Granule feeding device | |
| JPH0637624Y2 (en) | Lifting control device for rice transplanter | |
| KR200161478Y1 (en) | Wafer transfer apparatus | |
| JPH09331195A (en) | Component mounting device | |
| JPH04177896A (en) | Detector for nozzle clogging | |
| JP2553393B2 (en) | Bonder tool cleaning mechanism | |
| JP2950339B2 (en) | Metal mask alignment device | |
| KR940005438Y1 (en) | Tube pin inserting equipment | |
| JPH11118605A (en) | Color sorting device with freely adjustable space between object to be detected and color detecting unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |