FR2562751B1 - POSITIONING MECHANISM FOR, IN PARTICULAR THE POSITIONING OF ELECTRONIC COMPONENTS ON A SUBSTRATE. - Google Patents

POSITIONING MECHANISM FOR, IN PARTICULAR THE POSITIONING OF ELECTRONIC COMPONENTS ON A SUBSTRATE.

Info

Publication number
FR2562751B1
FR2562751B1 FR858504145A FR8504145A FR2562751B1 FR 2562751 B1 FR2562751 B1 FR 2562751B1 FR 858504145 A FR858504145 A FR 858504145A FR 8504145 A FR8504145 A FR 8504145A FR 2562751 B1 FR2562751 B1 FR 2562751B1
Authority
FR
France
Prior art keywords
positioning
substrate
electronic components
positioning mechanism
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR858504145A
Other languages
French (fr)
Other versions
FR2562751A1 (en
Inventor
Stanley Robert Vancelette
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USM Corp
Original Assignee
USM Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USM Corp filed Critical USM Corp
Publication of FR2562751A1 publication Critical patent/FR2562751A1/en
Application granted granted Critical
Publication of FR2562751B1 publication Critical patent/FR2562751B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
FR858504145A 1984-04-06 1985-03-20 POSITIONING MECHANISM FOR, IN PARTICULAR THE POSITIONING OF ELECTRONIC COMPONENTS ON A SUBSTRATE. Expired - Fee Related FR2562751B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59734184A 1984-04-06 1984-04-06

Publications (2)

Publication Number Publication Date
FR2562751A1 FR2562751A1 (en) 1985-10-11
FR2562751B1 true FR2562751B1 (en) 1991-05-24

Family

ID=24391111

Family Applications (1)

Application Number Title Priority Date Filing Date
FR858504145A Expired - Fee Related FR2562751B1 (en) 1984-04-06 1985-03-20 POSITIONING MECHANISM FOR, IN PARTICULAR THE POSITIONING OF ELECTRONIC COMPONENTS ON A SUBSTRATE.

Country Status (7)

Country Link
JP (1) JPS60229396A (en)
KR (1) KR920005074B1 (en)
BE (1) BE902032A (en)
CA (1) CA1246625A (en)
DE (1) DE3511132A1 (en)
FR (1) FR2562751B1 (en)
GB (1) GB2156710B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4799854A (en) * 1987-07-20 1989-01-24 Hughes Aircraft Company Rotatable pick and place vacuum sense head for die bonding apparatus
FR2632480B1 (en) * 1988-06-03 1990-08-24 Loupot Sa J SEMI-AUTOMATIC SURFACE MOUNTING MACHINE AND MOUNTING HEAD
US5446323A (en) * 1991-09-25 1995-08-29 Systems, Machines, Automation Components Corporation Actuator with translational and rotational control

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3597824A (en) * 1968-03-19 1971-08-10 Matsushita Electric Ind Co Ltd Full-automatic electric part mounting apparatus
JPS5325368A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Pellet attaching collet
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
US4231153A (en) * 1979-02-22 1980-11-04 Browne Lawrence T Article placement system
NL8001114A (en) * 1980-02-25 1981-09-16 Philips Nv DEVICE FOR MOUNTING CONNECTION WIRELESS PLATE OR BLOCKED ELECTRONIC COMPONENTS ON A SUBSTRATE.
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
GB2096498B (en) * 1980-06-02 1983-10-26 Tdk Electronics Co Ltd Apparatus for mounting chip type circuit elements
US4503606A (en) * 1980-12-26 1985-03-12 Citizen Watch Company Limited Automatic assembling machine
US4458412A (en) * 1981-05-06 1984-07-10 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
NL8201593A (en) * 1982-04-16 1983-11-16 Philips Nv DEVICE FOR TRANSFERRING AN ELECTRICAL OR ELECTRONIC COMPONENT TO A MOUNTING PANEL.
JPS5928399A (en) * 1982-08-09 1984-02-15 三洋電機株式会社 Device for mounting electronic part

Also Published As

Publication number Publication date
GB2156710A (en) 1985-10-16
KR920005074B1 (en) 1992-06-26
FR2562751A1 (en) 1985-10-11
JPS60229396A (en) 1985-11-14
GB8508413D0 (en) 1985-05-09
GB2156710B (en) 1987-08-05
CA1246625A (en) 1988-12-13
BE902032A (en) 1985-07-16
KR850007364A (en) 1985-12-02
DE3511132A1 (en) 1985-10-17

Similar Documents

Publication Publication Date Title
ES550306A0 (en) A PROCEDURE FOR THE NON-ELECTROLYTIC DEPOSITION OF COPPER ON A SUBSTRATE.
DE3583422D1 (en) MULTI-LAYER SUBSTRATE.
DE69017287D1 (en) Clear substrate.
DE68915072D1 (en) Integrated semiconductor circuit for a radio.
DE68918156T2 (en) Flat cooling structure for integrated circuit.
NO855115L (en) STAMP, SPECIFIC FOR ENGINE ENGINE.
DE3778261D1 (en) SUBSTRATE WITH MULTILAYER WIRING.
IT1236637B (en) CERAMIC SUBSTRATE WITH THROUGH HOLES FILLED WITH METAL FOR HYBRID MICROCIRCUITS AND PROCEDURE FOR MANUFACTURING THE SAME.
DE69008963T2 (en) Electronic circuit substrate.
DE59006957D1 (en) Flaky substrates.
ES510661A0 (en) A NON-ELECTROLYTIC DISPOSAL METHOD FOR DEPOSITING GOLD ON A SUBSTRATE.
DE68909111D1 (en) Electronic module that contains substrate elements.
ES512731A0 (en) A METHOD FOR FORMING A GOLD COATING ON A SUBSTRATE.
DE3581754D1 (en) INTEGRATED SEMICONDUCTOR CIRCUIT FOR CLOCK PULSE DISTRIBUTION.
DE3480628D1 (en) METALIZATION OF A CERAMIC SUBSTRATE.
FI904354A0 (en) SKIVFORMIGA, TILL SIN YTA MODIFIERADE SUBSTRAT.
DE59106689D1 (en) Spin plate for substrates.
DE58908152D1 (en) Semiconductor component with passivation layer.
ES541528A0 (en) A PROCEDURE FOR ADHERING SUBSTRATES.
DE69008953T2 (en) Blackable substrate.
FR2503280B1 (en) FLAT TYPE FAN, ESPECIALLY FOR ELECTRONIC CIRCUITS
FI890845A0 (en) CALORIFATT FETS SUBSTRATE.
IT8323707A0 (en) WIRING SUBSTRATE, PROCEDURE FOR ITS MANUFACTURE, AND SEMICONDUCTOR DEVICE USING THE SUBSTRATE ITSELF.
DE68918799D1 (en) Compound semiconductor substrate.
FR2596922B1 (en) INTEGRATED RESISTANCE ON A SEMICONDUCTOR SUBSTRATE

Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
CA Change of address
TP Transmission of property
CA Change of address
TP Transmission of property
ST Notification of lapse