GB8508413D0 - Placement mechanism - Google Patents

Placement mechanism

Info

Publication number
GB8508413D0
GB8508413D0 GB858508413A GB8508413A GB8508413D0 GB 8508413 D0 GB8508413 D0 GB 8508413D0 GB 858508413 A GB858508413 A GB 858508413A GB 8508413 A GB8508413 A GB 8508413A GB 8508413 D0 GB8508413 D0 GB 8508413D0
Authority
GB
United Kingdom
Prior art keywords
placement mechanism
placement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB858508413A
Other versions
GB2156710A (en
GB2156710B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USM Corp
Original Assignee
USM Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USM Corp filed Critical USM Corp
Publication of GB8508413D0 publication Critical patent/GB8508413D0/en
Publication of GB2156710A publication Critical patent/GB2156710A/en
Application granted granted Critical
Publication of GB2156710B publication Critical patent/GB2156710B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
GB08508413A 1984-04-06 1985-04-01 Micro-electronic component placement mechanism Expired GB2156710B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59734184A 1984-04-06 1984-04-06

Publications (3)

Publication Number Publication Date
GB8508413D0 true GB8508413D0 (en) 1985-05-09
GB2156710A GB2156710A (en) 1985-10-16
GB2156710B GB2156710B (en) 1987-08-05

Family

ID=24391111

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08508413A Expired GB2156710B (en) 1984-04-06 1985-04-01 Micro-electronic component placement mechanism

Country Status (7)

Country Link
JP (1) JPS60229396A (en)
KR (1) KR920005074B1 (en)
BE (1) BE902032A (en)
CA (1) CA1246625A (en)
DE (1) DE3511132A1 (en)
FR (1) FR2562751B1 (en)
GB (1) GB2156710B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4799854A (en) * 1987-07-20 1989-01-24 Hughes Aircraft Company Rotatable pick and place vacuum sense head for die bonding apparatus
FR2632480B1 (en) * 1988-06-03 1990-08-24 Loupot Sa J SEMI-AUTOMATIC SURFACE MOUNTING MACHINE AND MOUNTING HEAD
US5446323A (en) * 1991-09-25 1995-08-29 Systems, Machines, Automation Components Corporation Actuator with translational and rotational control

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3597824A (en) * 1968-03-19 1971-08-10 Matsushita Electric Ind Co Ltd Full-automatic electric part mounting apparatus
JPS5325368A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Pellet attaching collet
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
US4231153A (en) * 1979-02-22 1980-11-04 Browne Lawrence T Article placement system
NL8001114A (en) * 1980-02-25 1981-09-16 Philips Nv DEVICE FOR MOUNTING CONNECTION WIRELESS PLATE OR BLOCKED ELECTRONIC COMPONENTS ON A SUBSTRATE.
GB2096498B (en) * 1980-06-02 1983-10-26 Tdk Electronics Co Ltd Apparatus for mounting chip type circuit elements
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
US4503606A (en) * 1980-12-26 1985-03-12 Citizen Watch Company Limited Automatic assembling machine
US4458412A (en) * 1981-05-06 1984-07-10 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
NL8201593A (en) * 1982-04-16 1983-11-16 Philips Nv DEVICE FOR TRANSFERRING AN ELECTRICAL OR ELECTRONIC COMPONENT TO A MOUNTING PANEL.
JPS5928399A (en) * 1982-08-09 1984-02-15 三洋電機株式会社 Device for mounting electronic part

Also Published As

Publication number Publication date
BE902032A (en) 1985-07-16
FR2562751B1 (en) 1991-05-24
KR920005074B1 (en) 1992-06-26
GB2156710A (en) 1985-10-16
GB2156710B (en) 1987-08-05
CA1246625A (en) 1988-12-13
KR850007364A (en) 1985-12-02
JPS60229396A (en) 1985-11-14
DE3511132A1 (en) 1985-10-17
FR2562751A1 (en) 1985-10-11

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940401