DE69231374D1 - Verfahren zur Reparatur eines Ein-/Aufgabestiftes auf einer mehrschichtigen Leiterplatte - Google Patents
Verfahren zur Reparatur eines Ein-/Aufgabestiftes auf einer mehrschichtigen LeiterplatteInfo
- Publication number
- DE69231374D1 DE69231374D1 DE69231374T DE69231374T DE69231374D1 DE 69231374 D1 DE69231374 D1 DE 69231374D1 DE 69231374 T DE69231374 T DE 69231374T DE 69231374 T DE69231374 T DE 69231374T DE 69231374 D1 DE69231374 D1 DE 69231374D1
- Authority
- DE
- Germany
- Prior art keywords
- repairing
- procedure
- input
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
- H05K2201/10318—Surface mounted metallic pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3263801A JP2658672B2 (ja) | 1991-10-11 | 1991-10-11 | I/oピンの修理構造および修理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69231374D1 true DE69231374D1 (de) | 2000-09-28 |
DE69231374T2 DE69231374T2 (de) | 2001-04-12 |
Family
ID=17394445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69231374T Expired - Fee Related DE69231374T2 (de) | 1991-10-11 | 1992-10-12 | Verfahren zur Reparatur eines Ein-/Aufgabestiftes auf einer mehrschichtigen Leiterplatte |
Country Status (5)
Country | Link |
---|---|
US (1) | US5373110A (de) |
EP (1) | EP0536802B1 (de) |
JP (1) | JP2658672B2 (de) |
CA (1) | CA2080094C (de) |
DE (1) | DE69231374T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07320800A (ja) * | 1994-05-18 | 1995-12-08 | Star Micronics Co Ltd | 端子及びその製造方法 |
US6030857A (en) | 1996-03-11 | 2000-02-29 | Micron Technology, Inc. | Method for application of spray adhesive to a leadframe for chip bonding |
US6132798A (en) * | 1998-08-13 | 2000-10-17 | Micron Technology, Inc. | Method for applying atomized adhesive to a leadframe for chip bonding |
US5810926A (en) * | 1996-03-11 | 1998-09-22 | Micron Technology, Inc. | Method and apparatus for applying atomized adhesive to a leadframe for chip bonding |
CA2232523C (en) * | 1996-07-22 | 2004-07-13 | Honda Giken Kogyo Kabushiki Kaisha | Plug-in type electronic control unit, structure of connection of wiring board with plug member, unit of connection of electronic part with wiring board, and process for mounting electronic part |
DE69936319T2 (de) * | 1998-12-16 | 2008-02-14 | Ibiden Co., Ltd., Ogaki | Leitender verbindungsstift und baugruppenplatte |
JP3160583B2 (ja) * | 1999-01-27 | 2001-04-25 | 日本特殊陶業株式会社 | 樹脂製基板 |
TW512653B (en) * | 1999-11-26 | 2002-12-01 | Ibiden Co Ltd | Multilayer circuit board and semiconductor device |
JP3550355B2 (ja) * | 2000-04-13 | 2004-08-04 | 日本特殊陶業株式会社 | ピン立設基板 |
US7071012B2 (en) * | 2003-07-05 | 2006-07-04 | Micron Technology, Inc. | Methods relating to the reconstruction of semiconductor wafers for wafer-level processing |
JP2009043844A (ja) * | 2007-08-07 | 2009-02-26 | Shinko Electric Ind Co Ltd | リードピン付き配線基板およびリードピン |
JP4993754B2 (ja) * | 2008-02-22 | 2012-08-08 | 新光電気工業株式会社 | Pga型配線基板及びその製造方法 |
JP5290017B2 (ja) * | 2008-03-28 | 2013-09-18 | 日本特殊陶業株式会社 | 多層配線基板及びその製造方法 |
EP2327122A4 (de) * | 2008-09-15 | 2013-07-24 | Pacific Aerospace & Electronics Inc | Steckverbinderanordnungen mit keramischen einsätzen und leitfähigen pfaden und schnittstellen |
JP5281346B2 (ja) * | 2008-09-18 | 2013-09-04 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
JP5160390B2 (ja) * | 2008-12-15 | 2013-03-13 | 新光電気工業株式会社 | リードピン付配線基板及びその製造方法 |
JP5550280B2 (ja) * | 2009-07-29 | 2014-07-16 | 京セラ株式会社 | 多層配線基板 |
JP5423621B2 (ja) * | 2010-06-04 | 2014-02-19 | 株式会社デンソー | 回路基板の端子接続構造 |
JP7476540B2 (ja) * | 2020-01-23 | 2024-05-01 | 富士電機株式会社 | 半導体装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58110064A (ja) * | 1981-12-23 | 1983-06-30 | Nec Corp | 半導体装置およびその製造方法 |
US5049434A (en) * | 1984-04-30 | 1991-09-17 | National Starch And Chemical Investment Holding Corporation | Pre-patterned device substrate device-attach adhesive transfer system |
US5191224A (en) * | 1987-04-22 | 1993-03-02 | Hitachi, Ltd. | Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein |
JPH0258257A (ja) * | 1988-08-23 | 1990-02-27 | Ngk Spark Plug Co Ltd | リード付き半導体パッケージ |
JPH0766851B2 (ja) * | 1989-07-12 | 1995-07-19 | 富士通株式会社 | I/oピンの修復方法 |
JP2796394B2 (ja) * | 1990-01-17 | 1998-09-10 | 株式会社日立製作所 | 入出力用ピンの補修接続法 |
US5173842A (en) * | 1991-09-27 | 1992-12-22 | International Business Machines Corporation | Electrical assembly with deformable bridge printed circuit board |
US5241454A (en) * | 1992-01-22 | 1993-08-31 | International Business Machines Corporation | Mutlilayered flexible circuit package |
-
1991
- 1991-10-11 JP JP3263801A patent/JP2658672B2/ja not_active Expired - Lifetime
-
1992
- 1992-10-07 CA CA002080094A patent/CA2080094C/en not_active Expired - Fee Related
- 1992-10-09 US US07/958,756 patent/US5373110A/en not_active Expired - Lifetime
- 1992-10-12 EP EP92117417A patent/EP0536802B1/de not_active Expired - Lifetime
- 1992-10-12 DE DE69231374T patent/DE69231374T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0536802A3 (en) | 1993-07-21 |
DE69231374T2 (de) | 2001-04-12 |
EP0536802A2 (de) | 1993-04-14 |
CA2080094A1 (en) | 1993-04-12 |
US5373110A (en) | 1994-12-13 |
JP2658672B2 (ja) | 1997-09-30 |
EP0536802B1 (de) | 2000-08-23 |
CA2080094C (en) | 1997-03-25 |
JPH05102382A (ja) | 1993-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |