DE69842092D1 - Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte - Google Patents

Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte

Info

Publication number
DE69842092D1
DE69842092D1 DE69842092T DE69842092T DE69842092D1 DE 69842092 D1 DE69842092 D1 DE 69842092D1 DE 69842092 T DE69842092 T DE 69842092T DE 69842092 T DE69842092 T DE 69842092T DE 69842092 D1 DE69842092 D1 DE 69842092D1
Authority
DE
Germany
Prior art keywords
producing
circuit board
printed circuit
multilayer printed
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69842092T
Other languages
English (en)
Inventor
Yasuji Hiramatsu
Motoo Asai
Naohiro Hirose
Takashi Kariya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of DE69842092D1 publication Critical patent/DE69842092D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
DE69842092T 1997-12-11 1998-11-30 Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte Expired - Lifetime DE69842092D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36213297 1997-12-11

Publications (1)

Publication Number Publication Date
DE69842092D1 true DE69842092D1 (de) 2011-02-17

Family

ID=18476012

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69835962T Expired - Lifetime DE69835962T2 (de) 1997-12-11 1998-11-30 Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte
DE69842092T Expired - Lifetime DE69842092D1 (de) 1997-12-11 1998-11-30 Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69835962T Expired - Lifetime DE69835962T2 (de) 1997-12-11 1998-11-30 Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte

Country Status (7)

Country Link
US (4) US6609297B1 (de)
EP (2) EP1746871B1 (de)
CN (4) CN101094565A (de)
DE (2) DE69835962T2 (de)
MY (1) MY123983A (de)
TW (1) TW401727B (de)
WO (1) WO1999030542A1 (de)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7062845B2 (en) * 1996-06-05 2006-06-20 Laservia Corporation Conveyorized blind microvia laser drilling system
KR100791281B1 (ko) 1998-05-19 2008-01-04 이비덴 가부시키가이샤 프린트배선판 및 프린트배선판의 제조방법
EP2086299A1 (de) 1999-06-02 2009-08-05 Ibiden Co., Ltd. Mehrschichtige bestückte Leiterplatte und Verfahren zur Herstellung einer mehrschichtigen bestückten Leiterplatte
EP1259103B1 (de) * 2000-02-25 2007-05-30 Ibiden Co., Ltd. Mehrschichtige leiterplatte und verfahren zu ihrer herstellung
US20030039106A1 (en) * 2000-04-14 2003-02-27 Tatsunori Koyanagi Double-sided wiring board and its manufacture method
WO2002027786A1 (fr) 2000-09-25 2002-04-04 Ibiden Co., Ltd. Element semi-conducteur, procede de fabrication d'un element semi-conducteur, carte a circuit imprime multicouche, et procede de fabrication d'une carte a circuit imprime multicouche
US6699395B1 (en) * 2000-10-18 2004-03-02 Storage Technology Corporation Method of forming alignment features for conductive devices
KR20040035673A (ko) * 2001-07-06 2004-04-29 비아시스템즈 그룹, 인코포레이티드 보드간 통신을 위한 ｐｃｂ에의 광계층 집적 시스템 및집적방법
KR100969452B1 (ko) * 2001-08-09 2010-07-14 오르보테크 엘티디. 다층형 전기 회로의 타겟 노출 시스템 및 방법
US6380512B1 (en) 2001-10-09 2002-04-30 Chromalloy Gas Turbine Corporation Method for removing coating material from a cooling hole of a gas turbine engine component
JP2003131401A (ja) * 2001-10-26 2003-05-09 Adtec Engineeng Co Ltd 多層回路基板製造におけるマーキング装置
WO2003041271A2 (en) * 2001-11-02 2003-05-15 Fred Bassali Circuit board microwave filters
TWI227102B (en) * 2002-03-15 2005-01-21 United Test Ct Inc Fabrication method for circuit carrier
US7015616B2 (en) * 2002-04-01 2006-03-21 Honeywell International, Inc. System and method for providing coil retention in the rotor windings of a high speed generator
JP2003303919A (ja) * 2002-04-10 2003-10-24 Hitachi Ltd 半導体装置及びその製造方法
US6802445B2 (en) * 2002-10-24 2004-10-12 St Assembly Test Services Pte. Ltd. Cost effective substrate fabrication for flip-chip packages
JP4729883B2 (ja) * 2003-10-31 2011-07-20 セイコーエプソン株式会社 基板の加工方法、マイクロレンズシートの製造方法、透過型スクリーン、プロジェクタ、表示装置並びに基板の加工装置
US7178229B2 (en) * 2003-11-20 2007-02-20 E. I. Du Pont De Nemours And Company Method of making interlayer panels
DE10356658B4 (de) * 2003-12-04 2006-12-07 Hitachi Via Mechanics, Ltd., Ebina Verfahren zum Betrieb eines Lasersystems und Lasersystem für die Bearbeitung von Substraten
GB0400982D0 (en) * 2004-01-16 2004-02-18 Fujifilm Electronic Imaging Method of forming a pattern on a substrate
KR100621550B1 (ko) * 2004-03-17 2006-09-14 삼성전자주식회사 테이프 배선 기판의 제조방법
TWI229920B (en) * 2004-04-12 2005-03-21 Phoenix Prec Technology Corp Electrical connection structure of embedded chip and method for fabricating the same
JP4426900B2 (ja) * 2004-05-10 2010-03-03 三井金属鉱業株式会社 プリント配線基板、その製造方法および半導体装置
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US7246434B1 (en) * 2004-10-11 2007-07-24 Pericom Semiconductor Corp. Method of making a surface mountable PCB module
WO2006080073A1 (ja) * 2005-01-27 2006-08-03 Matsushita Electric Industrial Co., Ltd. 多層回路基板の製造方法、多層回路基板
TW200641564A (en) * 2005-02-24 2006-12-01 Fuji Photo Film Co Ltd The correction method of plotting device
DE102005031377A1 (de) * 2005-07-05 2007-01-11 Siemens Ag Kunststoffbauteil mit einer oberflächlich aufgebrachten Metallschicht zum in einem thermischen Befestigungsverfahren, insbesondere einem Lötverfahren erfolgenden elektrischen Kontaktieren von elektrischen Bauelementen
US7602062B1 (en) * 2005-08-10 2009-10-13 Altera Corporation Package substrate with dual material build-up layers
TW200717208A (en) * 2005-10-18 2007-05-01 Sheng-San Gu Defective connected piece of PCB reset method and system thereof
JP4588622B2 (ja) * 2005-12-08 2010-12-01 日東電工株式会社 配線回路基板の製造方法
JP2008030119A (ja) * 2006-06-26 2008-02-14 Orbotech Ltd 材料を微細加工する方法及び装置
JP2008016758A (ja) * 2006-07-10 2008-01-24 Adtec Engineeng Co Ltd 多層回路基板製造におけるマーキング装置
US7595112B1 (en) * 2006-07-31 2009-09-29 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Resin infusion of layered metal/composite hybrid and resulting metal/composite hybrid laminate
JP5078687B2 (ja) * 2007-03-22 2012-11-21 日本特殊陶業株式会社 多層配線基板の製造方法
KR100831593B1 (ko) * 2007-04-23 2008-05-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법, 비아홀 천공 장치
KR100882261B1 (ko) * 2007-07-25 2009-02-06 삼성전기주식회사 인쇄회로기판의 제조 방법 및 장치
US20110036617A1 (en) * 2007-08-03 2011-02-17 Leonid Kokurin Compensating Conductive Circuit
KR101505623B1 (ko) * 2007-09-19 2015-03-24 우에무라 고교 가부시키가이샤 빌드업 적층 기판의 제조 방법
CN101442884B (zh) * 2007-11-22 2010-11-03 比亚迪股份有限公司 一种多层印刷线路板的导通孔的加工方法
CN101472405B (zh) * 2007-12-26 2011-03-30 富葵精密组件(深圳)有限公司 多层电路板的制作方法
DE102008000306B4 (de) * 2008-02-15 2010-08-19 3D-Micromac Ag Verfahren und Vorrichtung zum Laserschneiden
US20090218119A1 (en) * 2008-03-03 2009-09-03 Ibiden Co., Ltd Method of manufacturing multilayer printed wiring board
US7982161B2 (en) * 2008-03-24 2011-07-19 Electro Scientific Industries, Inc. Method and apparatus for laser drilling holes with tailored laser pulses
KR100975924B1 (ko) * 2008-07-22 2010-08-13 삼성전기주식회사 인쇄회로기판의 제조 방법 및 이에 사용되는 제조 장치
TWI372007B (en) * 2008-08-07 2012-09-01 Unimicron Technology Corp Method for fabricating blind via structure of substrate
IL194967A0 (en) * 2008-10-28 2009-08-03 Orbotech Ltd Producing electrical circuit patterns using multi-population transformation
CN101742824B (zh) * 2008-11-26 2013-07-17 富葵精密组件(深圳)有限公司 电路板制作方法
TWI380423B (en) * 2008-12-29 2012-12-21 Advanced Semiconductor Eng Substrate structure and manufacturing method thereof
US20100243617A1 (en) * 2009-03-26 2010-09-30 Electro Scientific Industries, Inc. Printed circuit board via drilling stage assembly
WO2011000814A2 (de) * 2009-06-29 2011-01-06 Reis Gmbh & Co. Kg Maschinenfabrik Verfahren zum freilegen eines elektrischen kontakts
CN102482760B (zh) * 2009-09-15 2014-07-02 夏普株式会社 蒸镀方法和蒸镀装置
CN102196658B (zh) * 2010-03-04 2015-12-16 上海天马微电子有限公司 印刷电路板及其与柔性电路板的压合方法
CN102271462B (zh) * 2010-06-02 2015-03-11 楠梓电子股份有限公司 可辨识印刷电路板的制造方法
CN102291949B (zh) * 2010-06-18 2013-08-28 富葵精密组件(深圳)有限公司 多层电路板制作方法
JP5602584B2 (ja) * 2010-10-28 2014-10-08 新光電気工業株式会社 配線基板及びその製造方法
FR2974758B1 (fr) * 2011-05-04 2014-05-02 Commissariat Energie Atomique Dispositif et procede de gravure d'un motif
TWI555599B (zh) * 2013-02-25 2016-11-01 先進科技新加坡有限公司 在雷射劃刻裝置中執行光束特徵化之方法，及可執行此方法之雷射劃刻裝置
JP2014216377A (ja) * 2013-04-23 2014-11-17 イビデン株式会社 電子部品とその製造方法及び多層プリント配線板の製造方法
CN103433619B (zh) * 2013-08-30 2015-10-21 大族激光科技产业集团股份有限公司 激光熔覆打印机及线路板的制作方法
US20160074968A1 (en) * 2014-09-11 2016-03-17 Suss Microtec Photonic Systems Inc. Laser etching system including mask reticle for multi-depth etching
US9699914B2 (en) * 2014-10-20 2017-07-04 Averatek Corporation Patterning of electroless metals by selective deactivation of catalysts
US9994042B2 (en) * 2015-04-16 2018-06-12 Victor Manuel Sud Arce Substrates and method for print engravings
CN106271097B (zh) * 2015-06-09 2018-01-05 国巨电子（中国）有限公司 一种静电保护器的正导层单颗切割装置及方法
CN105895538A (zh) * 2016-04-28 2016-08-24 合肥祖安投资合伙企业(有限合伙) 一种芯片封装结构的制造方法及芯片封装结构
CN106735922B (zh) * 2017-01-16 2018-10-09 深圳顺络电子股份有限公司 一种叠层电子元件及其制备方法
US11257748B2 (en) 2017-06-30 2022-02-22 Intel Corporation Semiconductor package having polymeric interlayer disposed between conductive elements and dielectric layer
US11894770B2 (en) * 2017-11-10 2024-02-06 Tesla, Inc. High power voltage regulator module with different plane orientations
KR102496546B1 (ko) * 2017-12-19 2023-02-06 비아 메카닉스 가부시키가이샤 레이저 가공장치, 레이저 가공방법 및 이를 위한 프로그램을 기록한 기록매체
CN108436308B (zh) * 2018-03-16 2020-03-27 中国电子科技集团公司第三十八研究所 一种用于微波陶瓷基板上微孔的co2激光加工方法
CN110400152A (zh) * 2018-04-17 2019-11-01 鹏鼎控股(深圳)股份有限公司 用于印刷电路板的品质追溯系统
CN110576683A (zh) * 2018-06-14 2019-12-17 蓝思科技股份有限公司 面板打码夹具及打码机、面板与电子设备
CN109048073A (zh) * 2018-09-05 2018-12-21 深圳光韵达激光应用技术有限公司 一种应用于网状制品的激光烧蚀制作方法
TWI809201B (zh) 2018-10-23 2023-07-21 以色列商奧寶科技有限公司 用於校正晶粒放置錯誤之適應性路由
CN109714899B (zh) * 2019-01-29 2021-01-01 深圳市大族数控科技有限公司 靶标识别装置、pcb钻孔系统和pcb钻孔方法
JP7303053B2 (ja) * 2019-07-17 2023-07-04 ファナック株式会社 調整補助具及びレーザ溶接装置
DE102020103008A1 (de) * 2020-02-06 2021-08-12 HELLA GmbH & Co. KGaA Leiterplatte
JP2022047385A (ja) * 2020-09-11 2022-03-24 キオクシア株式会社 プリント配線基板およびメモリシステム
CN113218317B (zh) * 2021-04-23 2023-04-14 长春理工大学 激光原位压头印压工件成孔过程中的原位检测方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510276A (en) * 1979-12-13 1985-04-09 Kollmorgen Technologies Corporation Epoxy resin coating compositions for printed circuit boards
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
US4642160A (en) * 1985-08-12 1987-02-10 Interconnect Technology Inc. Multilayer circuit board manufacturing
JPH01141925A (ja) * 1987-11-30 1989-06-02 Honshu Paper Co Ltd パラ配向アラミド繊維シートを基材とする改良複合材料
DE3913966B4 (de) * 1988-04-28 2005-06-02 Ibiden Co., Ltd., Ogaki Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung
US4935584A (en) * 1988-05-24 1990-06-19 Tektronix, Inc. Method of fabricating a printed circuit board and the PCB produced
US5108553A (en) * 1989-04-04 1992-04-28 Olin Corporation G-tab manufacturing process and the product produced thereby
US5065228A (en) * 1989-04-04 1991-11-12 Olin Corporation G-TAB having particular through hole
US5073687A (en) * 1989-06-22 1991-12-17 Canon Kabushiki Kaisha Method and apparatus for working print board by laser
JP2680135B2 (ja) * 1989-07-15 1997-11-19 松下電工株式会社 プリント配線板の孔加工方法
JPH0354884A (ja) 1989-07-24 1991-03-08 Canon Inc スルーホールプリント配線板及びスルーホール形成方法
US4997517A (en) * 1990-01-09 1991-03-05 Olin Corporation Multi-metal layer interconnect tape for tape automated bonding
FR2657219B1 (fr) * 1990-01-11 1994-02-18 Gim Industrie Sa Procede de fabrication de circuits imprimes souples, circuit imprime fabrique par ce procede, et dispositif pour la mise en óoeuvre de ce procede.
JP2739726B2 (ja) * 1990-09-27 1998-04-15 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層プリント回路板
JP2621634B2 (ja) * 1990-10-24 1997-06-18 日本電気株式会社 ポリイミド樹脂多層配線基板の製造方法
JPH0520031A (ja) * 1991-07-09 1993-01-29 Fujitsu Ltd 演算制御方式
US5293025A (en) * 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
JP2707903B2 (ja) * 1992-01-28 1998-02-04 日本電気株式会社 多層プリント配線板の製造方法
US5517758A (en) * 1992-05-29 1996-05-21 Matsushita Electric Industrial Co., Ltd. Plating method and method for producing a multi-layered printed wiring board using the same
EP0602257B1 (de) * 1992-12-12 1997-09-10 International Business Machines Corporation Leiterplatten mit lokal erhöhter Verdrahtungsdichte und Herstellungsverfahren für solche Leiterplatten
JP3138954B2 (ja) * 1995-06-09 2001-02-26 住友重機械工業株式会社 バイアホール形成方法
JP2879723B2 (ja) 1995-07-18 1999-04-05 住友重機械工業株式会社 プリント配線基板におけるバイアホールの穴明け加工方法
EP0768334B1 (de) * 1995-10-16 2004-02-18 Sumitomo Chemical Company Limited Prepreg, Verfahren zur Herstellung und gedrucktes Leiterplattensubstrat und dessen Verwendung
JP3756580B2 (ja) * 1995-11-07 2006-03-15 セイコープレシジョン株式会社 多層基板の製造方法及びその製造装置
GB2307352A (en) * 1995-11-16 1997-05-21 Marconi Gec Ltd Manufacture of multi-layer printed circuit boards
JPH09308981A (ja) * 1996-05-20 1997-12-02 Sumitomo Heavy Ind Ltd レーザ加工装置
TW331698B (en) * 1996-06-18 1998-05-11 Hitachi Chemical Co Ltd Multi-layered printed circuit board
JP2000505948A (ja) * 1996-11-08 2000-05-16 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド 公称位置合せを向上させるための基準手法を用いる方法
JP3199653B2 (ja) * 1996-12-27 2001-08-20 イビデン株式会社 多層プリント配線板の製造装置及び製造方法
US6035526A (en) * 1997-11-18 2000-03-14 Ntn Corporation Method of repairing defect and apparatus for repairing defect

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CN101094565A (zh) 2007-12-26
CN1964604A (zh) 2007-05-16
CN1281629A (zh) 2001-01-24
EP1746871A1 (de) 2007-01-24
CN100521882C (zh) 2009-07-29
US20060131071A1 (en) 2006-06-22
TW401727B (en) 2000-08-11
US20090025216A1 (en) 2009-01-29
DE69835962T2 (de) 2007-01-04
US6609297B1 (en) 2003-08-26
EP1039789B1 (de) 2006-09-20
DE69835962D1 (de) 2006-11-02
MY123983A (en) 2006-06-30
CN1294788C (zh) 2007-01-10
US7127812B2 (en) 2006-10-31
CN1964603A (zh) 2007-05-16
WO1999030542A1 (fr) 1999-06-17
US20030192182A1 (en) 2003-10-16
CN100521883C (zh) 2009-07-29
EP1039789A1 (de) 2000-09-27
US7761984B2 (en) 2010-07-27
EP1039789A4 (de) 2004-05-19
EP1746871B1 (de) 2011-01-05

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