DE69925893D1 - Verfahren zur Herstellung einer doppelseitigen flexiblen Leiterplatte - Google Patents
Verfahren zur Herstellung einer doppelseitigen flexiblen LeiterplatteInfo
- Publication number
- DE69925893D1 DE69925893D1 DE69925893T DE69925893T DE69925893D1 DE 69925893 D1 DE69925893 D1 DE 69925893D1 DE 69925893 T DE69925893 T DE 69925893T DE 69925893 T DE69925893 T DE 69925893T DE 69925893 D1 DE69925893 D1 DE 69925893D1
- Authority
- DE
- Germany
- Prior art keywords
- double
- producing
- circuit board
- printed circuit
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP37309298 | 1998-12-28 | ||
JP37309298A JP3565069B2 (ja) | 1998-12-28 | 1998-12-28 | 両面フレキシブルプリント基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69925893D1 true DE69925893D1 (de) | 2005-07-28 |
DE69925893T2 DE69925893T2 (de) | 2006-05-11 |
Family
ID=18501566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69925893T Expired - Lifetime DE69925893T2 (de) | 1998-12-28 | 1999-12-27 | Verfahren zur Herstellung einer doppelseitigen flexiblen Leiterplatte |
Country Status (5)
Country | Link |
---|---|
US (2) | US6705007B1 (de) |
EP (1) | EP1017258B1 (de) |
JP (1) | JP3565069B2 (de) |
CN (1) | CN1183812C (de) |
DE (1) | DE69925893T2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4696368B2 (ja) * | 2001-02-09 | 2011-06-08 | 日立化成工業株式会社 | 半導体パッケージ用基板とその製造方法および半導体パッケージとその製造方法 |
TW595283B (en) * | 2001-04-25 | 2004-06-21 | Benq Corp | Flexible circuit board and its manufacturing method |
EP1407879A4 (de) * | 2001-05-24 | 2006-04-12 | Toray Industries | Widerstandsfähiger kunststofffilm mit metall- und drahtgelegelagen, herstellungsverfahren |
US6838184B2 (en) * | 2002-03-22 | 2005-01-04 | Ube Industries, Ltd. | Aromatic polyimide film for electro-conductive sealing element of packaged semi-conductor device |
JP4584006B2 (ja) * | 2005-04-12 | 2010-11-17 | 日本メクトロン株式会社 | 可撓性回路基板 |
JP2008041960A (ja) | 2006-08-07 | 2008-02-21 | Nissan Chem Ind Ltd | 電子回路部品の製造方法 |
EP1961686B1 (de) | 2007-02-20 | 2016-09-14 | Iro Ab | System zur Überwachung und Einstellung einer Garnspannung |
CN101374383B (zh) * | 2007-08-24 | 2010-06-09 | 富葵精密组件(深圳)有限公司 | 绝缘基膜、电路板基板及电路板 |
CN102009515B (zh) * | 2010-07-21 | 2013-01-02 | 广东生益科技股份有限公司 | 二层法双面挠性覆铜板的制作方法及该二层法双面挠性覆铜板 |
CN102627856B (zh) * | 2012-04-01 | 2015-01-07 | 云南云天化股份有限公司 | 高剥离强度柔性电路板的聚酰亚胺薄膜、制备方法及其电路板 |
DE102014217295A1 (de) * | 2014-08-29 | 2016-03-03 | Robert Bosch Gmbh | Imagermodul für eine Fahrzeug-Kamera und Verfahren zu dessen Herstellung |
CN113490344A (zh) * | 2021-07-08 | 2021-10-08 | 江西柔顺科技有限公司 | 一种柔性线路板及其制备方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1765926A1 (de) | 1968-08-09 | 1971-11-18 | Ibm Deutschland | Verfahren zur Herstellung einer gedruckten Schaltung |
US4088545A (en) | 1977-01-31 | 1978-05-09 | Supnet Fred L | Method of fabricating mask-over-copper printed circuit boards |
DE2739494B2 (de) * | 1977-08-30 | 1980-10-16 | Fuba, Hans Kolbe & Co, 3202 Bad Salzuflen | Verfahren zum Herstellen elektrischer Leiterplatten |
DE3121131C2 (de) | 1981-05-27 | 1984-02-16 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Verfahren zur Herstellung von mit Leiterbahnen versehenen Schaltungsplatten mit metallischen Durchkontaktierungen |
JPS60157286A (ja) | 1984-01-27 | 1985-08-17 | 株式会社日立製作所 | フレキシブルプリント基板の製造方法 |
JPS60243120A (ja) | 1984-05-18 | 1985-12-03 | Hitachi Ltd | フレキシブルプリント基板の製造方法 |
JPS63239998A (ja) | 1987-03-27 | 1988-10-05 | 新日鐵化学株式会社 | 配線材料の製造方法 |
JPS6453591A (en) | 1987-08-25 | 1989-03-01 | Sumitomo Electric Industries | Manufacture of flexible circuit board |
JPH01245586A (ja) | 1988-03-28 | 1989-09-29 | Nippon Steel Chem Co Ltd | フレキシブルプリント基板 |
JP2746643B2 (ja) | 1989-04-17 | 1998-05-06 | 住友ベークライト株式会社 | フレキシブルプリント回路板およびその製造方法 |
JPH0362988A (ja) | 1989-07-31 | 1991-03-19 | Chisso Corp | フレキシブルプリント回路用基板およびその製造法 |
JP2738453B2 (ja) | 1989-10-03 | 1998-04-08 | 新日鐵化学株式会社 | 銅張積層板の製造方法 |
JPH04262593A (ja) * | 1991-02-18 | 1992-09-17 | Hitachi Ltd | 多層配線構造体およびその製造方法とその用途 |
JP2612118B2 (ja) | 1991-10-15 | 1997-05-21 | 住友ベークライト株式会社 | 両面フレキシブル印刷回路用基板の製造方法 |
JPH05139027A (ja) | 1991-11-18 | 1993-06-08 | Oji Paper Co Ltd | 感熱記録体 |
JPH05291727A (ja) | 1992-04-14 | 1993-11-05 | Hitachi Chem Co Ltd | 配線板の製造法 |
JP3153017B2 (ja) | 1992-09-25 | 2001-04-03 | 日東電工株式会社 | フレキシブルプリント基板 |
JP3318035B2 (ja) | 1993-04-07 | 2002-08-26 | 三井化学株式会社 | フレキシブル両面金属積層板の製造法 |
JP2652325B2 (ja) | 1993-06-15 | 1997-09-10 | チッソ株式会社 | フレキシブルプリント基板の製造法 |
US6016598A (en) * | 1995-02-13 | 2000-01-25 | Akzo Nobel N.V. | Method of manufacturing a multilayer printed wire board |
US6180261B1 (en) * | 1997-10-21 | 2001-01-30 | Nitto Denko Corporation | Low thermal expansion circuit board and multilayer wiring circuit board |
JP3481117B2 (ja) * | 1998-02-25 | 2003-12-22 | 富士通株式会社 | 半導体装置及びその製造方法 |
-
1998
- 1998-12-28 JP JP37309298A patent/JP3565069B2/ja not_active Expired - Fee Related
-
1999
- 1999-12-14 US US09/459,895 patent/US6705007B1/en not_active Expired - Fee Related
- 1999-12-27 EP EP99126019A patent/EP1017258B1/de not_active Expired - Lifetime
- 1999-12-27 DE DE69925893T patent/DE69925893T2/de not_active Expired - Lifetime
- 1999-12-28 CN CNB991229894A patent/CN1183812C/zh not_active Expired - Fee Related
-
2003
- 2003-12-16 US US10/735,679 patent/US7213334B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69925893T2 (de) | 2006-05-11 |
US7213334B2 (en) | 2007-05-08 |
EP1017258B1 (de) | 2005-06-22 |
CN1183812C (zh) | 2005-01-05 |
EP1017258A2 (de) | 2000-07-05 |
US6705007B1 (en) | 2004-03-16 |
US20040131765A1 (en) | 2004-07-08 |
JP2000196206A (ja) | 2000-07-14 |
CN1264271A (zh) | 2000-08-23 |
EP1017258A3 (de) | 2002-06-12 |
JP3565069B2 (ja) | 2004-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
R082 | Change of representative |
Ref document number: 1017258 Country of ref document: EP Representative=s name: TBK, DE |
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R081 | Change of applicant/patentee |
Ref document number: 1017258 Country of ref document: EP Owner name: SONY CHEMICAL & INFORMATION DEVICE CORP., JP Free format text: FORMER OWNER: SONY CHEMICALS CORP., TOKIO/TOKYO, JP Effective date: 20121116 |
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