DE69925880D1 - Verbindungsverfahren für Leiterplatte - Google Patents
Verbindungsverfahren für LeiterplatteInfo
- Publication number
- DE69925880D1 DE69925880D1 DE69925880T DE69925880T DE69925880D1 DE 69925880 D1 DE69925880 D1 DE 69925880D1 DE 69925880 T DE69925880 T DE 69925880T DE 69925880 T DE69925880 T DE 69925880T DE 69925880 D1 DE69925880 D1 DE 69925880D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- connection method
- connection
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/20—Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/206—Microstrip transmission line antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11831898 | 1998-04-28 | ||
JP10118318A JPH11312881A (ja) | 1998-04-28 | 1998-04-28 | 基板の接合方法、及び高周波回路、アンテナ、導波管、線路変換器、線路分岐回路、並びに通信システム |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69925880D1 true DE69925880D1 (de) | 2005-07-28 |
DE69925880T2 DE69925880T2 (de) | 2006-05-11 |
Family
ID=14733712
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69925880T Expired - Fee Related DE69925880T2 (de) | 1998-04-28 | 1999-04-26 | Verbindungsverfahren für Leiterplatte |
DE69921204T Expired - Fee Related DE69921204T2 (de) | 1998-04-28 | 1999-04-26 | Hohlleiter-Mikrostreifenleiterübergang für Mikrowellen und Millimeterwellen |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69921204T Expired - Fee Related DE69921204T2 (de) | 1998-04-28 | 1999-04-26 | Hohlleiter-Mikrostreifenleiterübergang für Mikrowellen und Millimeterwellen |
Country Status (4)
Country | Link |
---|---|
US (2) | US6335664B1 (de) |
EP (3) | EP1321998B1 (de) |
JP (1) | JPH11312881A (de) |
DE (2) | DE69925880T2 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6466176B1 (en) * | 2000-07-11 | 2002-10-15 | In4Tel Ltd. | Internal antennas for mobile communication devices |
SE519904C2 (sv) | 2000-12-29 | 2003-04-22 | Amc Centurion Ab | Tillverkning av antennanordningar |
US6693557B2 (en) | 2001-09-27 | 2004-02-17 | Wavetronix Llc | Vehicular traffic sensor |
TW517613U (en) * | 2001-11-13 | 2003-01-11 | Asustek Comp Inc | Jig framework featuring with solder attracting function |
JP4231526B2 (ja) | 2003-12-24 | 2009-03-04 | モレックス インコーポレーテッド | 伝送ライン |
JP2006287452A (ja) * | 2005-03-31 | 2006-10-19 | Digital Electronics Corp | アンテナ装置および電子機器 |
US7606592B2 (en) * | 2005-09-19 | 2009-10-20 | Becker Charles D | Waveguide-based wireless distribution system and method of operation |
US8248272B2 (en) | 2005-10-31 | 2012-08-21 | Wavetronix | Detecting targets in roadway intersections |
US8665113B2 (en) | 2005-10-31 | 2014-03-04 | Wavetronix Llc | Detecting roadway targets across beams including filtering computed positions |
US20070178766A1 (en) * | 2006-01-31 | 2007-08-02 | Intel Corporation | Passive impedance equalization of high speed serial links |
US7420436B2 (en) * | 2006-03-14 | 2008-09-02 | Northrop Grumman Corporation | Transmission line to waveguide transition having a widened transmission with a window at the widened end |
KR100846515B1 (ko) * | 2007-03-19 | 2008-07-17 | 삼성전자주식회사 | 테이퍼진 c-형 개구를 갖는 90도 굽어진 금속 도파로,상기 도파로의 제조 방법, 상기 도파로를 이용한 광전송모듈 및 상기 도파로를 채용한 열보조 자기기록 헤드 |
CN102386480A (zh) * | 2010-08-27 | 2012-03-21 | 上海任虹精密机械有限公司 | 一种软板天线的生产方法和系统 |
CN102157769B (zh) * | 2011-03-25 | 2013-11-06 | 东南大学 | 带阻带的微带线-槽线的过渡结构 |
US9412271B2 (en) | 2013-01-30 | 2016-08-09 | Wavetronix Llc | Traffic flow through an intersection by reducing platoon interference |
JP6094379B2 (ja) * | 2013-05-22 | 2017-03-15 | 富士通株式会社 | 導波管ーマイクロストリップ線路変換器 |
CN103464337B (zh) * | 2013-08-13 | 2016-02-24 | 昆山龙腾光电有限公司 | 点胶固化装置 |
FR3010835B1 (fr) * | 2013-09-19 | 2015-09-11 | Inst Mines Telecom Telecom Bretagne | Dispositif de jonction entre une ligne de transmission imprimee et un guide d'ondes dielectrique |
JP6250468B2 (ja) * | 2014-04-23 | 2017-12-20 | 日本ピラー工業株式会社 | 平面アンテナ |
CN105680136A (zh) * | 2016-03-21 | 2016-06-15 | 南京邮电大学 | 共面波导到槽线到基片集成非辐射介质波导的过渡电路 |
EP3571900A4 (de) * | 2017-01-18 | 2021-02-17 | Phoenix, LLC | Hochleistungsionenstrahlgeneratorsysteme und -verfahren |
CN106956055B (zh) * | 2017-05-08 | 2023-06-23 | 成都锦江电子系统工程有限公司 | 一种高效高质量雷达振子外壳焊接夹具 |
WO2019138468A1 (ja) * | 2018-01-10 | 2019-07-18 | 三菱電機株式会社 | 導波管マイクロストリップ線路変換器およびアンテナ装置 |
CN109888511B (zh) * | 2019-04-15 | 2023-12-08 | 上海几何伙伴智能驾驶有限公司 | 一种圆极化微带平板天线 |
CN112670690B (zh) * | 2020-11-10 | 2022-01-11 | 北京遥测技术研究所 | 一种基于谐振式高温陶瓷过渡电路 |
CN113328227A (zh) * | 2021-05-27 | 2021-08-31 | 电子科技大学 | 一种微带线到非辐射介质波导的过渡结构 |
CN113460689B (zh) * | 2021-06-29 | 2023-05-23 | 东方日升(常州)新能源有限公司 | 硅片的移载方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE534739A (de) * | 1954-01-14 | |||
US3579149A (en) * | 1969-12-08 | 1971-05-18 | Westinghouse Electric Corp | Waveguide to stripline transition means |
US3815055A (en) * | 1973-04-20 | 1974-06-04 | Raytheon Co | Microwave power divider |
US3969691A (en) * | 1975-06-11 | 1976-07-13 | The United States Of America As Represented By The Secretary Of The Navy | Millimeter waveguide to microstrip transition |
US4226659A (en) * | 1976-12-27 | 1980-10-07 | Bell Telephone Laboratories, Incorporated | Method for bonding flexible printed circuitry to rigid support plane |
US4168479A (en) * | 1977-10-25 | 1979-09-18 | The United States Of America As Represented By The Secretary Of The Navy | Millimeter wave MIC diplexer |
CA1290676C (en) * | 1987-03-30 | 1991-10-15 | William Frank Graham | Method for bonding integrated circuit chips |
JPH04348540A (ja) * | 1991-05-27 | 1992-12-03 | Sony Corp | フリップチップボンダー |
US5210941A (en) * | 1991-07-19 | 1993-05-18 | Poly Circuits, Inc. | Method for making circuit board having a metal support |
JPH05283915A (ja) | 1992-03-31 | 1993-10-29 | Toshiba Corp | 導波管−マイクロストリップ線路変換器 |
JPH05335816A (ja) | 1992-06-03 | 1993-12-17 | Japan Radio Co Ltd | 導波管−マイクロストリップ線路変換器 |
US5906310A (en) * | 1994-11-10 | 1999-05-25 | Vlt Corporation | Packaging electrical circuits |
JP3476351B2 (ja) * | 1997-11-27 | 2003-12-10 | シャープ株式会社 | 低雑音増幅装置 |
-
1998
- 1998-04-28 JP JP10118318A patent/JPH11312881A/ja active Pending
-
1999
- 1999-04-13 US US09/290,395 patent/US6335664B1/en not_active Expired - Fee Related
- 1999-04-26 EP EP03006544A patent/EP1321998B1/de not_active Expired - Lifetime
- 1999-04-26 DE DE69925880T patent/DE69925880T2/de not_active Expired - Fee Related
- 1999-04-26 EP EP04024636A patent/EP1496563A3/de not_active Withdrawn
- 1999-04-26 EP EP99303201A patent/EP0954049B1/de not_active Expired - Lifetime
- 1999-04-26 DE DE69921204T patent/DE69921204T2/de not_active Expired - Fee Related
-
2001
- 2001-11-15 US US09/987,625 patent/US6592021B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69921204D1 (de) | 2004-11-18 |
DE69921204T2 (de) | 2005-11-10 |
EP1321998A1 (de) | 2003-06-25 |
EP0954049A3 (de) | 2002-07-24 |
DE69925880T2 (de) | 2006-05-11 |
US20020047038A1 (en) | 2002-04-25 |
EP1496563A3 (de) | 2005-04-13 |
US6592021B2 (en) | 2003-07-15 |
EP0954049A2 (de) | 1999-11-03 |
EP1321998B1 (de) | 2004-10-13 |
EP0954049B1 (de) | 2005-06-22 |
US6335664B1 (en) | 2002-01-01 |
JPH11312881A (ja) | 1999-11-09 |
EP1496563A2 (de) | 2005-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |