JPH04348540A - フリップチップボンダー - Google Patents

フリップチップボンダー

Info

Publication number
JPH04348540A
JPH04348540A JP3120847A JP12084791A JPH04348540A JP H04348540 A JPH04348540 A JP H04348540A JP 3120847 A JP3120847 A JP 3120847A JP 12084791 A JP12084791 A JP 12084791A JP H04348540 A JPH04348540 A JP H04348540A
Authority
JP
Japan
Prior art keywords
substrate
chip
adhesive
flexible substrate
stand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3120847A
Other languages
English (en)
Inventor
Takeshi Hori
剛 堀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP3120847A priority Critical patent/JPH04348540A/ja
Priority to DE69207815T priority patent/DE69207815T2/de
Priority to EP92108857A priority patent/EP0517071B1/en
Priority to US07/887,844 priority patent/US5232532A/en
Priority to KR1019920008963A priority patent/KR920022433A/ko
Publication of JPH04348540A publication Critical patent/JPH04348540A/ja
Pending legal-status Critical Current

Links

Classifications

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】この発明は、ＩＣ等のチップ状電
子部品をフレキシブル基板に接続固定するフリップチッ
プボンダーに関する。
【０００２】
【従来の技術】従来、プラスティックカードにＩＣチッ
プを内蔵してなるＩＣカードが提案されている。このＩ
Ｃカードを製造する際、基板の配線パターンにＩＣチッ
プの電極を接続する必要がある。
【０００３】図３は、接続方法としてワイヤ・ボンディ
ングを使用した例を示している。同図において、１はフ
レキシブル基板、２はフレキシブル基板１上に形成され
た配線パターンである。ＩＣチップ３は接着剤４をもっ
てフレキシブル基板１に固着された後、ＩＣチップ３の
電極３ａと配線パターン２とが金ワイヤ５を使用して接
続される。
【０００４】このようなワイヤ・ボンディングの接続方
法を使用するものによれば、金ワイヤ５が所定の空間を
占めるため全体的に厚くなってしまう不都合があった。 そこで、接続方法としてワイヤレス・ボンディングの１
つであるフリップチップボンディング（フェイスダウン
・ボンディング）を使用することが提案されている。
【０００５】図４は、接続方法としてフリップチップ・
ボンディングを使用した例を示している。この図４にお
いて、図３と対応する部分には同一符号を付して示して
いる。
【０００６】配線パターン２上にはＩＣチップ３の電極
３ａに対応した位置にバンプ６が接続される。まず、Ｉ
Ｃチップ３の載置位置に対応するフレキシブル基板１上
に熱硬化性を有する接着剤７が載せられる（図４Ａに図
示）。
【０００７】次に、電極３ａがバンプ６に対応するよう
にＩＣチップ３がフレキシブル基板１上に載置される。 そして、ＩＣチップ３は接着剤７の熱硬化温度に合わせ
て加熱されると共に、ＩＣチップ３の電極３ａとバンプ
６間の接着剤７が除去されるに必要な圧力が掛けられる
。これにより、ＩＣチップ３はフレキシブル基板１上に
固着されると共に、ＩＣチップ３の電極３ａはバンプ６
を介して配線パターン２に接続される（図４Ｂに図示）
。
【０００８】
【発明が解決しようとする課題】このようなフリップチ
ップ・ボンディングにおいては、接着剤７が加熱される
際、接着剤７より気泡（ケミカルガスや空気）が発生し
、フレキシブル基板１とＩＣチップ３との間に残留する
ことがあった。図５は気泡８の残留状態を示している。 図５Ａは縦断面図であり、図５Ｂはフレキシブル基板１
を省略した底面図である。
【０００９】このように気泡８が残留するときは、温度
変化に応じて気泡８が伸縮するため接続部にクラックや
剥れができ、接続の信頼性に欠けるものとなる。
【００１０】そこで従来、気泡８を押し出すために、接
着剤７の量を多くしたり、あるいは加熱押圧にゆっくり
時間を掛けている。そのため、接着剤７が無駄に使用さ
れ、あるいは製造効率を悪くしている。
【００１１】そこで、この発明では、気泡の残留を効果
的に防止できるフリップチップボンダーを提供するもの
である。
【００１２】
【課題を解決するための手段】この発明は、フレキシブ
ル基板を供給する基板供給手段と、フレキシブル基板上
に熱硬化性接着剤を載せる接着剤ノズルと、接着剤が載
せられたフレキシブル基板上にチップ状の電子部品を載
置する電子部品供給アームと、フレキシブル基板の電子
部品が載置される面と反対の面側にシート状部材を供給
するシート供給手段と、フレキシブル基板上に載置され
た電子部品を押圧および加熱する押圧アームとを備えて
なるものである。
【００１３】
【作用】電子部品が押圧アームで加熱押圧されるとき、
シート上部材が圧縮変形するため、接着剤内で発生する
気泡が外部に押し出される。そのため、接着剤内に気泡
が残留するのを効果的に防止し得る。
【００１４】
【実施例】以下、図１を参照しながら、この発明の一実
施例について説明する。
【００１５】同図において、１１Ｓおよび１１Ｔは、そ
れぞれフレキシブル基板１の供給リールおよび巻取りリ
ールである。これらリール１１Ｓ，１１Ｔの回転はシス
テムコントローラ１３によって制御される。
【００１６】フレキシブル基板１は、配線パターン２お
よびバンプ６が予め固定された単位ユニット（図４参照
）が複数個連続した構成とされ、リール１１Ｓ，１１Ｔ
の回転によって単位ユニット毎に基台１４上に移動する
ようにされる。
【００１７】１５Ｓおよび１５Ｔは、それぞれフィルム
あるいは紙等からなるテープ（シート状部材）１６の供
給リールおよび巻取りリールである。これらリール１５
Ｓ，１５Ｔの回転はシステムコントローラ１３によって
制御される。
【００１８】テープ１６は基台１４とフレキシブル基板
１との間に位置するようにされ、基台１４上にフレキシ
ブル基板１の新たな単位ユニットが移動するのに伴って
、リール１５Ｓ，１５Ｔの回転によってテープ１６の新
たな部分が基台１４上に移動するようにされる。
【００１９】１８はＩＣチップ３（図４参照）をフレキ
シブル基板１上に載置するＩＣチップ供給アームである
。このＩＣチップ供給アーム１８の動作は、システムコ
ントローラ１３で制御される。
【００２０】２０は、例えばエポキシ樹脂等の熱硬化性
接着剤７（図４参照）をフレキシブル基板１上に載せる
接着剤ノズルである。この接着剤ノズル２０の動作はシ
ステムコントローラ１３によって制御される。
【００２１】２２はヒーター２３を内蔵する押圧アーム
である。この押圧アーム２２の押圧動作は、システムコ
ントローラ１３で制御されるプランジャ２４によって行
なわれる。
【００２２】以上の構成において、まず、リール１１Ｓ
，１１Ｔの回転によって基台１４上にフレキシブル基板
１の新たなユニットが移動されると共に、リール１５Ｓ
，１５Ｔの回転によって基台１４上にテープ１６の新た
な部分が移動される。
【００２３】次に、接着剤ノズル２０が基台１４上のフ
レキシブル基板１の単位ユニット上に移動され、その単
位ユニット上に接着剤７が排出される。
【００２４】次に、ＩＣチップ供給アーム１８によって
基台１４上のフレキシブル基板１の単位ユニット上にＩ
Ｃチップ３が載置される。このとき、ＩＣチップ３の電
極３ａが配線パターン２上に接続されたバンプ６と対向
するようにされる。
【００２５】次に、プランジャ２４の駆動によって押圧
アーム２２が基台１４側に移動するようにされ、ＩＣチ
ップ３が加熱されながら基台１４側に押圧される。これ
により、ＩＣチップ３の電極３ａがバンプ６と接触した
状態となって配線パターン２に接続され、この状態で接
着剤７の加熱硬化によりＩＣチップ３がフレキシブル基
板１上に固着される。
【００２６】以下、このようなボンディング動作は、フ
レキシブル基板１の各単位ユニットが基台１４上に順次
移動される毎に行なわれる。
【００２７】本例においては、基台１４とフレキシブル
基板１との間にテープ１６が配されるので、押圧アーム
２２でＩＣチップ３を加熱押圧するとき、図２Ａに示す
ように、テープ１６のバンプ６に対応する部分が凹み、
それに伴ってフレキシブル基板１はバンプ６，６間に対
応する中央部が突出するように変形する。
【００２８】そのため、接着剤７内に発生する気泡８は
外部に押し出され、ボンディング終了時には接着剤７内
に気泡８は残留しなくなる（図２Ｂに図示）。
【００２９】このように本例のフリップチップボンダー
によれば、接着剤７内に気泡８が残留するのを効果的に
防止することができ、接続の信頼性を上げることができ
る。また、接着剤７の量を多くしたり、ゆっくりと時間
を掛けて加熱押圧して気泡８を押し出すものと比較して
、接着剤７を無駄にすることがなく、製造効率を上げる
ことができる。
【００３０】なお、上述実施例においては、フレキシブ
ル基板１にＩＣチップ３を接続固定するものであったが
、その他のチップ状の電子部品をフレキシブル基板に接
続固定する際にも、この発明のフリップチップボンダー
を同様に適用することができる。
【００３１】また、上述実施例においては、フレキシブ
ル基板１が移動されると共にテープ１６も移動されて順
次新たな部分が使用されるが、テープ１６に凹みの復元
性が充分あるときは、テープ１６の同一部分を複数回使
用することができる。
【００３２】
【発明の効果】この発明によれば、電子部品が押圧アー
ムで加熱押圧されるとき、シート上部材が圧縮変形して
接着剤内で発生する気泡を外部に押し出すので、接着剤
内に気泡が残留するのを効果的に防止でき、接続の信頼
性を上げることができる。また、接着剤の量を多くした
り、ゆっくりと時間を掛けて加熱押圧して気泡を押し出
すものと比較して、接着剤を無駄にすることがなく、製
造の効率を上げることができる。
【図面の簡単な説明】
【図１】実施例の構成を示す図である。
【図２】気泡の押し出し動作を説明するための図である
。
【図３】ワイヤ・ボンディングの説明のための図である
。
【図４】フリップチップ・ボンディングの説明のための
図である。
【図５】気泡の残留状態を示す図である。
【符号の説明】
１　　フレキシブル基板 ２　　配線パターン ３　　ＩＣチップ ３ａ　　電極 ６　　バンプ ７接着剤 ８　　気泡 １１Ｓ，１１Ｔ，１５Ｓ，１５Ｔ　　リール１３　　シ
ステムコントローラ １４　　基台 １６　　テープ １８　　ＩＣチップ供給アーム ２０　　接着剤ノズル ２２　　押圧アーム

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】　　フレキシブル基板を供給する基板供給
    手段と、上記フレキシブル基板上に熱硬化性接着剤を載
    せる接着剤ノズルと、上記接着剤が載せられたフレキシ
    ブル基板上にチップ状の電子部品を載置する電子部品供
    給アームと、上記フレキシブル基板の上記電子部品が載
    置される面と反対の面側にシート状部材を供給するシー
    ト供給手段と、上記フレキシブル基板上に載置された電
    子部品を押圧および加熱する押圧アームとを備えてなる
    フリップチップボンダー。
JP3120847A 1991-05-27 1991-05-27 フリップチップボンダー Pending JPH04348540A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP3120847A JPH04348540A (ja) 1991-05-27 1991-05-27 フリップチップボンダー
DE69207815T DE69207815T2 (de) 1991-05-27 1992-05-26 Bond-Maschine für Halbleiter-Chips
EP92108857A EP0517071B1 (en) 1991-05-27 1992-05-26 Chip device bonding machine
US07/887,844 US5232532A (en) 1991-05-27 1992-05-26 Chip device bonding machine
KR1019920008963A KR920022433A (ko) 1991-05-27 1992-05-27 칩장치본더와 그 접속고정방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3120847A JPH04348540A (ja) 1991-05-27 1991-05-27 フリップチップボンダー

Publications (1)

Publication Number Publication Date
JPH04348540A true JPH04348540A (ja) 1992-12-03

Family

ID=14796428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3120847A Pending JPH04348540A (ja) 1991-05-27 1991-05-27 フリップチップボンダー

Country Status (5)

Country Link
US (1) US5232532A (ja)
EP (1) EP0517071B1 (ja)
JP (1) JPH04348540A (ja)
KR (1) KR920022433A (ja)
DE (1) DE69207815T2 (ja)

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Also Published As

Publication number Publication date
DE69207815T2 (de) 1996-09-05
KR920022433A (ko) 1992-12-19
EP0517071B1 (en) 1996-01-24
DE69207815D1 (de) 1996-03-07
EP0517071A1 (en) 1992-12-09
US5232532A (en) 1993-08-03

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