4443 71 五、發明說明（1) 【發明領域】 本發明係關於一種晶片及導線架黏貼裝置及方法，其特 別有關於在晶片及導線架黏貼時，將導線架上已預先黏貼 的黏膠帶利用氣流噴射，使該黏膠帶能完全黏貼於晶片正 面上之黏貼裝置及方法β 【先前技術】 在半導體元件中利用導線架〔i ead f rame〕進行封裝的 封裝體，如SOP、QFP…等，該導線架封裝技術由於受到半 導趙元件的功能〔function〕增加需求而增加導線架的接 腳〔f i nger〕數量，又由於半導體元件的製程技術提升， 如最小線寬的減小，而使得該半導體元件的聚集度增加， 及為了符合半導元件的體積減小需求，因而必須將導線架 的内接腳〔inner finger〕間距及接腳寬相對減小。半導 體元件的導線架100，如第一圖所示，其接腳11〇兩端設 外接腳111及内接腳112 =該導線架100具有平整度 # 〔copl anari ty〕不佳及其必須設計成内接腳11 2祇有極小 接腳寬等缺點。該導線架1〇〇上形成晶片區120及黏膠區 1 3 0，該晶片區1 2 0位於接腳11 〇上而黏膠區1 3 0則位於内接 腳1 1 2上’該晶片區1 20供晶片承載且以黏膠帶黏貼於黏膠 區 1 3 0 〇 習用晶片及導線架黏貼裝置2〇〇，如第二圖所示，該裝 置200主要包含平臺210及壓板2 20。該承載平臺210及壓板 220之間放置導線架1〇〇及晶片a施壓，並以高溫將導線架 1 00及晶片A之間的黏膠帶B熱融，使得該晶片A可黏貼於導4443 71 V. Description of the Invention (1) [Field of the Invention] The present invention relates to a device and method for attaching a chip and a lead frame, and particularly relates to the use of a pre-adhesive tape on the lead frame when the chip and the lead frame are adhered. Air-jetting, the sticking device and method for making the sticky tape completely adhere to the front side of the chip β [Previous technology] Packages, such as SOP, QFP, etc., which are packaged in a semiconductor device using a lead frame [i ead frame], This lead frame packaging technology is subject to increased demand for the function of the semiconductor device and increases the number of pins of the lead frame. It is also due to the improvement of the process technology of the semiconductor device, such as the reduction of the minimum line width, which makes the The semiconductor device has an increased degree of aggregation, and in order to meet the volume reduction requirements of the semiconductor device, the inner finger pitch and lead width of the lead frame must be relatively reduced. As shown in the first figure, the lead frame 100 of the semiconductor device has external pins 111 and internal pins 112 at both ends of the lead frame 100. The lead frame 100 has flatness # [copl anari ty] is not good and must be designed Into the inner pin 11 2 only has the disadvantages of extremely small pin width. A chip region 120 and an adhesive region 130 are formed on the lead frame 100. The chip region 120 is disposed on the pin 11 and the adhesive region 130 is disposed on the inner pin 1 12. The area 1 20 is used for wafer loading and is adhered to the adhesive area 1 300 with a conventional adhesive tape and a lead frame sticking device 200. As shown in the second figure, the device 200 mainly includes a platform 210 and a pressure plate 2 20. A lead frame 100 and a wafer a are placed between the loading platform 210 and the pressing plate 220 to apply pressure, and the adhesive tape B between the lead frame 100 and the wafer A is melted at a high temperature, so that the wafer A can be adhered to the guide plate 100.
C:\Program Files\Patent\PK7082.ptd 第4頁 4443 71 五、發明說明（2) 線架1 0 0上。然而’由於該導線架丨〇 〇的平整度僅能控制在， 一定範圍内’此將導致接腳11 〇的翹曲及其内接腳〗丨2的間… 距不一致。當使用於内接腳112上黏膠帶B的厚度非常薄且 柔軟，這將使得該晶片A黏貼於導線架1〇〇上時，已黏貼在 導線架100落在内接腳112之間黏膠帶B發生皺摺，因而該 落在内接腳1 1 2之間黏膠帶b將未黏貼於該晶片A，進而當 该内接腳112黏貼於晶片A置於平臺210以壓板220進行熱壓 黏合時’該内接腳11 2之間的皺摺黏膠帶B容易發生黏附在 壓板22 0上’若進行下一個導線架1〇〇進行熱壓黏合時，由 於每次進行熱麼黏合的導線架1〇〇位置不一定，因此先前 在壓板220上的殘留黏膠帶總會覆蓋在導線架之内接腳 11 2 ’使得該被污染的現象將直接影響導線架丨〇 〇上打線 〔wire bonding〕之失誤率。在導線架1〇〇及晶片a施壓 時’將黏勝帶β完全平貼於晶片A上可消除在導線架丨〇 〇之 内接腳11 2之間黏膠帶B的皺摺及該皺摺黏膠帶b污染壓_ 2 2 0的問題》 有鑑於此’本發明改良以上缺點，在晶片及導線架黏貼 時’利用氣流對黏膠帶噴射，由壓板之排氣口喷出之氣體 使黏膠帶完全平貼於晶片正面上，如此將可有效改善生產 良率及&升產品之可賴性〔reliability〕，並可解決因 黏膠帶之皺摺過大所造成的打線失誤的問題。 【發明概要】 、本發明主要目的係提供一種晶片及導線架黏貼裝置及方 法’其利用氣流對黏膠帶喷射，由壓板之排氣口喷出之氣C: \ Program Files \ Patent \ PK7082.ptd Page 4 4443 71 V. Description of the invention (2) The wire frame is on 100. However, ‘because the flatness of the lead frame 丨 〇 〇 can only be controlled within a certain range’, this will cause the warpage of the pins 11 〇 and the distance between their inner pins… 2 to be inconsistent. When the thickness of the adhesive tape B used on the inner pins 112 is very thin and soft, which will cause the chip A to be adhered to the lead frame 100, the adhesive tape that has been pasted on the lead frame 100 and falls between the inner pins 112 B is wrinkled, so the adhesive tape b between the inner pins 1 1 2 is not adhered to the wafer A, and then when the inner pin 112 is adhered to the wafer A, it is placed on the platform 210 and the pressing plate 220 is used for hot pressing and bonding. When 'the creased adhesive tape B between the inner pins 11 2 is easy to adhere to the pressure plate 22 0', if the next lead frame 100 is subjected to thermocompression bonding, the lead frame is bonded each time because of thermal bonding. The position of 100 is not necessarily, so the residual adhesive tape on the pressure plate 220 will always cover the inner pins 11 2 'of the lead frame, so that the contaminated phenomenon will directly affect the wire bonding. Wire bonding Error rate. When the lead frame 100 and the wafer a are under pressure, 'sticking the adhesive tape β completely to the wafer A can eliminate the wrinkles and the wrinkles of the adhesive tape B between the pins 11 2 within the lead frame In view of this, the present invention improves the above disadvantages. When the wafer and the lead frame are pasted, the adhesive tape is sprayed with airflow, and the gas emitted from the exhaust port of the pressure plate makes the adhesive sticky. The tape is completely flat on the front side of the chip. This will effectively improve the production yield and reliability of the product, and can solve the problem of wiring errors caused by excessive wrinkling of the adhesive tape. [Summary of the Invention] The main object of the present invention is to provide a wafer and lead frame sticking device and method, which uses a gas flow to spray adhesive tape, and the gas sprayed from the exhaust port of the pressure plate.
4443 71 五、發明說明C3) ' ----- 體使黏膠帶完全平貼於晶片正面上，而改善製程内導線架 受黏勝帶污染的問題’使本發明具有提升導線架的打線 靠度之功效。 根據本發明之晶片及導線架黏貼裝置，該裝置主要包含 —壓板，該壓板包含一入氣口、數個排氣口及一平面。該 入氣口及數個排氣口以數個通道連通供氣體由入氣口進^ 再由排氣口排出，而該數個排氣口則位於該平面上β 根據本發明之晶片及導線架黏貼方法，該方法主要包含 步驟：將一黏膠帶黏貼於導線架的黏膠區；將一晶片置於 該導線架下方：該壓板熱壓合該導線架及晶片，使該黏膠 帶熱融黏接於該導線架及晶片之間，因而在壓合同時利用 一壓板氣體噴出氣流，將導線架之内接腳之間之黏膠帶可 完全平貼至晶片表面以改善晶片上片之品質。 【發明說明】 / ν 本發明之晶片及導線架黏貼裝置及方法主要係在導線f : 及晶片熱壓合時，利用氣流對黏膠帶喷射，使該導線架之 間的黏膠帶完全平貼於晶片上，進而改善製程内殘留黏膠 帶污染的問題’使本發明提升導線架的打線可靠度。 本發明之晶片及導線架黏貼裝置包含一壓板，該壓板主 要包含一入氣口、數個排氣口、數個通道及一平面。該入 氣口及數個排氣口以數個通道連通，而該數個排氣口則位 於該平面上。當該壓板之平面對準著待黏合晶片及導線架 時，該裝置送入氣體由該入氣口進入經該通道及排氣口喷 射至上晶片製程之導線架上。4443 71 V. Description of the invention C3) '----- The body makes the adhesive tape completely flat on the front side of the chip, and improves the problem that the lead frame is contaminated by the adhesive tape during the process. Degree of efficacy. According to the wafer and lead frame sticking device of the present invention, the device mainly includes a pressure plate, which includes an air inlet, a plurality of air outlets, and a flat surface. The air inlet and the several air outlets are connected through several channels for gas to enter from the air inlet and then be discharged from the air outlet, and the air outlets are located on the plane. The chip and the lead frame according to the present invention are pasted. Method, the method mainly includes the steps of: pasting an adhesive tape to an adhesive area of a lead frame; placing a chip under the lead frame: the pressing plate heat-presses the lead frame and the chip to make the adhesive tape melt-bond Between the lead frame and the wafer, a pressure plate gas is used to blast the airflow when pressing the contract, and the adhesive tape between the inner pins of the lead frame can be completely flattened to the surface of the wafer to improve the quality of the wafer on the wafer. [Explanation of the invention] / ν The wafer and lead frame sticking device and method of the present invention are mainly used when the wire f: and the wafer are heat-bonded, and the adhesive tape is sprayed with airflow to make the adhesive tape between the lead frames completely flat. On the chip, the problem of contamination of the remaining adhesive tape in the process is further improved, so that the present invention improves the reliability of wire bonding of the lead frame. The wafer and lead frame sticking device of the present invention includes a pressure plate, which mainly includes an air inlet, a plurality of exhaust ports, a plurality of channels, and a plane. The air inlet and the plurality of air outlets communicate with each other through a plurality of channels, and the plurality of air outlets are located on the plane. When the plane of the pressure plate is aligned with the wafer to be bonded and the lead frame, the gas sent by the device enters the lead frame from the air inlet and is sprayed onto the lead frame of the upper wafer process through the channel and the exhaust port.
C:\Program Files\Patent\PK7082.ptd 第6頁 4 443 7 1 五、發明說明（4) v請參照第一、三及四圖所示，本發明之晶片及導線架黏 貼裝置300主要包含平臺31〇及壓板32〇。本發明較佳實施 例之壓板320主要包含一入氣口 321、數個排氣口 322、數 個通道及一平面324。該入氣口 321及數個排氣口 322以數 個通道323連通供氣體由入氣口 321進入再由排氣口322排 出’而該數個排氣口 322則位於該平面324上，該數個排氣 口 322在該平面324上形成一陣列，該排氣口 322之間具有 一適當間距。將該導線架10〇置於該裝置3〇〇之平臺31〇， 當該裝置300之壓板3 2〇適當下降至平臺31〇時，該排氣口 322之陣列可對應於導線架100之黏膠區130。 本發明之晶片及導線架黏貼方法係主要將—黏勝帶黏貼 於導線架的點膠區。將一晶片置於該導線架下以進行上晶 片製程〔die at tachment process〕。晶片及導線架黏貼 裝置之壓板下降’該壓板熱壓合該導線架及晶片，使該 膠帶熱融黏接於該導線架及晶片之間，在進行壓板熱壓& 時並對該導線架之黏膠帶喷射氣流，使該導線架之内接腳 之間的皺摺黏膠帶完全平貼於晶片上，使得皺摺黏膠帶不 會=貼污染到壓板而使得壓板再污染下一個導線架。 清再參照第一圊所示’導線架丨〇 〇之内接腳i i 2之間的黏 膠帶B黏貼後，該内接腳112產生翹曲移位而使該内接腳 11 2之間的點膠帶b發生皴摺β因此，本發明利用上述的晶 片及導線架黏貼裝置及方法克服該導線架1〇〇之内接腳112 之間的黏膠帶Β發生鷇摺的問題。 清再參照第一及三圈所示’當該裝置3〇〇對導線架1〇〇開C: \ Program Files \ Patent \ PK7082.ptd Page 6 4 443 7 1 V. Description of the invention (4) v Please refer to the first, third and fourth figures. The chip and lead frame bonding device 300 of the present invention mainly includes Platform 31 ° and platen 32 °. The pressure plate 320 of the preferred embodiment of the present invention mainly includes an air inlet 321, a plurality of exhaust ports 322, a plurality of channels, and a flat surface 324. The air inlet 321 and the plurality of exhaust ports 322 communicate through a plurality of channels 323 for gas to enter from the air inlet 321 and then be discharged from the exhaust port 322 ', and the plurality of exhaust ports 322 are located on the plane 324. The exhaust ports 322 form an array on the plane 324, and the exhaust ports 322 have a proper distance therebetween. The lead frame 100 is placed on the platform 31 of the device 300. When the pressure plate 3 200 of the device 300 is appropriately lowered to the platform 31, the array of the exhaust ports 322 may correspond to the adhesion of the lead frame 100.胶 区 130。 The rubber area 130. The method for attaching the wafer and the lead frame of the present invention is mainly to attach an adhesive tape to the dispensing area of the lead frame. A wafer is placed under the lead frame to perform a die at tachment process. The pressure plate of the chip and lead frame sticking device is lowered. 'The pressure plate is thermally bonded to the lead frame and the chip, so that the tape is hot-melted and adhered between the lead frame and the chip. The adhesive tape sprays airflow, so that the creased adhesive tape between the inner pins of the lead frame is completely flat on the wafer, so that the creased adhesive tape will not be contaminated to the pressure plate and the pressure plate will contaminate the next lead frame. After referring to the adhesive tape B between the pins ii 2 within the lead frame shown in the first figure, the inner pins 112 are warped and shifted to make the distance between the inner pins 11 2 The tape β is folded β. Therefore, the present invention overcomes the problem that the adhesive tape B between the pins 112 in the lead frame 100 is folded by using the above-mentioned wafer and lead frame bonding device and method. Qing again refer to the first and third circles as shown when the device has 300 pairs of lead frames 100
4443 71 五、發明說明（5) 始進行上晶片製程時’該裝置30 0之平臺310及壓板32〇被 加熱成高溫的狀態，將壓板320下降至平臺31〇但未壓合於 導線架100 ’此時，該排氣口 322之陣列可對應於導線架 100之黏膠區130。當該歷板320熱壓合該導線架及晶片 A時’該裝置300將氣體送入壓板32〇之入氣口321，該氣體 經通道323及排氣口 322對導線架1〇〇之黏膠區丨3〇嗔射，'使 得該導線架1 〇 0之内接腳間的黏膠帶B平貼於晶片A。此 時’該黏膠帶B熱融黏接於該導線架1 0 〇及晶片A之間由 於該導線架1 0 0之内接腳間的黏膠帶B完全平貼於晶片A， 因而增強該導線架1 0 0及晶片A的結合。 請再參照第二及三圓所示，習用之裝置2〇〇以單純熱壓 合進行上晶片製程’因而其無法克服内接腳被殘留黏膠帶 污染所造成的打線失誤。反觀，本發明之裝置3 〇 〇以氣流 對導線架1 0 0内接腳之間的黏膠帶B喷射，使該導線架1 〇 之内接腳間的黏膠帶B完全平貼於晶片a，因而本發明並g 需要其他額外的製程或裝置清除殘留黏膠帶污染，本發明 祇需在進行上晶片製程内一併完成黏膠帶完全平貼於曰 的步驟。 ；日曰月 雖然本發明已以前述較佳實施例揭示，然其並非用以 定本發明’任何熟習此技藝者’在不脫離本發明之精 範圍内’當可作各種之更動與修改，因此本發明之保 圍當視後附之申請專利範圍所界定者為準β4443 71 V. Description of the invention (5) When the wafer-up process is started, the platform 310 and the platen 32 of the device 300 are heated to a high temperature state, and the platen 320 is lowered to the platen 31 but not laminated to the lead frame 100. 'At this time, the array of the exhaust ports 322 may correspond to the adhesive region 130 of the lead frame 100. When the calendar plate 320 is thermocompression bonded to the lead frame and the wafer A, the device 300 sends gas to the air inlet 321 of the pressure plate 32, and the gas passes through the passage 323 and the exhaust port 322 to the lead frame 100. Zone 301 is shot, so that the adhesive tape B between the pins within the lead frame 100 is flatly attached to the chip A. At this time, 'the adhesive tape B is hot-melt adhered between the lead frame 100 and the chip A. Since the adhesive tape B between the pins of the lead frame 100 is completely flat against the chip A, the wire is strengthened. The combination of rack 100 and wafer A. Please refer to the second and third circles as shown. The conventional device 2000 uses a simple hot-pressing process for the wafer-on-chip process. Therefore, it cannot overcome the wiring errors caused by the contamination of the internal pins by the residual adhesive tape. In contrast, the device 300 of the present invention sprays the adhesive tape B between the pins of the lead frame 100 with air current, so that the adhesive tape B between the pins of the lead frame 100 is completely flat against the wafer a. Therefore, the present invention requires other additional processes or devices to remove the residual adhesive tape contamination. The present invention only needs to complete the step of completely sticking the adhesive tape to the wafer during the wafer fabrication process. ; Day, month, and month Although the present invention has been disclosed in the aforementioned preferred embodiment, it is not intended to define the present invention as "any person skilled in the art" can make various changes and modifications without departing from the true scope of the present invention. The protection scope of the present invention shall be determined by the scope of the appended patent application.
4443 71 圖式簡單說明 【圖式說明】 為了讓本發明之上述和其他目的 '特徵、和優點能更明 確被了解，下文將特舉本發明較佳實施例’並配合所附圖 式，作詳細說明如下。 第1圖：習用導線架之上視圖； 第2圖：習用晶片及導線架黏貼裝置使用狀態之侧視 圖； 第3圖：本發明晶片及導線架黏貼裝置使用狀態之側視 圖：及 第4圖：本發明第3圖沿4-4線之剖面圖。 【圖號說明】 1 0 0 導線架 1 1 0 接腳 11 1 外接腳 4 112 内接腳 1 2 0 晶片區 1 3 0 黏膠區 2 0 0 晶片及導線架黏貼裝置 210 平臺 220 壓板 3 0 0 晶片及導線架黏貼裝置 310 平臺 320 壓板 32 1 入氣口 322 排氣口 32 3 通道 3 2 4 平面 C:\Program Files\Patent\PK7〇82.ptd 第 9 頁4443 71 Brief description of the drawings [Illustration of the drawings] In order to make the features and advantages of the above and other objects of the present invention more clearly understood, the following describes the preferred embodiments of the present invention in conjunction with the drawings. The details are as follows. Figure 1: Top view of a conventional lead frame; Figure 2: Side view of a conventional chip and lead frame sticking device in use; Figure 3: Side view of a chip and lead frame sticking device in use according to the present invention: and Figure 4 : Sectional view taken along line 4-4 of Figure 3 of the present invention. [Illustration of drawing number] 1 0 0 lead frame 1 1 0 pin 11 1 external pin 4 112 inner pin 1 2 0 chip area 1 3 0 adhesive area 2 0 0 chip and lead frame attachment device 210 platform 220 pressure plate 3 0 0 Chip and lead frame attachment device 310 Platform 320 Pressure plate 32 1 Air inlet 322 Air outlet 32 3 Channel 3 2 4 Flat C: \ Program Files \ Patent \ PK7〇82.ptd Page 9